Ultrasonic polishing method and polishing device using liquid to transmit megahertz vibration

Abstract

The invention provides an ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid, and relates to polishing methods and devices. According to the method, the vibration is transmitted through a flexible coupling agent, and the high-frequency ultrasonic vibration of a vibrator is transmitted to a vibration polishing tool; the vibration polishing tool independent of overall modal analysis and modal design is obtained. The method is applied to the field of silicon wafer polishing, the ultrasonic polishing device for transmitting the megahertz-level vibration through the liquid is designed, appropriate-frequency alternating voltage excitation is applied to a piezoelectric ceramic piece on the vibrator, the vibrator resonates in the designed mode, the high-frequency vibration is transmitted to the vibration polishing tool through the coupling agent, and finally megahertz-level sound is transmitted to the polishing liquid, so that particles of the polishing liquid come into play effectively, and a polished wafer has a complete surface lattice, ultrahigh surface precision and ultralow roughness. According to the method for transmitting the vibration through the liquid, vibration addition has higher flexibility, and the vibration utilization range is widened.

Description

technical field [0001] The invention relates to an ultrasonic polishing method and a device thereof, in particular to an ultrasonic polishing method and a polishing device thereof which utilize liquid to transmit megahertz-level vibrations. Background technique [0002] Ultra-precision machining is the basis for the development of modern high-tech industries and science and technology. As one of the important fields of ultra-precision machining, ultra-precision polishing is a processing method that uses the mechanical and chemical effects of fine abrasive grains to obtain smooth or ultra-smooth surface quality. . In recent years, for precision chemical mechanical polishing of brittle and hard materials such as silicon wafers, adding ultrasonic vibration to assist polishing has become a hot research issue. The traditional methods of ultrasonic vibration addition are vibration polishing tools that rely on overall modal analysis and modal design. Vibration loading plays a cert...

AI Technical Summary

Problems solved by technology

The traditional methods of ultrasonic vibration addition are vibration polishing tools that rely on overall modal analysis and modal design. Vibration loading plays a certain role, but this method of addition has great limitations. When external conditions change, It is very likely to cause a change in the resonance frequency, and it is difficult to ensure that the vibrator is always working in a good resonance mode

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