Staggered complex micro-channel miniature heat exchanger
A technology of micro-channel and heat exchanger, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., to achieve the effects of improving uniformity, increasing heat exchange effect, and facilitating installation and integration
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[0044] Example 1
[0045] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue for chip development. The misaligned sector-shaped groove micro-channel micro heat exchanger is composed of a complex channel substrate 2 and a package sheet 1, see figure 1 with figure 2 . The substrate is silicon, the packaging sheet is glass, and the working medium is deionized water. Since the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After microelectronic circuit design optimization, the platinum heating film can uniformly generate heat to simulate the heat dissipation of the electronic chip. The input voltage of the platinum heating film is determined according to the heat production of the chip.
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[0050] Example 2
[0051] The present invention will be further described below in conjunction with the accompanying drawings and the application of the micro-channel micro heat exchanger with staggered triangular grooves in the heat dissipation of electronic chips:
[0052] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue for chip development. The micro-channel micro heat exchanger with misplaced triangular grooves is composed of a substrate 2 containing complex channels and a packaging sheet 1 see figure 1 with figure 2 . The substrate is silicon, the packaging sheet is glass, and the working medium is deionized water. Since the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After th...
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