High-precision full-automatic BGA repair workbench

Abstract

The invention provides a high-precision full-automatic BGA repair workbench. The high-precision full-automatic BGA repair workbench comprises a handpiece portion mechanism, an X-axis motor, an X-axis sliding rail, a Y-axis sliding rail, a Y-axis motor, a picking-up mechanism, a PCB supporting device, a cooling device, a feeding mechanism, a preheating box, an X shaft, a Y shaft, a datum base plate, a preheating device, a lower hot-air mechanism, a lower CCD vision mechanism, an upper machine body cover and a lower machine body cover. The handpiece portion mechanism is arranged on the X-axis sliding rail and comprises a handpiece fixing base, a surface mounting mechanism, an upper heating mechanism, an upper CCD vision mechanism, a headpiece cover, a heating motor, a surface mounting motor, a heating motor fixing base, a surface mounting motor fixing base, a coupler, a lead screw fixing base, a lead screw and a Z-axis sliding rail. According to the high-precision full-automatic BGA repair workbench, a vision automatic alignment system is adopted, image capturing and locating are conducted on a PCB and a BGA through a CCD, accurate alignment and surface mounting are achieved through analysis and deviation rectification by image processing software, and the surface mounting precision can reach + / -0.025 mm; in this way, the consistency of work quality is guaranteed, and high-end precise electronic products are easily processed.

Description

technical field [0001] The invention relates to the technical field of BGA repair, in particular to a high-precision automatic BGA repair workbench. Background technique [0002] In the field of automatic assembly, production and repair of circuit boards, there are more and more high-end precision electronic products. When precision mounting, heating and cooling of components, the accuracy, uniformity and stability of temperature control are very important. In recent years, with the rapid development of electronic technology, the miniaturization, high density, high frequency and high efficiency of electronic product assembly have higher and higher requirements for the quality of installed rework, and the demand has become stronger and stronger, so that BGA rework has been rapidly develop. [0003] The existing traditional BGA rework station is divided into optical alignment and manual visual alignment. The optical alignment is imaged by a split prism through the optical mod...

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Problems solved by technology

[0003] The existing traditional BGA rework station is divided into optical alignment and manual visual alignment. The optical alignment is imaged by split prism through the optical module; the manual visual alignment is to align the BGA solder feet with the PCB silk screen line and points by naked eyes; At present, these two rework methods are far from the ideal rework for high-end precision electronic products, and have the following disadvantages: a. It can only be done manually; b. The accuracy of high-end precision electronic products cannot be guaranteed and it is prone to false welding, Missing soldering phenomenon; c. The repair efficiency is low and the success rate of the repair cannot be guaranteed; d. The degree of automation is low, and the error in the production work is large, resulting in low work quality

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