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Treating method and electric flocculation device for Cu-EDTA complex wastewater

A treatment method and electro-flocculation technology, applied in the environmental field, can solve the problems of unsatisfactory treatment effect of Cu-EDTA complex wastewater, and achieve the effects of high degree of automation, high mineralization rate and environmental protection cost.

Active Publication Date: 2014-10-01
HUNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the chemical precipitation method and the biological method are not ideal for the treatment of Cu-EDTA complex wastewater.

Method used

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  • Treating method and electric flocculation device for Cu-EDTA complex wastewater
  • Treating method and electric flocculation device for Cu-EDTA complex wastewater
  • Treating method and electric flocculation device for Cu-EDTA complex wastewater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] see figure 1 : An electroflocculation device includes a power supply 1, a relay 2, an electrode 3, a reaction tank 4, a mixing tank 5, a peristaltic pump 6, and an air pump 8. One end of the electrode 3 is connected to the power supply 1 through the relay 2, and the other end of the electrode 3 Set in the reaction tank 4, the mixing tank 5 is arranged side by side on the side of the reaction tank 4. The reaction tank 4 and the mixing tank 5 are filled with Cu-EDTA complex wastewater, and the exchange of the Cu-EDTA complex wastewater between the reaction tank 4 and the mixing tank 5 is realized through the peristaltic pump 6 . Preferably, the bottom of the mixing tank 5 is provided with a magnetic stirrer 7 to realize rapid mixing of Cu-EDTA complex wastewater.

[0062] The air pump 8 is arranged outside the reaction tank 4, and air is passed into the bottom of the reaction tank 4 through the air pipe. Preferably, a flow meter 9 for detecting air flow is provided betw...

Embodiment 2

[0068] A method for treating Cu-EDTA complex wastewater by using an aluminum-iron electrode combined with electrocoagulation:

[0069] 1) Cu-EDTA complex wastewater, wherein the copper ion content is 50mg / L, the COD concentration content is 200mg / L, and the pH value is adjusted to 3.01 with hydrochloric acid;

[0070] 2) Using the preferred electroflocculation device in Example 1, adjust the distance between two adjacent electrodes among the first aluminum electrode 311 , the first iron electrode 321 , the second aluminum electrode 312 , and the second iron electrode 322 to be 15 mm. Be that the sodium chloride solution of 0.75g / L is electrolytic solution with concentration, put electrolytic solution in the reaction tank 4 of aforementioned electrocoagulation device, then add the Cu-EDTA complexation of 2.5L step (1) in reaction tank 4 For waste water, mix Cu-EDTA complex waste water and electrolyte to obtain a mixed solution. The first aluminum electrode 311, the first iron e...

Embodiment 3

[0074] 1) Take Cu-EDTA complex wastewater, wherein the copper ion content is 50mg / L, the COD concentration content is 200mg / L, and the pH value is adjusted to 3.00 with hydrochloric acid;

[0075]2) Using the preferred electroflocculation device in Example 1, adjust the distance between two adjacent electrodes in the first aluminum electrode 311 , the first iron electrode 321 , the second aluminum electrode 312 , and the second iron electrode 322 to be 10 mm. Be that the sodium chloride solution of concentration 0.5g / L is electrolytic solution, electrolytic solution is put into the reaction tank 4 of aforementioned electrocoagulation device, then add the Cu-EDTA complexation of 2.5L step (1) in reaction tank 4 For waste water, mix Cu-EDTA complex waste water and electrolyte to obtain a mixed solution. The first aluminum electrode 311, the first iron electrode 321, the second aluminum electrode 312, and the second iron electrode 322 are all immersed in the mixed solution. Then ...

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Abstract

The invention provides a treating method and electric flocculation device for Cu-EDTA complex wastewater. The treating method comprises the following steps: placing the Cu-EDTA complex wastewater into a reaction tank for 30 to 50 minutes of electric flocculation reaction, wherein an aluminum electrode is taken as the anode, and an iron electrode is taken as the cathode; changing the current direction by taking the aluminum electrode as the anode while taking the iron electrode as the cathode, and carrying out electric flocculation reaction for 30 to 50 minutes, so as to fulfill treatment of the Cu-EDTA complex wastewater. The electric flocculation device comprises a power supply, a relay, the electrodes and the reaction tank, wherein the electrodes comprise the aluminum electrode and the iron electrode; one ends of the aluminum electrode and the iron electrode are connected in series with the power supply through the relay; the other ends of the aluminum electrode and the iron electrode are arranged in the reaction tank. The Cu-EDTA complex wastewater is treated due to the cooperation of the aluminum electrode and the iron electrode without addition of chemical agents and adsorbents. The method has the advantages that the operation is simple; the treating cost is low; the removal rates of copper ions and COD are high.

Description

technical field [0001] The invention relates to the field of environmental technology, in particular to a method for treating Cu-EDTA complex wastewater, and also relates to an electrocoagulation device applied to the aforementioned treatment method. Background technique [0002] In the high-speed information society, people's life is inseparable from electronic products such as mobile phones and computers, and the production of these electronic products cannot be separated from printed circuit boards (PCB). The printed circuit board is the basis of the electronics industry and is an interconnection mainly used for the connection of electronic components. An important part of almost all electronic products includes printed circuit boards, which are widely used in communication equipment, measurement and control instruments, household electronic appliances, computers and components. In order to improve the quality of products, the types and quantities of electroplating addit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/06C02F1/463
Inventor 谭竹杨朝晖徐海音宋佩佩汪理科
Owner HUNAN UNIV
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