Statistical process control system and method for wafer acceptance test

Abstract

The invention discloses a statistical process control system and method for a wafer acceptance test. The statistical process control system for the wafer acceptance test comprises a wafer parameter testing device, a wafer test transmission device, an initial SPC data arrangement and judgment unit, a data storage and inquiry unit and a secondary SPC data arrangement and judgment unit; due to the fact that the secondary SPC data arrangement and judgment unit is independent of the SPC data arrangement and judgment unit, the secondary SPC data arrangement and judgment unit conducts secondary calculation and interpretation on data stored in the data storage and inquiry unit according to a monitoring rule and provides control commands for a manufacturing execution system. As a result, the statistical process control system and method for the wafer acceptance test have the advantages that the consistency of the sources of monitoring data is guaranteed, problems which possibly exist on a production line can be found in time, and corresponding measures can be taken, so that the problems are prevented from becoming serious and defects of products are prevented.

Description

technical field [0001] The present invention relates to the technical field of integrated circuit manufacturing, and more specifically, relates to a wafer-level electrical test (Wafer Acceptance Test, WAT for short) statistical process control (Statistical Process Control, SPC for short) system and method. Background technique [0002] At present, the design of semiconductor devices is rapidly developing in the direction of high density and high integration, which puts forward higher and higher requirements for new technology, new technology and new equipment of semiconductor integrated circuits. As one of the process equipment in the pre-process of integrated circuit production line, semiconductor heat treatment equipment plays an important role in the manufacturing process of silicon wafers such as diffusion, annealing, alloying, oxidation, and film growth. It requires precisely controlled temperature for the surface of silicon wafers. temperature. [0003] For example, s...

AI Technical Summary

Problems solved by technology

As shown in the figure, since the above-mentioned initial SPC data sorting and judging unit only analyzes the original data of the test, it can only report violations of single-point or multi-point out-of-bounds, that is, OOS (Out Of Spec) or OOC (Out Of Control) , but cannot handle the monitoring of the average and standard deviation of the wafer (Wafer) test results, such as the Western Electric rule of SPC monitoring (the Western Electric rule in the control chart, referred to as the WECO rule, which can determine whether the process is out of control and Whether there are unexpected changes (WECO rules) the monitoring of 2~8 cannot be realized

Images