Laser processing method and laser cutting systems of high molecular workpieces

A laser processing method and polymer material technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as carbonized layers, achieve the effect of improving quality and ensuring cutting quality

Active Publication Date: 2014-09-03
HANS LASER TECH IND GRP CO LTD
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Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide a laser processing method for polymer material workpieces and a laser cutting system for realizing the laser processing method, which has high processing efficiency and effectively solves the problems of the prior art. The problem of carbonized layer in the machining section of the laser processing polymer material workpiece

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  • Laser processing method and laser cutting systems of high molecular workpieces
  • Laser processing method and laser cutting systems of high molecular workpieces
  • Laser processing method and laser cutting systems of high molecular workpieces

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] Such as Figure 1 ~ Figure 4 As shown, in the laser processing method of polymer material workpiece 3 provided by the embodiment of the present invention, the first laser cutting head 1 and the second laser cutting head 2 irradiate two laser beams with different powers to the workpiece 3 respectively, and the high power The laser beam 101 first moves and cuts along the processing track of the workpiece 3 for a certain distance, and then the low-power laser beam 102 moves and cuts along the processing track of the high-power laser beam 101, and the first laser cutting head 1 and the second la...

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Abstract

The invention belongs to the technical field of laser processing, and discloses a laser processing method of high molecular workpieces. Two laser cutting heads irradiate the workpieces with two laser beams with different power values, the high-power laser beam moves along a processing track of the workpieces to cut the workpieces by a certain distance, and then the low-power laser beam moves along the processing track of the high-power laser beam for cutting. The invention further discloses two laser cutting systems for realizing the laser processing method, one laser cutting system comprises two laser oscillators, two laser drivers, two industrial personal computers and the two laser cutting heads, and the high-power laser beam and the low-power laser beam can independently controlled to be transmitted; the other laser cutting system comprises a laser oscillator, a laser driver, an industrial personal computer, the two laser cutting heads and a beam splitter used for splitting a laser beam transmitted by the laser oscillator to a high-power laser beam and a low-power laser beam.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser processing method for a polymer material workpiece and a laser cutting system designed by using the laser processing method. Background technique [0002] With the rapid development of laser technology, laser processing technology is also constantly improving. Due to the advantages of high efficiency, high quality and high precision, laser processing technology has gradually replaced traditional mechanical processing technology in many processing fields. . [0003] Workpieces made of Kevlar, carbon fiber, leather and other polymer materials are widely used in the casings and jackets of consumer electronics products such as mobile phones, laptops, and tablet computers. These polymer material workpieces are machined by traditional machinery such as mechanical CNC milling When cutting by processing technology, because the cutting tool is in direct conta...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/046B23K26/067B23K26/14
CPCB23K26/046B23K26/067B23K26/14B23K26/38
Inventor 肖磊杨锦彬李斌郭炜赵建涛褚志鹏高云峰
Owner HANS LASER TECH IND GRP CO LTD
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