Electronic tag inlay, processing method of electronic tag inlay and electronic tag
An electronic label and processing method technology, applied in the field of radio frequency identification, to achieve the effect of high strength, simple production process, convenient and quick operation
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Example Embodiment
[0055] Example 1:
[0056] figure 1 with figure 2 Shown is an electronic tag inlay provided by Embodiment 1 of the present invention, which is composed of five parts: a dielectric board 10, a chip 20, an antenna, a protective material and a protective cover 40, in which:
[0057] There are pads on the dielectric board 10; the dielectric board 10 can be made of glass fiber board, ceramic board, resin board, composite board, bakelite board or Teflon board (ie PTFE board) or other materials suitable for high-frequency signal transmission Plate; pads can be copper etching pads;
[0058] The chip 20 and the antenna are respectively connected to the dielectric board to realize electrical conduction between the chip 20 and the antenna; in this embodiment, the antenna is a spiral metal wire with a spring structure (hereinafter referred to as a spring antenna 30), of course, other methods such as An antenna made of a metal structure with certain bending and stretching characteristics such ...
Example Embodiment
[0063] Example 2:
[0064] The electronic tag inlay provided in this embodiment also consists of five parts: a dielectric board, a chip, an antenna, a protective material, and a protective cover, among which:
[0065] There are pads on the dielectric board; the dielectric board can be made of glass fiber board, ceramic board, resin board, composite board, bakelite or Teflon board, or other boards suitable for high-frequency signal transmission; the pad can be made of copper Etching pad
[0066] The chip and the antenna are respectively connected to the dielectric board to realize electrical conduction between the chip and the antenna; in this embodiment, the antenna is a copper braided wire, and the copper braided wire includes two parts of equal length, which are respectively connected to both sides of the dielectric board, In this embodiment, the length of each part of the copper braided wire is about one-fourth of the wavelength of the radio frequency signal; the chip can be con...
Example Embodiment
[0071] Example 3:
[0072] This embodiment provides a method for processing an electronic tag inlay, which includes the following steps:
[0073] (1) The chip is connected to the pad of the dielectric board through a gold wire or solder in a package with pins. In other embodiments, the chip can also be directly fixed on the dielectric board through a bare die using a COB process.
[0074] The dielectric board can be made of glass fiber board, ceramic board, resin board, composite board, bakelite or Teflon board, or other boards suitable for high-frequency signal transmission; the pad can be copper etching pad.
[0075] (2) The antenna is connected to the pad of the dielectric board by welding. In other embodiments, screw vias may also be opened at both ends of the dielectric board, and the antenna is connected to the pad of the dielectric board by screw connection.
[0076] Among them, the antenna can be a copper braided wire, a spiral metal wire with a spring structure (hereinafter re...
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