Zinc oxide micro-nano array and preparation method thereof
A zinc oxide array, micro-nano technology, applied in the direction of zinc oxide/zinc hydroxide, nanotechnology, etc., can solve difficult micro, nano device structure, and it is difficult to realize the controllable positioning device growth of zinc oxide nanostructure, method Limiting problems such as chemical and physical vapor deposition, to achieve the effect of wide range of uses, simple preparation process and strong operability
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[0026] Example 1
[0027] This embodiment is used to illustrate the method for preparing the zinc oxide micro-nano array provided by the present invention.
[0028] 1) Preparation of precursor solution: 3 grams of Zn(NO 3 ) 2 ·6H 2 O(0.1mol / L) and 0.7g(CH 2 ) 6 N 4 (0.05mol / L) added to 100ml of deionized water, stirring continuously for at least 10 minutes until the solution is uniform;
[0029] 2) Preparation of the substrate: a silicon wafer with a smooth surface is selected as the substrate, and after ultrasonic cleaning, metal zinc is thermally evaporated on the silicon wafer, and high-temperature oxygen is introduced to react to form a zinc oxide film (the thickness of the film) After the substrate is cooled, a layer of photoresist with a thickness of 45 nanometers is sprayed on the film (MJB4 contact aligning exposure system produced by SUSS, Germany; technical indicators: a resolution of 0.7 micron and 365 nm light source, Alignment accuracy 0.5 microns), and then perform pa...
Example Embodiment
[0032] Example 2
[0033] This embodiment is used to illustrate the method for preparing the zinc oxide micro-nano array provided by the present invention.
[0034] 1) Preparation of precursor solution: 0.3 g of Zn(NO 3 ) 2 ·6H 2 O(0.01mol / L) and 0.14g(CH 2 ) 6 N 4 (0.01mol / L) Add to 100ml deionized water, keep stirring for at least 10 minutes until the solution is uniform;
[0035] 2) Preparation of the substrate: a silicon wafer with a flat and smooth surface is selected as the substrate, and after ultrasonic cleaning, a layer of zinc oxide film (with a thickness of 45 nanometers) is evaporated on the silicon wafer by magnetron sputtering; wait for the substrate to cool Afterwards, spray a layer of photoresist with a thickness of 45 nanometers (same as Example 1) on the film, and then perform partial electron beam exposure on the photoresist to obtain a hole array with an average pore diameter of 300 nanometers;
[0036] 3) Forming zinc oxide array: Put the substrate prepared in st...
Example Embodiment
[0038] Example 3
[0039] This embodiment is used to illustrate the method for preparing the zinc oxide micro-nano array provided by the present invention.
[0040] 1) Preparation of precursor solution: 3 grams of Zn(NO 3 ) 2 ·6H 2 O(0.1mol / L) and 0.14g(CH 2 ) 6 N 4 (0.01mol / L) Add to 100ml deionized water, keep stirring for at least 10 minutes until the solution is uniform;
[0041] 2) Preparation of the substrate: a silicon wafer with a smooth surface is selected as the substrate, after ultrasonic cleaning, metal zinc is thermally evaporated on the silicon wafer, and high temperature oxygen is introduced to react to form a zinc oxide film (the thickness of the film) After the substrate is cooled, a layer of photoresist with a thickness of 45 nm (same as Example 1) is sprayed on the film, and then partial electron beam exposure is performed on the photoresist to obtain an average pore diameter of 300 nm Array of holes;
[0042] 3) Form zinc oxide array: Put the substrate prepared ...
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