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Pre-encapsulation LED (light emitting diode) module dust blowing method and device

A technology of LED modules and dust removal devices, applied in the direction of cleaning methods, cleaning methods and utensils, chemical instruments and methods using gas flow, etc., can solve the problems that cannot meet the requirements of product quality and production process environment, and achieve a significant dust removal effect , high reliability, and the effect of improving yield

Inactive Publication Date: 2014-06-18
CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The blown dust is suspended in the air, and these suspended dust will become a secondary pollution source, which cannot meet the requirements of product quality and production process environment

Method used

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  • Pre-encapsulation LED (light emitting diode) module dust blowing method and device
  • Pre-encapsulation LED (light emitting diode) module dust blowing method and device

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Embodiment Construction

[0017] The invention will be further described in detail below in conjunction with the accompanying drawings, but not as any limitation to the invention.

[0018] A method of blowing dust before LED module potting, such as figure 1 - As shown in Figure 4, the method is to place the filled batch of LED modules with their mouths up on the transparent glass workbench to ensure that the glue will not flow out; set a reflector under the transparent glass workbench to reflect light Use a mirror to observe the filling quality of the bottom surface of the LED module. By adjusting the angle of the reflector to achieve the best visual effect.

[0019] A device constructed according to the aforementioned method, such as figure 1 - As shown in FIG. 4 , it includes a frame 1 , a transparent glass inspection platform 2 is arranged on the frame 1 , and a mirror 3 is arranged on the frame 1 below the transparent glass inspection platform 2 . The shape and size of the reflective mir...

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Abstract

The invention discloses a pre-encapsulation LED module dust blowing method and device. The pre-encapsulation LED module dust blowing method comprises putting a product to be dedusted on a stainless steel net plate of a dedusting device and utilizing a blower gun to blow dust on the surface of the product away form the surface of the product, so that sundries of relatively large particles fall into a dust collecting box under the action of gravity, tiny dust is exhausted outdoors along with wind and second dust pollution caused by return of dust to a production environment can be avoided. According to the pre-encapsulation LED module dust blowing method and device, the professional dust blowing device is manufactured through principles of combination of positive pressure airflow and negative pressure airflow, absolute separation of the dust blown away from the product from the product is achieved, and the technical problem that floating dust leads to secondary product pollution can be solved. Circular production of the floating dust can be eliminated, accordingly, product quality and the rate of finished products of the whole production line can be improved, a workload of a floating dust detection working procedure is reduced, and subsequent machining of the product and raw material costs can be reduced. Through practical application, the dedusting effect is significant, the technology is mature, and the reliability is high and certain popularization and application values can be obtained.

Description

technical field [0001] The invention relates to a dust blowing method and device before potting of an LED module and belongs to the technical field of LED module production. Background technique [0002] LED module is a character and pixel display module with LED chips as the light-emitting unit. It has the characteristics of small size, light weight, and fast response speed. It is widely used in household appliances, multi-functional display screens, instruments, automation equipment and industrial control. field. With the continuous diversification of electronic products, the usage of LED modules is also rising. During the production process of the LED module, the PIN needle and the PCB board are first combined to form a dot matrix component, and then the dot matrix component is potted in the shell with transparent glue or resin, and then cured. If there is dust in the LED module before the potting process, it will directly affect the luminous efficiency of the LED modul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/02
CPCB08B5/02
Inventor 王强邓林
Owner CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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