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a fv 0 Preparation method of high-grade flame-retardant paper-based copper-clad laminate

A copper-clad laminate and flame-retardant technology, which is applied in the field of preparation of Fv0 flame-retardant paper-based copper-clad laminates, can solve the problems of unsatisfactory market demand, long tung oil production cycle, and limited resources, so as to achieve rich production capacity and output, Improve the nitrogen-phosphorus synergistic flame retardant effect and the effect of product quality stability

Active Publication Date: 2016-07-06
SHANDONG JINBAO ELECTRONICS
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] However, the production cycle of tung oil is long, the output and quality are greatly affected by climate, season, and region, and the number of resources is very limited. With the development of the copper clad laminate industry, the demand for tung oil is increasing year by year, and the output of tung oil in my country can no longer meet the market demand. As a result, the imbalance between supply and demand, and the rising price of tung oil have brought great pressure to domestic manufacturers of flame-retardant paper-based copper-clad laminates.
At the same time, the use of tung oil can only use nitrogen-containing phenolic resin with a nitrogen content below 4% to finally produce a flame-retardant copper clad laminate. The reduction in nitrogen content will inevitably increase the use of flame retardant tetrabromobisphenol A. , but the large-scale use of tetrabromobisphenol A will produce harmful carcinogens such as dioxin, which will pollute the environment, and the high price of tetrabromobisphenol A will also increase a lot of production costs

Method used

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  • a fv  <sub>0</sub> Preparation method of high-grade flame-retardant paper-based copper-clad laminate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] a Fv 0 The preparation method of grade flame-retardant paper-based copper-clad laminate, the steps are as follows:

[0030] (1) Preparation of nitrogen-containing phenolic resin solution

[0031] Put 20g of phenol, 90g of melamine and 200g of formaldehyde into the reaction kettle in turn, add 4g of 10% sodium hydroxide aqueous solution, react at 80°C for 70min, control the water mixing degree to 300%, add 45g of 98% methanol , cooled to 25°C to obtain a nitrogen-containing phenolic resin solution for storage, wherein nitrogen accounts for 8% of the total weight of the pure nitrogen-containing phenolic resin solution;

[0032] (2) Preparation of epoxy soybean oil modified phenolic resin solution

[0033] Put 150g of phenol, 80g of epoxidized soybean oil and 0.5g of dicyandiamide into the reactor in turn, react at 100°C for 90min, then put 200g of formaldehyde and 30g of the nitrogen-containing phenolic resin solution prepared in step (1) into the reactor In the proces...

Embodiment 2

[0041] a Fv 0 The preparation method of grade flame-retardant paper-based copper-clad laminate, the steps are as follows:

[0042] (1) Preparation of nitrogen-containing phenolic resin solution

[0043] Put 20g of phenol, 130g of melamine and 300g of formaldehyde into the reaction kettle in turn, add 5g of 10% sodium hydroxide aqueous solution, react at 90°C for 50min, control the water mixing degree to 500%, add 60g of 98% methanol , cooled to 40° C. to obtain a nitrogen-containing phenolic resin solution for storage, wherein nitrogen accounts for 9% of the total weight of the nitrogen-containing phenolic resin solution;

[0044] (2) Preparation of epoxy soybean oil modified phenolic resin solution

[0045]Put 240g of phenol, 120g of epoxidized soybean oil and 3g of m-phenylenediamine into the reactor in turn, react at 120°C for 60min, then put 300g of formaldehyde and 50g of the nitrogen-containing phenolic resin solution prepared in step (1) into the reactor In the proce...

Embodiment 3

[0053] a Fv 0 The preparation method of grade flame-retardant paper-based copper-clad laminate, the steps are as follows:

[0054] (1) Preparation of nitrogen-containing phenolic resin solution

[0055] Put 20kg of phenol, 110kg of melamine and 260kg of formaldehyde into the reaction kettle in sequence, add 4.5kg of 10% sodium hydroxide aqueous solution, react at 85°C for 60min, control the water mixing degree to 400%, add 50kg of 98% sodium hydroxide solution Methanol is cooled to 30° C. to obtain a nitrogen-containing phenolic resin solution for storage, wherein nitrogen accounts for 10% of the total weight of the nitrogen-containing phenolic resin solution;

[0056] (2) Preparation of epoxy soybean oil modified phenolic resin solution

[0057] 200kg of phenol, 100kg of epoxidized soybean oil and 2kg of 4,4-diaminodiphenylmethane were put into the reactor successively, and reacted at 110°C for 80min, then 240kg of formaldehyde, 40kg of the nitrogen-containing phenolic alde...

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Abstract

The invention belongs to the technical field of production of copper clad laminates, and in particular relates to a 0 The preparation method of the flame-retardant paper-based copper-clad laminate of the first grade is to put phenol, epoxy soybean oil and amine catalysts into the reaction kettle in turn, react at high temperature, and then put formaldehyde and nitrogen-containing phenolic resin into the reaction kettle to obtain epoxy resin. Soybean oil modified phenolic resin, the impregnated resin obtained by adding organic flame retardants is dipped and coated on wood pulp paper to obtain impregnated sheets, and several sheets are superimposed to make flame-retardant paper-based copper-clad laminates, and the flame-retardant reaches Fv 0 class. The present invention adopts epoxidized soybean oil to replace tung oil, the product quality is stable and the price is low, the nitrogen content in the nitrogen-containing phenolic resin is increased, and the nitrogen-phosphorus synergistic flame-retardant effect of the copper-clad laminate is improved, thereby reducing the formation of tetrabromobisphenol A in flame-retardant dioxin, saving and environmental protection; the quality of the plate produced by the invention is improved, and it has the advantages of low water absorption, better punching property, better solder resistance, etc., and has a better appearance color.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminate production, and in particular relates to a Fv 0 A method for preparing a flame-retardant paper-based copper-clad laminate. Background technique [0002] Copper clad laminate is an important material in the printed circuit board industry. Fv 0 When making printed circuit boards, copper-clad laminates, the grade flame-retardant paper base material, have the advantages of flame retardancy, punching performance, excellent drilling processability and low price, so they are widely used in printed circuit boards of civilian electronic devices. . [0003] Currently, Fv 0 The preparation of high-grade flame-retardant paper-based copper-clad laminates mostly uses dry oil (mainly tung oil) to modify the phenolic resin, and then adds flame retardants (tetrabromobisphenol A, triphenyl phosphate, etc.) to the tung oil-modified phenolic resin. ester) solution at room temperature, prepared as a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/04B32B27/42B32B29/00B32B15/098C08G14/12
Inventor 陈晓鹏陈长浩秦雪芹杨江波赵东王天堂姜晓亮朱义刚李洪学尹瑞权
Owner SHANDONG JINBAO ELECTRONICS