High-speed infrared signal processing system

A technology of infrared signal and processing system, which is applied in the direction of closed-circuit television system, TV system components, image communication, etc., which can solve the problems such as difficulty in increasing system communication data bandwidth, large volume, complex structure of infrared imaging system, etc., and achieve real-time performance Good, high communication rate, simple structure effect

Inactive Publication Date: 2014-07-02
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0004] In the past, the infrared signal processing system often used external SRAM and a large number of bridge chips, and used the PCI bus for image transmission, resulting in the shortcomings of the infrared imaging system, such as complex structure, large volume, and difficulty in improving the system communication data bandwidth.

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Embodiment Construction

[0017] The specific implementation manners of the present invention will be further described in detail below according to the accompanying drawings.

[0018] figure 1 It is the system block diagram of the high-speed infrared signal processing system.

[0019] The hardware device used in the present invention is a signal processing board, which includes: a DSP, a FPGA, an optical fiber data transceiver module and peripheral configuration circuits.

[0020] Said FPGA is the XC5VLX50T-FF665 of the Virtex-5 series of Xilinx Company. This FPGA adopts a 65nm process, combined with low-power IP blocks, the dynamic power consumption is reduced by 35%, and there are 12 low-power transceivers. Can realize 100Mb~3.75Gb / s high-speed serial interface, have the distributed RAM of 480kb capacity and the block RAM of 2160kb capacity.

[0021] The DSP mentioned above is TMS320c6455 launched by TI, which is a high-performance fixed-point DSP developed based on the third-generation advanced u...

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Abstract

The invention discloses a high-speed infrared signal processing system which is mainly used for an infrared imaging tracking system. The high-speed infrared signal processing system is integrated with a signal processing board and mainly comprises a DSP chip, an FPGA chip, an optical fiber data transceiving module and a peripheral configuration circuit. An infrared image high-speed transmission platform based on an AURORA protocol is constructed on an FPGA, signals are input through an optical fiber interface, and images are output through an AURORA bus. A CAN communication processing platform based on a MicroBlaze soft core is constructed and communicates with other processing boards through a CAN bus. The two platforms communicate through a two-port RAM and communicate with a DSP through an EMIF interface. The high-speed infrared signal processing system has the advantages that the FPGA is used for achieving most interface functions, and the structure is concise; the AURORA protocol is adopted, high-speed image transmission can be achieved, and the real-time performance is good; a CAN communication protocol is adopted, distribution type control is supported, and the traffic rate is high.

Description

Technical field: [0001] The invention relates to a high-speed infrared signal processing system, in particular to an FPGA-based signal processing logic design. It is mainly used for infrared real-time signal processing in infrared imaging tracking system. Background technique: [0002] The infrared signal processing platform needs to complete two tasks: the first task is to process the image information sent by the infrared detector, detect the specific target from the complex background, and give the target signal at the same time; the second task is the infrared signal processing The platform can accept the control of other processing platforms, and transmit infrared images and detection and tracking results to the upper host, thus forming a complete system. [0003] FPGA and DSP each have their own characteristics. With the development of large-scale programmable devices, the signal processing system using DSP+FPGA structure has shown its superiority and is gradually bei...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N7/18H04N5/33
Inventor 岳振张涌刘士建吕波杨龙李冰
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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