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High temperature resistant soluble polyimide resin and preparation method thereof

A polyimide resin and polyimide technology are applied in the field of soluble and fusible polyimide resin and its preparation, which can solve the problems of limited application scope, inability to apply films and coatings, etc., and expand the application scope. , excellent mechanical properties and dimensional stability, the effect of a wide range of applications

Active Publication Date: 2018-09-11
江苏尚莱特医药化工材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application range of polyimide molding compound is relatively limited, and it cannot be used in fields such as film and coating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0022] The preparation method of the high-temperature-resistant soluble polyimide resin of the present embodiment has the following steps:

[0023] ①Add 52.05g of bisphenol A diether dianhydride (0.1mol) and 22.43g of 2-(4-aminophenyl) into a four-neck flask equipped with a stirrer, water separator, thermometer and nitrogen protection device - 5-aminobenzimidazole (0.1mol), 223g of aprotic organic solvent DMAc and 60g of xylene, stirred and dissolved and heated to 150±2°C, the system began to reflux, and water was brought out at the same time.

[0024] Continue the reflux reaction at this temperature for 2-3 hours until the system becomes viscous and there are a lot of bubbles churning.

[0025] Stop heating, and cool naturally to ambient temperature (0-40°C, the same below), to obtain a polyamic acid-polyimide mixed solution.

[0026] ② Pour the polyamic acid-polyimide mixed solution obtained in step ① into a high-speed tissue masher containing deionized water for precipitat...

Embodiment 2～ Embodiment 4）

[0030] Each embodiment is basically the same as Embodiment 1, and the differences are shown in Table 1.

[0031] Table 1

[0032]

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Abstract

The invention discloses high-temperature-resistant soluble and fusible polyimide resin and a preparation method thereof. The high-temperature-resistant soluble and fusible polyimide resin is prepared from bisphenol A type diether dianhydride and 2-(4-aminophenyl)-5-aminobenzimidazole and the specific method comprises the steps of performing polymerization reaction on bisphenol A type diether dianhydride and 2-(4-aminophenyl)-5-aminobenzimidazole in a mixed organic solvent under the protection of nitrogen at reflux temperature to obtain a polyamic acid-polyimide mixed solution, pouring the polyamic acid-polyimide mixed solution into a high-speed tissue masher containing a polymer precipitation agent for precipitation and mashing and then sequentially performing suction filtration, washing, re-suction filtration, vacuum drying and thermal imidization to obtain the high-temperature-resistant soluble and fusible polyimide resin. The polyimide resin disclosed by the invention has the advantages of excellent solubility and melt flowability, high long-term using temperature of above 230 DEG C and excellent high temperature resistance.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high-temperature-resistant soluble polyimide resin and a preparation method thereof. Background technique [0002] Polyimide is one of the varieties with the best comprehensive performance among commercialized high-performance polymers, and is called "problem-solving expert" by the industry. [0003] In the 1960s, DuPont successively developed the famous KAPTON polyimide film and VESPEL polyimide plastic. These two series of polyimide materials not only have excellent heat resistance, creep resistance, and In addition to chemical resistance, it also has excellent mechanical and electrical properties, and has been widely used in high-performance components such as electronics and electrical, industrial machinery, automobiles, and aircraft. However, these two polyimides composed of pyromellitic dianhydride and 4,4'-diphenyl ether diamine are insoluble and i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 胡国宜胡锦平吴建华游劲松兰静波
Owner 江苏尚莱特医药化工材料有限公司