Method for sintering high-performance copper-tungsten electrical contact material by spark plasma
A discharge plasma and contact material technology, applied in the direction of circuits, electric switches, electrical components, etc., can solve the problems of thermal conductivity, arc ablation resistance and mechanical properties, large difference in melting point, long sintering time, etc. To achieve the effect of short sintering time, fast heating speed and uniform grain
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Embodiment 1
[0019] Copper-tungsten composite powder is prepared by mixing tungsten powder with mass ratio of 70% and copper powder with 30% content, and put it into graphite mould. Put the graphite mold into the discharge plasma sintering furnace, apply a pressure of 60 MPa to the copper-tungsten composite powder, and vacuumize the sintering furnace, and the vacuum degree is lower than 10 -1 Under the condition of Pa, the temperature was raised to 900°C at a heating rate of 300°C / min, kept for 25 minutes, and finally cooled to room temperature with the furnace to prepare copper-tungsten electrical contact materials.
[0020] Embodiment 1 makes the performance of copper-tungsten electrical contact material as follows:
[0021] Density: 99%;
[0022] Conductivity: 4.7μΩ.cm;
[0023] Hardness (HB): 242.
Embodiment 2
[0025] Prepare copper-tungsten composite powder with 80% tungsten powder and 20% copper powder by mass ratio, and put it into graphite mould. Put the graphite mold into the discharge plasma sintering furnace, apply a pressure of 20 MPa to the copper-tungsten composite powder, and vacuumize the sintering furnace, and the vacuum degree is lower than 10 -1 Under the condition of Pa, the temperature was raised to 1200°C at a heating rate of 100°C / min, kept for 5 minutes, and finally cooled to room temperature with the furnace to prepare copper-tungsten electrical contact materials.
[0026] Embodiment 2 makes the performance of copper-tungsten electrical contact material as follows:
[0027] Density: 97%;
[0028] Conductivity: 4.3μΩ.cm;
[0029] Hardness (HB): 262.
Embodiment 3
[0031] Copper-tungsten composite powder is prepared by mixing tungsten powder with mass ratio of 75% and copper powder with 25% content, and put it into graphite mould. Put the graphite mold into the discharge plasma sintering furnace, apply a pressure of 40MPa to the copper-tungsten composite powder, pass inert gas into the sintering furnace, raise the temperature to 1100°C at a heating rate of 200°C / min, keep it for 15min, and finally cool down with the furnace to room temperature, the copper-tungsten electrical contact material is prepared.
[0032] Embodiment 3 makes the performance of copper-tungsten electrical contact material as follows:
[0033] Density: 98.5%;
[0034] Conductivity: 4.6μΩ.cm;
[0035] Hardness (HB): 256.
[0036] The density of the copper-tungsten alloy electrical contact material is measured by the Archimedes method, the electrical conductivity of the material is measured by the FQR7501A eddy current conductivity meter, and the hardness of the mat...
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