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A special ultra-thin metal-based diamond cutting sheet for wlcsp packaging chip and preparation method

A technology of ultra-thin metal and cutting blades, which is applied in the direction of stone processing equipment, manufacturing tools, fine working devices, etc., can solve the problems of high price, harsh cutting requirements, and the inability to develop cutting blades, etc. The effect of high degree and strong holding power

Active Publication Date: 2017-02-01
苏州赛尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Since the promulgation of "Several Policies on Encouraging the Development of the Software Industry and the Integrated Circuit Industry" in 2000, the semiconductor integrated circuit industry has developed rapidly, and the scale of the industry has expanded rapidly. In particular, the scale and technological innovation capabilities of the IC packaging and testing service industry have also increased year by year. The domestic semiconductor industry is developing rapidly. Domestic packaging companies are mainly concentrated in the Yangtze River Delta. Ultra-thin cutting sheets mainly rely on imports from companies such as DISCO and ADMAS. The annual market value is about 400-600 million yuan. Cutting discs can meet the requirements
Because of its high price and very strict cutting requirements, edge chipping and corner chipping are basically not allowed, so domestic enterprises have been unable to develop such cutting blades.

Method used

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  • A special ultra-thin metal-based diamond cutting sheet for wlcsp packaging chip and preparation method
  • A special ultra-thin metal-based diamond cutting sheet for wlcsp packaging chip and preparation method
  • A special ultra-thin metal-based diamond cutting sheet for wlcsp packaging chip and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A special ultra-thin metal-based diamond cutting sheet for WLCSP packaging chips, the components and contents of the metal-based matrix are as follows:

[0035]

[0036] Its preparation method is:

[0037] (1) Mixing: Put the copper powder, tin powder, nickel powder, graphite, diamond (concentration: 20%, particle size: 10 μm) accurately weighed according to the content of the above components into the mixer and mix for 2 hours. After 120# sieve, put it into the container for later use;

[0038] (2) Cold press forming: Put the material into the mold slowly, and gently scrape it with a scraper, place it on the hydraulic press platform together with the mold, and apply a pressure of 3.0*10 3 MPa is made into a shaped compact;

[0039] (3) Hot pressing sintering: put the pressed green body into the sintering furnace, heat up at a rate of 60°C / min, raise the temperature to the final sintering temperature of 550°C, keep it warm for 1 hour, cool it to room temperature wi...

Embodiment 2

[0044] A special ultra-thin metal-based diamond cutting sheet for WLCSP packaging chips, the components and contents of the metal-based matrix are as follows:

[0045]

[0046]

[0047] Its preparation method is:

[0048] (1) Mixing: Put copper powder, tin powder, nickel powder, graphite, diamond (concentration: 30%, particle size: 8 μm) accurately weighed according to the content of the above components into the mixer, and mix for 1 hour. Put it into a container after passing through a 120# sieve;

[0049] (2) Cold press forming: Put the material into the mold slowly, and gently scrape it with a scraper, place it on the hydraulic press platform together with the mold, and apply a pressure of 3.0*10 3 MPa is made into a shaped compact;

[0050] (3) Hot pressing sintering: put the pressed green body into the sintering furnace, heat up at a rate of 60°C / min, heat up to the final sintering temperature of 520°C, keep it warm for 1 hour, cool it to room temperature with the...

Embodiment 3

[0055] A special ultra-thin metal-based diamond cutting sheet for WLCSP packaging chips, the components and contents of the metal-based matrix are as follows:

[0056]

[0057] Its preparation method is:

[0058](1) Mixing: put copper powder, tin powder, nickel powder, graphite, diamond (concentration: 25% particle size: 15 μm) accurately weighed according to the content of the above components into the mixer, mix for 1.5 hours, pass After 120# sieve, put it into the container for later use;

[0059] (2) Cold press forming: Put the material into the mold slowly, and gently scrape it with a scraper, place it on the hydraulic press platform together with the mold, and apply a pressure of 3.0*10 3 MPa is made into a shaped compact;

[0060] (3) Hot pressing sintering: put the pressed body into the sintering furnace, heat up at a rate of 65°C / min, raise the temperature to the final sintering temperature of 500°C, keep it warm for 1 hour, cool it to room temperature with the f...

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Abstract

The invention discloses a special ultra thin metal-based diamond cutting sheet for a WLCSP packaging chip. The cutting sheet is composed of a metal matrix carcass and diamond particles. For the diamond cutting sheet, the concentration of the diamond is 15-40 wt%, and the particle diameter of the diamond is 5-30 [mu]m. The metal-based matrix carcass comprises the following compositions by weight percent, 55-70% of copper powder, 25-40% of tin powder, 5-15% of nickel powder, and 1-10% of graphite. The invention also discloses a process for preparing the diamond cutting sheet by the steps of material mixing, cold press molding, hot press sintering and mechanical processing, the quality requirement for the WLCSP packaging chip can be satisfied, the cutting speed is fast, the efficiency is high, and at the same time, the breaking phenomenon cannot occur, and the source of raw materials is wide. The cutting sheet is suitable for modernized industrial production.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision cutting, and is used in the manufacturing industry of superhard material products or tools, in particular to an ultra-thin metal-based diamond cutting sheet used when dividing WLCSP packaged chips and a preparation method thereof. Background technique [0002] Since the promulgation of "Several Policies on Encouraging the Development of the Software Industry and the Integrated Circuit Industry" in 2000, the semiconductor integrated circuit industry has developed rapidly, and the scale of the industry has expanded rapidly. In particular, the scale and technological innovation capabilities of the IC packaging and testing service industry have also increased year by year. The domestic semiconductor industry is developing rapidly. Domestic packaging companies are mainly concentrated in the Yangtze River Delta. Ultra-thin cutting sheets mainly rely on imports from companies such as DISCO and ADM...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B23P15/28
Inventor 冉隆光李威
Owner 苏州赛尔科技有限公司
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