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Electronic tag inlay, processing method of electronic tag inlay and electronic tag

An electronic label and processing method technology, applied in the field of radio frequency identification, to achieve the effect of high strength, simple production process, convenient and quick operation

Inactive Publication Date: 2014-09-17
杨雪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] None of the above-mentioned patents and the prior art can provide an electronic tag inlay that can adapt to different degrees of bending and has a very reliable structural strength

Method used

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  • Electronic tag inlay, processing method of electronic tag inlay and electronic tag
  • Electronic tag inlay, processing method of electronic tag inlay and electronic tag

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] figure 1 and figure 2 Shown is an electronic tag inlay provided by Embodiment 1 of the present invention, which consists of five parts: a dielectric board 10, a chip 20, an antenna, a protective material, and a protective cover 40, wherein:

[0057] A pad is provided on the dielectric board 10; the dielectric board 10 can be made of glass fiber boards, ceramic boards, resin boards, composite boards, bakelite boards or Teflon boards (ie PTFE boards) and other boards, or other materials suitable for high-frequency signal transmission. Plate; pads can be copper etched pads;

[0058] The chip 20 and the antenna are respectively connected to the dielectric plate to realize the electrical conduction between the chip 20 and the antenna; in the present embodiment, the antenna is a spiral metal wire with a spring structure (hereinafter referred to as the spring antenna 30), and of course other such as Ordinary metal wires and other antennas made of metal structures with certa...

Embodiment 2

[0064] The electronic tag inlay provided in this embodiment is also composed of five parts: a dielectric board, a chip, an antenna, a protective material and a protective cover, wherein:

[0065] There is a pad on the dielectric board; the dielectric board can be made of glass fiber board, ceramic board, resin board, composite board, bakelite board or Teflon board, or other boards suitable for high-frequency signal transmission; the pad can be made of copper Etched pad;

[0066] The chip and the antenna are respectively connected to the dielectric board to realize electrical conduction between the chip and the antenna; in this embodiment, the antenna is a copper braided wire, and the copper braided wire includes two parts of equal length, which are respectively connected to both sides of the dielectric board. In this embodiment, the length of each part of the copper braided wire is about 1 / 4 of the wavelength of the radio frequency signal; the chip can be connected to the pad ...

Embodiment 3

[0072] The present embodiment provides a kind of processing method of electronic label inlay, comprises the following steps:

[0073] (1) The chip is connected to the pad of the dielectric board by using a package body with pins through gold wire or soldering tin. In other embodiments, the chip can also be directly fixed on the dielectric board through the COB process through the bare crystal.

[0074] The dielectric board can be made of glass fiber board, ceramic board, resin board, composite board, bakelite board or Teflon board, or other boards suitable for high-frequency signal transmission; the pad can be copper-etched pad.

[0075] (2) The antenna is connected to the pad of the dielectric board by welding. In other embodiments, screw holes may also be provided at both ends of the dielectric board, and the antenna is connected to the pad of the dielectric board by screw connection.

[0076]Wherein, the antenna can be a copper braided wire, a spiral metal wire with a sprin...

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Abstract

The invention relates to the technical field of radio frequency identification and provides an electronic tag inlay, a processing method of the electronic tag inlay and an electronic tag. The electronic tag inlay comprises a dielectric slab, a chip, an antenna, a protective material and a protective sheath, wherein a bonding pad is arranged on the dielectric slab, the chip and the antenna are respectively connected with the dielectric slab to achieve electrical breakover of the chip and the antenna, the protective material is packaged in the dielectric slab and the chip, connected to the outside of the antenna on the dielectric slab and used for sealing the chip, the dielectric slab and a connecting position of the chip and the antenna and bearing external force impact, and the protective sheath is located outside the protective material, wraps the dielectric slab, the chip, the antenna and the protective material and is used for preventing an outside environment from interfering the chip, the dielectric slab and the connecting position of the chip and the antenna and enhancing the structural strength of the electronic tag inlay. The electronic tag inlay is reliable in structure, high in strength and capable of being bent or stretched.

Description

【Technical field】 [0001] The invention relates to the technical field of radio frequency identification, in particular to an electronic label inlay, a processing method of the electronic label inlay and the electronic label. 【Background technique】 [0002] Radio Frequency Identification (RFID) technology is an emerging short-distance wireless communication technology. Compared with barcodes and other identification technologies, RFID technology has many advantages such as fast scanning speed, high recognition rate, and strong anti-interference ability. It has been widely used in different industries. [0003] Electronic tags are the core of radio frequency identification technology, and are generally fixed on the identified object by adhesive or screws. Electronic tags are generally composed of four parts: chip, antenna, substrate and package shell. The chip is used to store information about objects, the antenna is used to receive and transmit microwave signals, and the su...

Claims

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Application Information

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IPC IPC(8): G06K19/077B23K1/00
Inventor 杨雪
Owner 杨雪
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