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A kind of preparation method of polyimide film

A technology of polyimide film and polyamide film, which is applied in the field of preparation of polyimide film, can solve the problems of difficult control of pore size, shape and porosity, unsuitability for large-scale production, high cost of raw materials, etc., to achieve The product composition is easy to control, the pore size is easy to adjust, and the effect of low dielectric constant

Active Publication Date: 2017-03-29
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are some problems in the above methods, such as high cost of raw materials, difficult to control the size, shape and porosity of pores
The supercritical carbon dioxide method is complicated, the cost of raw materials is high, and it is not suitable for large-scale production

Method used

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  • A kind of preparation method of polyimide film

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Prepare the template

[0039] SiO 2 The microspheres are dispersed into the solvent to prepare a uniform dispersion of the microspheres. Put the clean glass piece into the culture bottle at an angle, inject an appropriate amount of dispersion liquid into the bottle, put the culture bottle into the incubator, and wait for the solvent to volatilize to make the template. The particle size of the microspheres is 20nm. The dispersant used is an aqueous solution of Tween, and the volume fraction of Tween is 0.01%. The temperature in the incubator was 30°C.

[0040] (2) Preparation of polyamic acid solution

[0041] Add dianhydride and diamine monomers in proportion to the polar solvent and heat the stirring plate at 25° C. for 10 hours to obtain a polyamic acid solution. The polyamic acid solution was defoamed under vacuum for 2 hours at room temperature to obtain a membrane-forming solution. The polar solvent of choice is dimethylformamide. The mass fraction of po...

Embodiment 2

[0049] (1) Prepare the template

[0050] Disperse polystyrene microspheres in a solvent to prepare a uniform dispersion of microspheres. Put the clean glass piece into the culture bottle at an angle, inject an appropriate amount of dispersion liquid into the bottle, put the culture bottle into the incubator, and wait for the solvent to volatilize to make the template. The particle size of the microspheres is 1500nm. The dispersant used is an aqueous solution of Tween, and the volume fraction of Tween is 0.15%. The temperature of the incubator was 60°C.

[0051] (2) Preparation of polyamic acid solution

[0052] Dissolving polyamic acid, the precursor of polyimide, in a suitable polar solvent, heating a stirring plate at 50° C. for 10-25 hours to obtain a polyamic acid solution. The polyamic acid solution is degassed under vacuum for 1-15 hours at room temperature to obtain a membrane-forming solution. The selected polar solvent is dimethylformamide, N-methylpyrrolidone or...

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Abstract

The invention discloses a preparation method of a polyimide film. The preparation method mainly comprises the following steps: preparing a template, preparing a polyamide acid solution, preparing a porous polyamide film, and preparing the polyimide film of which the surface is compact. The preparation method provided by the invention is safe in the whole technological process, no expensive equipment is needed, the operation procedures are simple, the composition of a product is easy to control, the prepared polyimide film is smooth in surface, ultralow in dielectric constant, and controllable in aperture size, and has an excellent mechanical property, and pores are orderly distributed on the polyimide film.

Description

technical field [0001] The invention belongs to the technical field of organic film preparation, and in particular relates to a preparation method of a polyimide film. Background technique [0002] With the development of microelectronics technology, the size of VLSI is gradually reduced, and the device density and connection density are increased. It leads to signal transmission delay and crosstalk, limits the improvement of device performance, and puts forward higher requirements on the heat resistance of device materials. In order to reduce signal transmission delay, crosstalk and dielectric loss, and improve device performance, conductive interlayer insulating materials are required to have low dielectric constant and high heat resistance. [0003] Polyimide has good heat resistance, mechanical properties and electrical properties. Its heat resistance temperature can exceed 400°C and its dielectric constant is 3-4. It has great potential to be widely used in the microel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/26C08L79/08C08G73/10
Inventor 李垚刘俊凯赵九蓬
Owner HARBIN INST OF TECH
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