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Staggered complex micro-channel miniature heat exchanger

A technology of micro-channel and heat exchanger, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., to achieve the effects of improving uniformity, increasing heat exchange effect, and facilitating installation and integration

Active Publication Date: 2014-11-26
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a micro heat exchanger, which is used to solve the problems of effective heat dissipation of high heat flux density electronic chips, uniformity of chip temperature distribution and thermal matching between heat exchanger and chip, and provide reliable temperature for the operation of the chip. surroundings

Method used

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Embodiment 1

[0045] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue in the development of chips. The misplaced fan-shaped groove microchannel micro heat exchanger is composed of a substrate 2 and an encapsulation sheet 1 with complex channels, see figure 1 and figure 2 . The substrate is made of silicon, the package is made of glass, and the working medium is deionized water. Because the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After optimization of microelectronics circuit design, the platinum heating film can generate heat evenly to simulate the heat dissipation of electronic chips. The input voltage of platinum heating film is determined according to the heat production of the chip. ...

Embodiment 2

[0051] The present invention will be further described below in conjunction with the accompanying drawings and the application of the misplaced triangular groove microchannel micro heat exchanger in the heat dissipation of electronic chips:

[0052] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue in the development of chips. The misplaced triangular groove microchannel micro heat exchanger is composed of a substrate 2 and an encapsulation sheet 1 with complex channels. See figure 1 and figure 2 . The substrate is made of silicon, the package is made of glass, and the working medium is deionized water. Because the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After optimization ...

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Abstract

A staggered complicated micro-channel miniature heat exchanger belongs to the technical field of microelectronic heat exchangers. The staggered complex micro-channel miniature heat exchanger includes a packaging sheet (1) formed by packaging, and a substrate (2); the packaging sheet is provided with a fluid inlet (3) and a fluid outlet (4) which are connected with an external pipeline; and staggered complex micro channels (5), a liquid storage groove (6) at the inlet and a liquid storage groove (7) at the outlet are etched on the front side of the substrate. The device satisfies a heat radiation requirement of a large power electronic chip, and makes up the defects that application of an efficient metal micro-radiator is limited since the thermal expansion coefficient thereof is not matched with that of the electronic chip, and temperature distribution of a cooled surface (i.e., the electronic chip) is nonuniform.

Description

technical field [0001] The invention belongs to the technical field of microelectronic heat exchangers, and relates to a cooling device, in particular to a micro heat exchanger with dislocation complex microchannels. Background technique [0002] The development of microelectronics technology has greatly promoted the rapid development of computer technology, aerospace technology and electronic devices. The core device chips of electronic products are developing towards high integration, high frequency, high speed and miniaturization, which leads to a sharp increase in the power density of chips according to Moore's law. For microelectronic chips with high thermal load sensitivity: traditional coolers can no longer effectively take away the heat generated by the chip, and the accumulation of heat at the chip will cause the temperature of the chip to rise and the temperature distribution of the chip to be uneven. Affect the working state and stability of the chip, and even da...

Claims

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Application Information

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IPC IPC(8): H01L23/473
Inventor 夏国栋马丹丹翟玉玲蒋静李云飞
Owner BEIJING UNIV OF TECH
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