A method of processing circuit board with laser direct forming technology

Abstract

The invention relates to a method for processing a circuit board by laser direct forming technology. Firstly, the conductive layer covered on the substrate material is thinned, and then the conductive layer is selectively and directly removed by laser after being processed by hole making and electroplating thickening process. Thus, a conductive pattern structure meeting design requirements is obtained. The steps are as follows: first, make a monitoring disk, that is, use a laser to photoetch and remove the conductive layer from the monitoring pattern area; then, use a micro-etching liquid to thin the material of the conductive layer until the micro-etching is thinned until it is at the monitoring disk pattern. When the substrate is exposed; finally, after drilling and metallizing the thinned substrate material and the conductive layer material, the conductive layer covered by the substrate material is removed by laser direct forming, leaving the required conductive layer. The invention solves the processing problem in the current technology that the conductive layer is too thick after hole formation and is not suitable for direct removal of the conductive layer by laser or mechanical methods, and at the same time broadens the application range of the laser photoetching method for processing PCBs.

Description

technical field [0001] The invention belongs to the field of circuit board manufacturing, in particular to a method for processing circuit boards by laser direct forming technology. Background technique [0002] The production of subtractive circuit boards includes a series of processing processes: drilling, metallization of holes, thickening of electroplated copper, production of conductive lines, production of solder resist characters, appearance processing, etc. Among them, one of the most important processes is the production of the circuit, that is, according to the design requirements, the metal conductive layer of the non-conductive pattern part is removed, and the remaining metal layer is used as the circuit. [0003] Removing unnecessary conductive layers is usually done by printing-etching method. First, the pattern is transferred on the surface of the copper clad laminate, and the conductive layer of the part of the conductive pattern that needs to be retained, us...

AI Technical Summary

Problems solved by technology

These tools have a small diameter or a sharp and thin head. The thicker the material to be processed, the narrower the channel to be processed, the more difficult the processing, and the shorter the life of the tool.

As mentioned above, the hole metallization technology necessary for making double-sided circuit boards and multi-layer boards increases the thickness of the conductive layer on the surface of the substrate material. In the process of making double-sided boards with hole metallization and outer layer conductive patterns of multi-layer boards, there are processing problems such as fast tool consumption and inability to make fine graphics.