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High-toughness epoxy resin composition applied to RTM (resin transfer molding) process and preparation method thereof

An epoxy resin and high-toughness technology, applied in the field of high-toughness epoxy resin composition and its preparation, can solve the problem of limited toughness improvement, low strength, modulus and glass transition temperature, low strength, modulus and glass transition temperature Reduce the temperature and other problems, to achieve the effect of low viscosity and high strength

Active Publication Date: 2014-08-13
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The elongation at break of the modified bisphenol A epoxy / modified amine system prepared by Beijing Glass Steel Institute Composite Materials Co., Ltd. by toughening and modifying ordinary bisphenol A epoxy resin is as high as 5.7%, but its strength, modulus low glass transition temperature [Lu Jinyan, Wang Lei, Chai Hongmei; FRP / Composite Materials, 2008(4): 16-18]
The elongation at break of the modified CYD-128 / liquid amine system prepared by Zhuzhou Times New Material Technology Co., Ltd. through the blending and toughening of CYD-128 epoxy resin and high-performance epoxy resin reached 5.3%, but its Lower strength, modulus and glass transition temperature【CN101880443A】
[0005] In summary, the current toughened modified RTM epoxy resin has limited improvement in toughness, or even though the toughness has been improved more, its strength, modulus and glass transition temperature have been greatly reduced, which is difficult to meet the needs of aerospace, cryogenic engineering and other fields. Requirements for RTM epoxy resins to achieve high toughness while maintaining high strength, modulus and glass transition temperature

Method used

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  • High-toughness epoxy resin composition applied to RTM (resin transfer molding) process and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Stir 19 parts of diethyltoluenediamine and 10 parts of polyetheramine D-230 at room temperature, and mix uniformly to form a component B liquid curing agent containing polyetheramine D-230 with a mass fraction of 34%;

[0023] Then at 40°C, remove the air bubbles with the A-component 830 epoxy resin and the B-component liquid curing agent in a vacuum;

[0024] Use an RTM injection machine to mix evenly according to the mass ratio of component A: component B = 100:29, then inject it into an RTM mold with a mold temperature of 35°C, and cure at 80°C / 1h+100°C / 2h+130°C / 2h , to obtain cured epoxy resin.

[0025] The RTM operating process window of the epoxy resin composition at 35° C. is 148 min (viscosity2 , while its tensile strength is 77.6MPa, tensile modulus is 3.1GPa, glass ring transition temperature Tg is 89 ℃. See Table 1 for other performance data.

Embodiment 2

[0027] Stir 15 parts of diethyltoluenediamine and 15 parts of polyetheramine D-230 evenly at room temperature, and mix them into a component B liquid curing agent containing D-230 with a mass fraction of 50%;

[0028] Then, at 35°C, remove the air bubbles with the A-component 830 epoxy resin and the B-component liquid curing agent in a vacuum;

[0029] Use an RTM injection machine to mix evenly according to the mass ratio of component A: component B = 100:30, then inject it into the RTM mold with a mold temperature of 38°C, and cure at 80°C / 1h+100°C / 2h+130°C / 2h , to obtain cured epoxy resin.

[0030] The RTM operating process window of the epoxy resin composition at 35° C. is 140 min (viscosity2 , while the tensile strength is 76.2MPa, the tensile modulus is 3.0GPa, and the glass ring transition temperature Tg is 85°C. See Table 1 for other performance data.

Embodiment 3

[0032] Stir 11 parts of diethyltoluenediamine and 20.5 parts of polyetheramine D-230 evenly at room temperature, and mix them into a component B liquid curing agent containing D-230 with a mass fraction of 65%;

[0033] Then, at 30°C, remove the air bubbles with the A-component 830 epoxy resin and the B-component liquid curing agent in a vacuum;

[0034] Use an RTM injection machine to mix evenly according to the mass ratio of component A: component B = 100:31.5, then inject it into an RTM mold with a mold temperature of 35°C, and cure at 80°C / 1h+100°C / 2h+130°C / 2h , to obtain cured epoxy resin.

[0035]The RTM operating process window of the epoxy resin composition at 35° C. is 139 min (viscosity2 , while the tensile strength is 79.3MPa, the tensile modulus is 3.1GPa, and the glass ring transition temperature Tg is 89°C. See Table 1 for other performance data.

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Abstract

The invention provides an epoxy resin composition which is not only applicable to an RTM (resin transfer molding) process, but also is high in toughness and higher in strength. The invention further provides a preparation method of the epoxy resin composition. The preparation method is as follows: under a room temperature, uniformly mixing diethyl toluene diamine with polyether amine D-230 to prepare a component B liquid curing agent with polyether amine D-230 with mass fraction of 20%-90%; then, removing air bubbles in vacuum for component A epoxy resin and component B liquid curing agent at 30 DEG C-40 DEG C; adopting an RTM injector for uniformly mixing the component A with the component B in a mass ratio of 100:(25-50), then injecting to an RTM mould with a mould temperature of 30 DEG C-40 DEG C for curing to obtain the high-toughness epoxy resin composition. The epoxy resin composition disclosed by the invention has an RTM operation process window greater than 138 min at 30 DEG C-45 DEG C, and is suitable for RTM process forming. The epoxy resin composition is low in viscosity, does not need to use a diluent, a defoaming agent, and the like; and a curing product of the epoxy resin composition has high toughness.

Description

technical field [0001] The present invention relates to a kind of high-toughness epoxy resin composition suitable for RTM process and preparation method thereof, specifically, the present invention relates to a kind of with lower initial viscosity and longer RTM process window under process operating temperature , and an epoxy resin composition with high toughness and high strength and a preparation method thereof. Background technique [0002] Resin transfer molding, also known as RTM process, is a composite material molding process in which resin is injected into a closed mold to infiltrate reinforcing materials and solidified. It has the advantages of high surface dimensional accuracy, overall net size molding of the product, low porosity, and high molding efficiency. Widely used in aerospace, ships, automobiles and other fields. The resin in the RTM process has only one step of impregnating the fiber, so the resin is required to have a low viscosity (generally <1Pa·s...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/50
Inventor 孙宝岗史汉桥刘千张毅杨智勇潘玲英赵伟栋赵锐霞尹亮蒋文革孙宏杰
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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