Curable silicone resin composition and optical semiconductor device using same

A technology of silicone resin and composition, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the light output rate of LEDs, achieve the effect of improving mechanical hardness and maintaining the light output rate

Active Publication Date: 2016-07-13
BENQ MATERIALS +1
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the environment where LEDs are used, the sulfur in the air will gradually penetrate the encapsulant into the interior of the LED component, and react with the silver layer on the bracket, causing the silver layer to vulcanize to produce black silver sulfide, thus reducing the light output of the LED.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curable silicone resin composition and optical semiconductor device using same
  • Curable silicone resin composition and optical semiconductor device using same

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0064] Preparation Example 1: Preparation method of linear polysiloxane (A)_compound 1

[0065] 3499.92 grams (19.13 mole) of methylphenyl dimethoxysilane (phenylmethyldimethoxysilane, purchased from Hengqiao Industrial Co., Ltd., Taiwan), 288.48 grams (2.4 mole) of dimethyldimethoxysilane (Dimethyldimethoxysilane, Purchased from Hengqiao Industrial Co., Ltd., Taiwan), and 317.28 grams (2.4mole) of methylvinyldimethoxysilane (Methylvinyldimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan) was added to the reactor and placed in Stir evenly at room temperature to form a mixed solution. This mixed solution was dripped into 5337.4 grams of sulfuric acid aqueous solution with a mass concentration of 5% to obtain a reaction solution. Then, the reaction solution was heated to 75° C. to carry out the hydrolysis reaction. After the reaction was complete, it was extracted to the organic layer with deionized water. The pH is neutral; finally, the solvent is removed to obtai...

preparation Embodiment 2

[0067]Preparation Example 2: The preparation method of the first silicone resin (B1)_compound 2

[0068] 2776 grams (14 mole) of phenyl-trimethoxysilane (phenyl-trimethoxysilane, purchased from Liuhe Co., Ltd., Taiwan), 480.88 grams (4 mole) of dimethyldimethoxysilane (Dimethyldimethoxysilane, purchased from Hengqiao Industrial Co., Ltd., Taiwan), and 264.46 grams (2mole) of methylvinyldimethoxysilane (Methylvinyldimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan) is placed in the reactor, stirred evenly at room temperature to A mixed solution was prepared. The mixed solution is dropped into 4579 grams of mass concentration in 5% sulfuric acid aqueous solution to prepare a reaction solution, then the reaction solution is heated to 75°C for hydrolysis reaction, after the reaction is complete, extract with deionized water to make the organic layer The pH is neutral and the solvent is finally removed to obtain the hydrolyzate.

[0069] The above-mentioned hydrolyz...

preparation Embodiment 3

[0070] Preparation Example 3: The preparation method of the second silicone resin (B2)_compound 3

[0071] With 2379.4 grams (12 mole) of phenyl trimethoxysilane (Phenyltrimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan), and 1118.4 grams (6 mole) of divinyltetramethyldisiloxane (Divinyltetramethyldisiloxane, purchased from Liuhe Chemical Co., Ltd., Taiwan) was placed in a reactor and stirred uniformly at room temperature to obtain a mixed solution. This mixed solution was dropped into 4547.16 grams of sulfuric acid aqueous solution with a mass concentration of 5% to prepare a reaction solution. Then, the reaction solution was heated to 75° C. to carry out a hydrolysis reaction. After the reaction was complete, extract it with deionized water The pH of the organic layer was brought to neutral, and finally the solvent was removed to obtain a hydrolyzate.

[0072] The above hydrolyzate, 1998 grams of toluene and 10 grams of potassium hydroxide were placed in a re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to view more

Abstract

The invention provides a solidifiable silicon resin composition which contains the following components in parts by weight: 10-50 parts of linear polysiloxane (A), 10-40 parts of first silicon resin (B1), 10-40 parts of second silicon resin (B2), 15-25 parts of silicon-containing hydrogen bond polysiloxane (C) and platinum metal series catalysts (D), wherein the chemical structural formula of the silicon-containing hydrogen bond polysiloxane (C) is HR42SiO (SiR320)nSiR42H; the ratio of the parts by weight of the linear polysiloxane (A) component / (the first silicon resin (B1) component and the second silicon resin (B2) component) is 0.1-2.0, and the ratio of the parts by weight of the first silicon resin (B1) component / the second silicon resin (B2) component is 0.2-4.0.

Description

technical field [0001] The invention relates to a curable silicone resin composition, which can be applied to packaging materials for optical components, packaging materials for semiconductors, COB (Chiponborad) dam glue or electronic insulation coating materials, and especially for LED (Light Emitting Diode) package of components. Background technique [0002] Compared with traditional lighting, Light Emitting Diode (LED) has the advantages of small size, high luminous efficiency, long life, high safety, fast operation response time, rich colors, no heat radiation and no mercury and other toxic substances. Therefore, , is currently developing rapidly. Its applications are quite diverse, such as architectural lighting, consumer hand-held lighting, retail display lighting, and residential lighting. [0003] A general LED packaging structure includes a bracket, an LED chip disposed on the upper surface of the bracket, and packaging glue. Usually, the lower surface of the br...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
Inventor 黄如慧简佑芩
Owner BENQ MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap