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Silver-coated copper alloy powder and method for manufacturing same

A technology of copper alloy and powder, which is applied in the field of silver-coated copper alloy powder and its production, can solve the problems of high volume resistivity, copper powder storage stability (insufficient reliability, low conductivity, etc.), and achieve low volume resistivity Effect

Active Publication Date: 2014-09-24
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the silver-coated copper powder disclosed in Japanese Patent Laid-Open Nos. 2010-174311 and 2010-077495, if part of the surface of the copper powder is not coated with silver, oxidation of the copper powder starts from the part, which makes the coating Insufficient storage stability (reliability) of copper powder of silver
In the silver-coated copper alloy powder disclosed in Japanese Patent Laid-Open No. 08-311304 or 10-152630, there is a problem of having high volume resistivity (low electrical conductivity), which makes its storage stability (reliability) very low

Method used

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  • Silver-coated copper alloy powder and method for manufacturing same
  • Silver-coated copper alloy powder and method for manufacturing same
  • Silver-coated copper alloy powder and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The molten metal obtained by heating 7.2 kg of copper and 0.8 kg of nickel was rapidly cooled and solidified by spraying high-pressure water thereon while the molten metal dripped from the lower part of the refractory tank. The alloy powder thus obtained was filtered, washed with water, dried and crushed to obtain copper alloy powder (copper-nickel alloy powder).

[0034] Then, 61.9 g of dihydrate EDTA-2Na and 61.9 g of ammonium carbonate were dissolved in 720 g of pure water to prepare a solution (solution 1), and to 2097 g of pure water was dissolved 263.2 g of dihydrate EDTA-2Na and 526.4 A solution obtained by dissolving 87.7 g of silver nitrate in 271 g of pure water was added to a solution obtained by g of ammonium carbonate to prepare a solution (solution 2).

[0035] Then, under a nitrogen atmosphere, 130 g of the obtained copper-nickel alloy powder was added to Solution 1, and the temperature of the solution was raised to 35° C. while stirring the solution. Af...

Embodiment 2

[0062] Copper-nickel alloy powder coated with silver (copper alloy powder coated with silver) was obtained by the same method as in Example 1 using the same copper alloy powder (copper-nickel alloy powder) as in Example 1, except that , a solution prepared by dissolving 61.9 g of EDTA-2Na dihydrate and 61.9 g of ammonium carbonate in 720 g of pure water was used as solution 1, and by dissolving 307.1 g of EDTA-2Na dihydrate in 1223 g of pure water A solution prepared by dissolving 51.2 g of silver nitrate in 222 g of pure water was added to a solution prepared with 153.5 g of ammonium carbonate and used as solution 2.

[0063]For the silver-coated copper alloy powder thus obtained, the composition of the powder, the amount of silver coated therein, the average particle size thereof, and the electrical resistance of the pressed powder thereof were obtained by the same method as in Example 1, and by the same method as in Example 1 The storage stability (reliability) of the powde...

Embodiment 3

[0067] Copper-nickel alloy powder coated with silver (copper alloy powder coated with silver) was obtained by the same method as in Example 1 using the same copper alloy powder (copper-nickel alloy powder) as in Example 1, except that , a solution prepared by dissolving 19 g of EDTA-2Na dihydrate and 19 g of ammonium carbonate in 222 g of pure water was used as solution 1, and by dissolving 252 g of EDTA-2Na dihydrate and 126 g of ammonium carbonate in 1004 g of pure water To the prepared solution was added a solution prepared by dissolving 42 g of silver nitrate in 100 g of pure water was used as solution 2.

[0068] For the silver-coated copper alloy powder thus obtained, the composition of the powder, the amount of silver coated therein, the average particle size thereof, and the electrical resistance of the pressed powder thereof were obtained by the same method as in Example 1, and by the same method as in Example 1 The storage stability (reliability) of the powder was ev...

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Abstract

A copper alloy powder (preferably a copper alloy powder in which the cumulative 50% particle diameter (D50 diameter) measured using a laser diffraction granularity distribution device is 0.1-15 mum) containing at least one of zinc and nickel at 1-50 mass% with the remainder composed of copper and unavoidable impurities is covered by a layer containing 7-50 mass% silver, preferably a layer made from silver or a silver compound, whereby a silver-coated copper alloy powder having a low volume resistance and an excellent storage stability (reliability) is manufactured.

Description

technical field [0001] The present invention generally relates to silver-coated copper alloy powders and methods for their production. More specifically, the present invention relates to a silver-coated copper alloy powder for use in conductive pastes and the like, and a production method thereof. Background technique [0002] Conductive pastes prepared by mixing or compounding solvents, resins, dispersants and the like with conductive metal powders such as silver powders or copper powders are used to form electrodes and wires of electronic components by a printing method or the like. [0003] Although silver is a good conductive material with very low volume resistivity, however, since it is a noble metal, silver powder adds to the cost of the paste. On the other hand, although copper is a good conductive material with low volume resistivity, the storage stability (reliability) of copper powder is lower than that of silver powder because it is easily oxidized. [0004] In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00B22F9/08C22C9/00C22C9/04C22C9/06H01B1/22H01B5/00H01B5/14H01B13/00B22F1/05B22F1/107B22F1/17
CPCB22F1/025H01B13/00C22C9/06H01B1/026C22C1/0425B22F9/08C22C9/04B22F1/0011H01B5/14C22C5/06H01B1/22H01B5/00Y10T428/2991B22F9/082B22F1/05B22F1/107B22F1/17
Inventor 井上健一尾木孝造江原厚志桧山优斗山田雄大上山俊彦
Owner DOWA ELECTRONICS MATERIALS CO LTD
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