Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid

A technology of resin glue and copper-clad laminate, which is applied in the field of preparation of high-temperature-resistant and high-frequency copper-clad laminate resin glue, which can solve the problems of broken lines in holes, low pass rate, and easy falling off.

Inactive Publication Date: 2014-06-18
TONGLING HAORONG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-frequency copper-clad laminates currently on sale at home and abroad are mainly based on polytetrafluoroethylene resin matrix, but the PTFE resin matrix has a big defect, that is, the metallization process in the hole is complicated when the circuit board is made, and the pass rate is low. The fatal defect is The metal copper has poor adhesion to the hole wall and is easy to fall off, which leads to disconnection of the line in the hole

Method used

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  • Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid

Examples

Experimental program
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Effect test

Embodiment 1

[0018] The method for preparing high-temperature-resistant and high-frequency copper-clad laminate resin glue, the components include: toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, diisoperoxide Propylbenzene, decabromodiphenylethane and diphenyl phosphate, the ratio of each component by weight is:

[0019] 315:1.30:85.0:2.21:17.25:50.00:15.40:8.50;

[0020] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 85-92°C, keep it warm for 1.5 hours; then add dicumyl peroxide and Triallyl cyanate, keep the temperature at 85-92 ° C, continue to react for 2 hours; immediately cool the resin temperature to below 60 ° C after the completion of the reaction time; finally add the composite flame retardant decabromodiphenylethane and di Phenyl phosphate, stir well;

[0021] After the resin is made, keep the resin temperature at 60°C, impregnate...

Embodiment 2

[0029] The method for preparing high-temperature-resistant and high-frequency copper-clad laminate resin glue, the components include: toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, diisoperoxide Propylbenzene, decabromodiphenylethane and diphenyl phosphate, the ratio of each component by weight is:

[0030] 312:1.41:90:2.3:17.35:50.65:15.53:8.85;

[0031] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 85-92°C, keep it warm for 1.5 hours; then add dicumyl peroxide and Triallyl cyanate, keep the temperature at 85-92 ° C, continue to react for 2 hours; immediately cool the resin temperature to below 60 ° C after the completion of the reaction time; finally add the composite flame retardant decabromodiphenylethane and di Phenyl phosphate, stir well;

[0032] After the resin is made, keep the resin temperature at 60°C, impregnate th...

Embodiment 3

[0040] The method for preparing high-temperature-resistant and high-frequency copper-clad laminate resin glue is characterized in that the components include: toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, peroxide Dicumyl oxide, decabromodiphenylethane and diphenyl phosphate, the ratio of each component by weight is:

[0041] 330:1.52:115.0:2.28:17.4:50.6:16.20:8.95;

[0042] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 85-92°C, keep it warm for 1.5 hours; then add dicumyl peroxide and Triallyl cyanate, keep the temperature at 85-92 ° C, continue to react for 2 hours; immediately cool the resin temperature to below 60 ° C after the completion of the reaction time; finally add the composite flame retardant decabromodiphenylethane and di Phenyl phosphate, stir well;

[0043] After the resin is made, keep the resin temperature a...

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Abstract

The invention discloses a method for preparing a high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid. The components comprise methylbenzene, allyl bisphenol A, polyphenyl ether, benzoyl peroxide, triallyl cyanate ester, dicumyl peroxide, decabromodiphenylethane and diphenyl phosphate, wherein the weight ratio of the components is (315-330): (1.30-1.60): (85.0-110.0): (2.21-2.38): (17.25-17.55): (50.00-50.80): (15.40-16.80): (8.50-9.60). The copper-clad plate resin adhesive liquid has low dielectric constant and high heat resistance.

Description

technical field [0001] The invention relates to a method for preparing resin glue for high-temperature-resistant and high-frequency copper-clad laminates. Background technique [0002] Dielectric constant 3.4 High frequency microwave copper clad laminate is the basic material and one of the necessary materials for high information transmission and communication. It is made of glass cloth prepreg impregnated with low dielectric constant resin polyphenylene ether and copper foil through high pressure and high temperature composite. High-performance, high-tech composite materials. [0003] Resin systems that can be used in the high-frequency communication field include polytetrafluoroethylene (PTFE), polyphenylene ether, and cyanate resin, but the existing products at home and abroad are mainly based on PTFE and polyphenylene ether resin systems. The high-frequency copper-clad laminates currently on sale at home and abroad are mainly based on polytetrafluoroethylene resin matr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08K5/03C08K5/523C08F283/08
Inventor 曹慧妍
Owner TONGLING HAORONG ELECTRONICS TECH
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