Non-outer-pin packaging structure and manufacturing method and wire frame of non-outer-pin packaging structure

Abstract

The invention provides a non-outer-pin packaging structure and a manufacturing method and a wire frame of the non-outer-pin packaging structure. The non-outer-pin packaging structure comprises the wire frame, a chip, a plurality of electric connection elements and a plastic packaging body. The wire frame comprises a wire frame unit and a connecting support. The wire frame unit comprises a plurality of pins connected with the connecting support, and the thickness of the ends, away from the wire frame unit, of the pins is smaller than the thickness of the pins. The chip is electrically connected to the pins through the electric connection elements. The plastic packaging body packages the chip and the electric connection elements and encapsulates the pins. The ends, away from the center of the wire frame unit, of the pins can have first parts with the thickness smaller than that of the pins, one side of each first part is a cutting channel, the metal thickness at the cutting positions is reduced, the loss of a cutter can be reduced, the cutting efficiency can be improved, the contact area between the pins and plastic packaging materials is increased, and the packaging reliability of the chip can be improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a packaging structure without external leads, a manufacturing method thereof and a lead frame, and also relates to a structure of the lead frame. Background technique [0002] In the leadless packaging of integrated circuit chips, the bare chip is electrically connected to the packaging substrate through the pads on it, and then the bare chip is covered with the packaging material, and finally the packaging material and the packaging substrate are cut to form a chip packaging structure . The purpose of packaging is to prevent the impact of external water vapor, pollutants and external temperature on the bare chip, and at the same time improve the medium for the electrical connection between the bare chip and the external circuit. [0003] Figure 1A It is a schematic cross-sectional structure diagram of a leadless package structure assembly 100 before cuttin...

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Problems solved by technology

[0005] In view of this, the purpose of the present invention is to provide an improved leadless package structure and its manufacturing method and lead frame to solve the problem that the leadless package structure in the prior art causes the cutting tool to be easily worn out and easily caused during the cutting process. The problem that the plastic encapsulant is detached from the pin

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