Boxy hole rolling method for large-sized high-thermal-conductivity diamond/copper composite board

A high thermal conductivity, diamond technology, applied in the field of rolling forming, can solve the problems of affecting the performance, low density of composite materials, small size of composite materials, etc., and achieve the effect of improving the density

Inactive Publication Date: 2015-01-28
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composite material prepared by this method is small in size and can only be produced individually, which is not suitable for mass production, and the investment in equipment is high, and the production cost is also high
In addition, the density of the prepared composite material is low, which affects its performance
[0008] In addition to the above methods, other technologies are improvements of the above methods, but there are high temperature, high pressure, high preparation cost, low efficiency, non-continuous preparation, small product size, poor air tightness of the prepared composite material, low thermal conductivity, etc. common problem

Method used

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  • Boxy hole rolling method for large-sized high-thermal-conductivity diamond/copper composite board
  • Boxy hole rolling method for large-sized high-thermal-conductivity diamond/copper composite board
  • Boxy hole rolling method for large-sized high-thermal-conductivity diamond/copper composite board

Examples

Experimental program
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Effect test

Embodiment 1

[0027] The preparation process of a high thermal conductivity diamond / copper composite board is shown in the attached figure 1 As shown, firstly, after the surface of the diamond particles is cleaned, a layer of pure copper coating is electroplated; secondly, the treated diamond / copper powder 2 is filled into a thin-walled pure copper tube 3 with an outer diameter of 2.5mm and an inner diameter of 2.0mm ; Then, 76 lengths of 100mm are filled with copper tubes 3 of diamond / copper powder evenly arranged between copper plates 1 of 100mm (long) * 32mm (wide) * 1mm (thick), as attached figure 2 As shown, the upper and lower copper plates 1 are welded into a prefabricated body 6 along the length direction by fusion welding, and the prepared prefabricated body 6 is as follows figure 2 Shown; Prefabricated body 6 is placed between the roll 4 of box hole rolling mill and carries out the cold rolling of seven passes, and rolling process is as image 3 with 4 As shown, the reductions...

Embodiment 2

[0029] The preparation process of a high thermal conductivity diamond / copper composite board is shown in the attached figure 1 As shown, first, after the surface of the diamond particles is cleaned, a layer of pure copper coating is electroplated; secondly, the processed diamond / copper powder 2 is filled into a thin-walled pure copper tube 3 with an outer diameter of 3mm and an inner diameter of 2.5mm; Then, 54 copper tubes 3 filled with diamond / copper powder with a length of 100mm are evenly arranged between copper plates 1 of 100mm (length) × 32mm (width) × 1mm (thickness), as attached figure 2 As shown, the upper and lower copper plates 1 are welded into a prefabricated body 6 along the length direction by fusion welding, and the prepared prefabricated body 6 is as follows figure 2 Shown; Prefabricated body 6 is placed between the roll 4 of box hole rolling mill and carries out the cold rolling of seven passes, and rolling process is as image 3 with 4 As shown, the red...

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Abstract

The invention discloses a boxy hole rolling method for a large-sized high-thermal-conductivity diamond / copper composite board. The method particularly comprises the following steps: uniformly placing diamond particles with copper-coated surfaces into thin-walled copper tubes with the external diameter of 2.5-3.5 mm; stacking the copper tubes into a bundle between an upper layer of copper sheets and a lower layer of copper sheets and welding the side edges of the two layers of copper sheets into a precast body; subjecting the prepared preform to multi-pass boxy hole cold rolling, and performing stress relieving at the temperature of 260-400 DEG C after each pass of rolling. Owing to the hardness difference between diamond and pure copper, in the rolling process, the diamond particles enter the copper matrix in an embedded manner. The boxy-hole pass rolling method has the advantages of uniform deformation, large deflection, capability of mass production and the like, and facilitates improvement on the production efficiency and reduction of the manufacturing cost. In the prepared diamond / copper composite board, the volume fraction of the diamond particles is 55-65%, and the thermal conductivity can reach more than 400W / (m.K). Therefore, a wide application prospect is achieved in the electronic encapsulation field.

Description

technical field [0001] The invention relates to a preparation method of a large-size high-thermal conductivity diamond / copper composite plate, which belongs to the field of rolling forming. Background technique [0002] With the rapid development of microelectronics technology, the integration of electronic chips is getting higher and higher. While the power is greatly increased, the volume is getting smaller and smaller, so high-efficiency heat dissipation has become an urgent problem to ensure the normal operation of electronic chips. [0003] Diamond is the material with the highest thermal conductivity known in nature, and its thermal conductivity can reach 1500-2000W / (m K). It has great application potential in the field of heat dissipation. At present, the technology of synthetic diamond is very mature, and its production cost is also greatly increased. The decline makes it possible for large-scale application of synthetic diamond in composite materials. Copper is on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B21B1/28
CPCB23P15/00B21B1/28
Inventor 王开坤付金龙段凯悦王淑娴
Owner UNIV OF SCI & TECH BEIJING
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