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Positive photosensitive resin composition and method for forming patterns by using the same

A technology of photosensitive resin and composition, which is applied in optics, optomechanical equipment, nonlinear optics, etc. It can solve the problems of reduced process yield, poor cross-sectional shape of pattern, and inability to form patterns, etc., and achieve the effect of good cross-sectional shape

Inactive Publication Date: 2014-08-27
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the aforementioned known technologies, the photosensitive resin composition cannot form a pattern with a high film thickness after post-baking
Secondly, the resulting pattern has a poor cross-sectional shape, resulting in a decrease in the yield of subsequent processes

Method used

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  • Positive photosensitive resin composition and method for forming patterns by using the same
  • Positive photosensitive resin composition and method for forming patterns by using the same
  • Positive photosensitive resin composition and method for forming patterns by using the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example A-1-1

[0094] A four-necked conical flask with a volume of 1000 ml is equipped with a nitrogen inlet, a stirrer, a heater, a condenser and a thermometer. After the nitrogen is introduced, 0.70 mol of m-cresol, 0.30 mol of p-cresol, and 3,4-dihydroxy are added. 0.5 moles of benzaldehyde and 0.020 moles of oxalic acid. Stir slowly to raise the temperature of the reaction solution to 100°C, and polycondensate at this temperature for 6 hours. Then, the reaction solution is heated to 180°C, dried under reduced pressure at a pressure of 10 mmHg, and the solvent is devolatilized to obtain a hydroxyl-type novolak resin (A-1-1).

[0095] Synthesis examples A-1-2 to A-3-3

[0096] The synthesis method of the hydroxyl novolak resin is the same as that of Synthesis Example A-1-1, except that Synthesis Examples A-1-2 to A-3-3 change the reactants in the hydroxyl novolak resin (A-1) Types and dosages, the formula is shown in Table 1, and will not be repeated here.

[0097] Preparation of positive phot...

Embodiment 1

[0100] 70 parts by weight of the hydroxy-type novolak resin (A-1-1) obtained in Synthesis Example A-1-1, and 30 parts by weight of the hydroxy-type novolak resin (A-2- 1) 30 parts by weight of 1-[1-(4-hydroxyphenyl)isopropyl]-4-[1,1-bis(4-hydroxyphenyl)ethyl]benzene and 1,2-naphthoquinone Diazide-5-sulfonic acid ester (B-1) (average degree of esterification 85%), 10 parts by weight of tris(4-hydroxyphenyl)methane (C-1), and 300 parts by weight of propylene glycol In the solvent (D-1) of propylene glycol monomethyl ether acetate (PGMEA), the above mixture is dissolved in the solvent by stirring with a shaking stirrer to obtain the positive photosensitive resin composition of the present invention . The obtained positive photosensitive resin composition was evaluated in each of the following evaluation methods, and the results are as shown in Table 2. Among them, the detection methods of discoloration after etching, resolution, and residual film rate will be described later.

Embodiment 2 to 10

[0102] The preparation method of the positive photosensitive resin composition is the same as that of Example 1, except that Examples 2 to 10 change the types and usage of the raw materials in the positive photosensitive resin composition. The formula and test results are shown in Table 2. Show, not repeat them here.

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Abstract

The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a hydroxycompound (C) and a solvent (D). The novolac resin (A) further includes a hydroxy-type novolac resin (A-1) and a xylenol-type novolac resin (A-2). The hydroxy-type novolac resin (A-1) is synthesized by condensing hydroxyl benzaldehyde compound with aromatic hydroxyl compound. The xylenol-type novolac resin (A-2) is synthesized by condensing aldehyde compound with xylenol compound. The postbaked positive photosensitive resin composition can be beneficially formed to patterns with high film thickness and well cross-sectional profile.

Description

Technical field [0001] The present invention relates to a positive photosensitive resin composition and a pattern forming method thereof, and in particular to a liquid crystal display element or touch panel used in semiconductor integrated circuit elements, thin film transistors (hereinafter referred to as TFT) In the manufacturing process, a pattern with high film thickness and good cross-sectional shape can be obtained after post-baking. Background technique [0002] With the miniaturization of various electronic products in life, various smart phones, thin TVs, and high-performance microprocessors have increasingly higher requirements for high resolution. As a result, the photolithography process needs to be more and more precise to form a finer The line width. [0003] For the above-mentioned purpose, Japanese Patent Publication No. 2003-98669 discloses a positive photosensitive resin composition comprising a novolak resin, a photoacid generator and an organic solvent. The no...

Claims

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Application Information

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IPC IPC(8): G03F7/039G03F7/00G02F1/1368
Inventor 刘骐铭施俊安
Owner CHI MEI CORP
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