Ultrasonic polishing method and polishing device using liquid to transmit megahertz vibration

A technology of vibration polishing and liquid transfer, applied in the field of ultrasonic polishing methods and polishing devices, which can solve problems such as changes in resonance frequency, achieve strong vibration absorption characteristics, strong penetrating ability, and expand the range of vibration utilization

Inactive Publication Date: 2017-01-18
LIAONING UNIVERSITY OF TECHNOLOGY
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional methods of ultrasonic vibration addition are vibration polishing tools that rely on overall modal analysis and modal design. Vibration loading plays a certain role, but this method of addition has great limitations. When external conditions change, It is very likely to cause a change in the resonance frequency, and it is difficult to ensure that the vibrator is always working in a good resonance mode

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic polishing method and polishing device using liquid to transmit megahertz vibration
  • Ultrasonic polishing method and polishing device using liquid to transmit megahertz vibration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] The ultrasonic polishing device that uses liquid to transmit megahertz vibration is composed of two parts: the ultrasonic vibration additional system and the polishing machine system. The vibration additional system includes three assemblies: vibrator and sealing device, coupling agent and vibration polishing tool. It consists of six parts (see figure 1 ); the polishing machine system is composed of the object to be polished (silicon wafer), polishing liquid, polishing pad, and polishing disc (see figure 2 ).

[0027] In the figure: 1-screw; 2-upper piece of compression device; 3-lower piece of compression device; 4-electric wire; 5-sealing ring; 6-disc piezoelectric vibrator; 7-horizontal cantilever support; 8-coupling agent; 9-vibration polishing tool; 10-silicon wafer; 11-polishing pad; 12-polishing liquid; 13-polishing disk.

[0028]The working surface of the disc piezoelectric vibrator of the present invention is immersed in the liquid environment. In order to p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid, and relates to polishing methods and devices. According to the method, the vibration is transmitted through a flexible coupling agent, and the high-frequency ultrasonic vibration of a vibrator is transmitted to a vibration polishing tool; the vibration polishing tool independent of overall modal analysis and modal design is obtained. The method is applied to the field of silicon wafer polishing, the ultrasonic polishing device for transmitting the megahertz-level vibration through the liquid is designed, appropriate-frequency alternating voltage excitation is applied to a piezoelectric ceramic piece on the vibrator, the vibrator resonates in the designed mode, the high-frequency vibration is transmitted to the vibration polishing tool through the coupling agent, and finally megahertz-level sound is transmitted to the polishing liquid, so that particles of the polishing liquid come into play effectively, and a polished wafer has a complete surface lattice, ultrahigh surface precision and ultralow roughness. According to the method for transmitting the vibration through the liquid, vibration addition has higher flexibility, and the vibration utilization range is widened.

Description

technical field [0001] The invention relates to an ultrasonic polishing method and a device thereof, in particular to an ultrasonic polishing method and a polishing device thereof which utilize liquid to transmit megahertz-level vibrations. Background technique [0002] Ultra-precision machining is the basis for the development of modern high-tech industries and science and technology. As one of the important fields of ultra-precision machining, ultra-precision polishing is a processing method that uses the mechanical and chemical effects of fine abrasive grains to obtain smooth or ultra-smooth surface quality. . In recent years, for precision chemical mechanical polishing of brittle and hard materials such as silicon wafers, adding ultrasonic vibration to assist polishing has become a hot research issue. The traditional methods of ultrasonic vibration addition are vibration polishing tools that rely on overall modal analysis and modal design. Vibration loading plays a cert...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04
CPCB24B1/04
Inventor 何勍张玉成
Owner LIAONING UNIVERSITY OF TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap