Method for preparing large diamond/copper composite plate through semi-solid continuous rolling

Abstract

The invention discloses a method for preparing a large diamond/copper composite plate through semi-solid continuous rolling. The method includes the specific steps of plating the surfaces of diamond particles with a layer of copper, evenly mixing the diamond particles with CuZn31Al2 copper powdered alloy with the volume fraction ranging from 5% to 15%, loading the mixed diamond/copper alloy particles into thin-wall pure copper thin pipes with the outer diameter ranging from 2.5 mm to 3.5 mm, sealing the two ends of each copper pipe, collecting the thin copper pipes containing the diamond/copper alloy particles into a bundle, loading the bundle into a thin-wall round copper pipe with the outer diameter ranging from 15 mm to 20 mm to form a prefabricated body, pressing the prefabricated body into an ellipsoid on a press machine, heating the ellipsoid obtained through pressing to the temperature at which the copper alloy CuZu31Al2 is in the semi-solid state, conducting continuous rolling on a continuous rolling machine, and conducting stress relief annealing at the temperature ranging from 260 DEG C to 400 DEG C after rolling is conducted, wherein the volume fraction of the prepared diamond/copper composite plate diamond particles ranges from 55% to 65%, the heat conductivity can reach more than 400 W/(m K), and the method has wide application prospects in the electronic package field.

Description

technical field [0001] The invention belongs to the technical field of semi-solid forming, and in particular relates to a method for preparing large-size diamond / copper composite plates by semi-solid continuous rolling. Background technique [0002] With the improvement of the integration of integrated circuit electronic components, more and more functional requirements, and smaller and smaller volume requirements, the components will generate a lot of heat when they run at high speed, and the heat must be dissipated immediately to ensure that the components can be used Operates at maximum efficiency at normal operating temperature. Therefore, the problem of heat dissipation has become a severe challenge that many engineers must face, and the preparation and processing of high thermal conductivity materials has become a technical bottleneck that needs to be urgently solved in the integrated circuit industry. [0003] Diamond is the material with the highest thermal conducti...

AI Technical Summary

Problems solved by technology

The production process of this method is complicated, the process equipment is high, and only a single process can be carried out, and the sintering at high temperature will lead to serious graphitization of diamond particles, which will affect the structure and performance of the composite material.

[0008] In addition to the above methods, there are some other technologies improved on the above methods, but they all have high temperature, high pressure, low efficiency, low thermal conductivity, high preparation cost, small product size, non-continuous preparation, and the prepared composite material gas Common problems such as poor tightness

[0009] At the same time, the invention patent of "Method for Manufacturing Metal and Diamond Composite" with application number 200910073746.4 in the prior art utilizes flat roll rolling, and flat roll rolling cannot guarantee the uniformity of deformation of the rolled piece in the width direction. At the same time, the cracking of the welded part of the rolled piece cannot be avoided, and a single clad tube cannot guarantee the uniformity of the composition and performance of the composite material after rolling. The product is a small size composite board

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