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Positive infrared sensitive composition and imaging element thereof

A composition and infrared technology, which is applied in the field of imageable components for positive plate making and positive infrared sensitive composition, can solve problems such as erosion and unfavorable lithography, and achieve the effect of prolonging life

Active Publication Date: 2014-09-10
ZHEJIANG KONITA NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention solves the problem that the prior art imageable composition for positive working plate making is susceptible to printing room chemicals and is unfavorable for lithographic printing, and then provides a product with good solvent resistance and printing room chemical properties The positive-working infrared-sensitive composition, the present invention also provides a positive-working imageable element prepared by using said composition

Method used

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  • Positive infrared sensitive composition and imaging element thereof
  • Positive infrared sensitive composition and imaging element thereof
  • Positive infrared sensitive composition and imaging element thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0040] The positive infrared sensitive composition described in the present embodiment comprises:

[0041] Cyanine dye IRD-85, 0.2 parts by weight, purchased from DKSH Holding Ltd.;

[0042] Methyl violet, 0.14 parts by weight;

[0043] Diphenyliodonium hexafluorophosphate, 0.20 parts by weight;

[0044] Polymer, 6.16 parts by weight; The polymer includes a main chain LB6564 resin with a phenolic repeating unit and a substituting group covalently connected with the main chain LB6564 resin, and the structure of the polymer is as shown in formula (I) Show:

[0045]

[0046] Wherein, R represents the main chain of the LB6564 resin.

[0047] The preparation method of described polymer is as follows:

[0048] In a closed fume hood, add 5 parts by weight of dry LB6564 resin (purchased from German Bakerite Company) and 40.8 parts by weight of DMF to a four-necked round bottom flask equipped with mechanical stirring, thermometer, reflux condenser and constant pressure funnel. ...

Embodiment 2

[0052] The positive infrared sensitive composition described in the present embodiment comprises:

[0053] Cyanine dye IRD-67, 0.2 parts by weight, purchased from DKSH Holding Ltd.;

[0054] Methyl violet, 0.14 parts by weight;

[0055] Diphenyliodonium hexafluorophosphate, 0.20 parts by weight;

[0056] Polymer, 6.16 parts by weight; The polymer includes a main chain BX-10 resin with phenolic repeating units and a substituting group covalently connected with the main chain BX-10 resin, and the structure of the polymer is as follows: (I) as shown:

[0057]

[0058] Wherein R represents the main chain of the BX-10 resin.

[0059] The preparation method of described polymer is as follows:

[0060] In a closed fume hood, add 5 parts by weight of dry BX-10 resin (purchased from Ruishida Chemical Co., Ltd. company) and 40.8 parts by weight of DMF, stirred until the BX-10 resin was completely dissolved. After the DMF solution of the BX-10 resin is clarified, add 0.5 parts b...

Embodiment 3

[0063] The positive infrared sensitive composition described in the present embodiment comprises:

[0064] Cyanine dye IRD-85, 0.2 parts by weight;

[0065] Methyl violet, 0.14 parts by weight;

[0066] Triphenylsulfonium hexafluorophosphate, 0.20 parts by weight;

[0067] Polymer, 6.16 parts by weight; The polymer includes a main chain BTB-225 resin with phenolic repeating units and a substituting group covalently connected with the main chain BTB-225 resin, and the structure of the polymer is as follows: (I) as shown:

[0068]

[0069] Wherein R represents the main chain of the BTB-225 resin.

[0070] The preparation method of described polymer is as follows:

[0071] In a closed fume hood, add 5 parts by weight of dry BTB-225 resin (purchased from Tiancheng Chemical Industry Co., Ltd. Co., Ltd.) and 40.8 parts by weight of DMF, stirred until the BTB-225 resin was completely dissolved. After the DMF solution of the BTB-225 resin is clarified, add 0.5 parts by weight...

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Abstract

The invention discloses a positive infrared sensitive composition which comprises an infrared absorber and a polymer, and is characterized in that the polymer comprises a main chain provided with a phenolic-group repetitive unit, and a substituent group covalently connected with the main chain; a structural formula of the polymer is shown as Formula (I) described in the specification; and R represents the main chain. Compared with an imaging composition for positive platemaking in the prior art, the positive infrared sensitive composition is sensitive to radiation with maximum wavelength of 700-1300nm, and a planographic printing forme precursor prepared by the composition has good tolerance to corrosion of isopropanol, so that the positive infrared sensitive composition can be used for preparing a positive imaging element, and further serves as the planographic printing forme precursor.

Description

technical field [0001] The invention relates to a positive-working infrared sensitive composition and a positive-working imageable element prepared by using the composition, belonging to the field of printing plate materials for lithographic offset printing. technical background [0002] The imageable elements used to make lithographic printing plates generally comprise one or more imageable layers comprising one or more Radiation Sensitive Ingredients. Following radiation imaging, the exposed or non-exposed areas of the imageable layer are removed by a suitable developer, exposing the underlying hydrophilic surface of the support. If exposed areas are removed, the imageable element is considered positive working, and conversely, if non-exposed areas are removed, the imageable element is considered negative working. In either case, the areas of the imageable layer that are not removed are ink receptive, while the hydrophilic surface revealed by the development process acce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/09
Inventor 胡玲玲翁银巧徐能平高邈周辉应作挺黄莹张荣超陶烃
Owner ZHEJIANG KONITA NEW MATERIALS
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