Epoxy group-containing organosilicon modified poly(phenylene oxide) resin as well as a preparation method and application thereof

A technology of polyphenylene ether resin and epoxy resin, which is applied in circuit substrate materials, electrical components, printed circuits, etc., can solve the problems of deterioration of dielectric properties, complicated preparation methods, influence on the dielectric properties of polyphenylene ether and glass transition temperature and other problems, to achieve the effect of improving processability, good adhesion and low surface energy

Active Publication Date: 2019-07-09
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0015] The preparation of this modified polyphenylene ether is to redistribute polyphenylene ether, and then react the redistributed product with epoxy silicone oil to obtain the final product. The preparation method is relatively complicated, and the modification principle is to redistribute polyphenylene ether The phenolic hydroxyl group in the ether reacts with th

Method used

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  • Epoxy group-containing organosilicon modified poly(phenylene oxide) resin as well as a preparation method and application thereof
  • Epoxy group-containing organosilicon modified poly(phenylene oxide) resin as well as a preparation method and application thereof
  • Epoxy group-containing organosilicon modified poly(phenylene oxide) resin as well as a preparation method and application thereof

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[0080] Example

[0081] (1) Synthesis of modified polyphenylene ether resin

[0082] Weigh 425g of RPE-HL, add toluene and heat to 80℃ and stir to dissolve. After the dissolution is complete, add 98.6g of KBM-303, stir evenly, then add 0.5g of dibutyltin dilaurate, set the heating temperature to 110~115℃, start Slowly add deionized water dropwise for reflux reaction, and control the speed of the dropwise addition of distilled water according to the reaction temperature to control the reaction temperature between 90-100°C. After 8 hours of reaction, remove water and methanol under reduced pressure at 80-100°C. Then, toluene was added to prepare a resin solution with a solid content of about 50%, and its epoxy equivalent was tested to be 418 g / eq.

[0083] By repeating the above operations and changing the ratio of various reactants, different epoxy-containing silicone modified polyphenylene ether resins can be obtained, as shown in Table 1.

[0084] Table 1

[0085]

[0086]

[0087] T...

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Abstract

The invention relates to epoxy group-containing organosilicon modified poly(phenylene oxide) resin as well as a preparation method and application thereof. According to the preparation method, organosilane containing an alkoxy leaving group and an epoxy group is used for modifying double hydroxyl-terminated poly(phenylene oxide) resin, and an epoxy functional group and a silica structural unit areintroduced, and therefore, a defect that poly(phenylene oxide) resin has high curing temperature, poor compatibility with epoxy resin, poor binding force with inorganic materials or metals, poor wettability and solvent resistance, and the like is solved; the modified resin combines the advantages of poly(phenylene oxide) and organosilicon, so that the resin composition and a copper-clad plate prepared from the resin composition have excellent dielectric properties, heat resistance and dimensional stability, and also have good performance in the aspects of adhesion with inorganic materials ormetals, flame retardancy, toughness and the like.

Description

technical field [0001] The invention belongs to the field of organosilicon modified resins, in particular to an epoxy group-containing organosilicon-modified polyphenylene ether resin and its preparation method and application. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity and high frequency of information, the heat resistance, water absorption, chemical resistance, mechanical properties, Dimensional stability, dielectric properties and other comprehensive properties put forward higher requirements. [0003] The molecular structure of polyphenylene ether resin contains a large number of benzene ring structures, and there is no strong polar group, which endows polyphenylene ether resin with excellent properties, such as high glass transition temperature, good dimensional stability, small linear expansion coefficient, water a...

Claims

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Application Information

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IPC IPC(8): C08G65/48C08L71/12H05K1/03
CPCC08G65/485C08L71/126C08L2201/02C08L2201/08C08L2203/20H05K1/036
Inventor 林伟范华勇介星迪黄天辉
Owner GUANGDONG SHENGYI SCI TECH
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