Preparation method of polytetrafluoroethylene (PTFE) composite dielectric substrate

A composite medium and substrate technology, which is applied in the field of preparation of PTFE composite medium substrates for microwave circuits, can solve the problems of inability to guarantee complete removal of organic additives and moisture, complicated process flow, and high manufacturing costs, and is suitable for batch and large-scale production. Production, excellent comprehensive performance, easy coating and molding effect

Active Publication Date: 2014-12-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can reduce the voids and water absorption of the substrate, it also has the disadvantages of complicated process and high manufacturing cost.
[0007] In the existing preparation methods of PTFE composite dielectric substrates without reinforcement materials, there are defects such as complex process flow and low efficiency, and there are many kinds of organic additives in the fluororesin emulsion. In the process of removing organic additives, generally Long time (over 4h) high temperature (over 200°C) treatment is required, especially in systems containing fillers. After high temperature baking, the resin composition is easy to agglomerate and agglomerate. In addition, the residues of organic additives and moisture have a great influence on the performance of the substrate, especially the dielectric properties

Method used

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  • Preparation method of polytetrafluoroethylene (PTFE) composite dielectric substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] PTFE resin emulsion, particle size 0.25 μm, resin content 55wt%, produced by Japan Daikin Company, brand: D210C.

[0039] Inorganic filler: silicon micropowder, particle size about 1.5 μm, Sibelco Co., Ltd., brand name: MEGASIL525.

[0040] Thickener: polyoxyethylene distyrenated phenyl ether, Kao Corporation, brand name EMULGEN A-60.

[0041] Take 454.5g of the above-mentioned PTFE resin emulsion, add 250g of silicon micropowder, 4.0g of thickener, and carry out high-speed stirring and mixing for 2 hours. The viscosity of the test glue is 420mPa.s, and the viscosity is within the normal range.

[0042] The above-mentioned glue solution was coated on the surface of the copper foil with a coating machine, and a resin layer with a thickness of 255 μm was coated to obtain the glue-coated copper foil.

[0043]Put the coated copper foil in a vacuum oven at 100°C, bake for 1 hour to remove water, bake at 250°C for 1 hour to remove organic additives, bake at 350°C for 10 minu...

Embodiment 2

[0046] PTFE resin emulsion, particle size 0.25 μm, resin content 55wt%, produced by Japan Daikin Company, brand: D210C.

[0047] Inorganic filler: silicon micropowder, particle size about 1.5 μm, Sibelco Co., Ltd., brand name: MEGASIL525.

[0048] Thickener: polyoxyethylene distyrenated phenyl ether, Kao Corporation, brand name EMULGEN A-60.

[0049] Take 454.5g of the above-mentioned PTFE resin emulsion, add 250g of silicon micropowder, 4.0g of thickener, and carry out high-speed stirring and mixing for 2 hours. The viscosity of the test glue is 420mPa.s, and the viscosity is within the normal range.

[0050] The above-mentioned glue solution was coated on the surface of the copper foil with a coating machine, and a resin layer with a thickness of 104 μm was coated to obtain a glue-coated copper foil.

[0051] Put the coated copper foil in a vacuum oven at 100°C, bake for 1 hour to remove water, bake at 250°C for 1 hour to remove organic additives, bake at 350°C for 10 minut...

Embodiment 3

[0054] PTFE resin emulsion, particle size 0.25 μm, resin content 55wt%, produced by Japan Daikin Company, brand: D210C.

[0055] Inorganic filler: silicon micropowder, particle size about 1.5 μm, Sibelco Co., Ltd., brand: MEGASIL525; titanium dioxide, particle size about 0.25 μm, American Huntsman Company, brand: TR-28.

[0056] Thickener: polyoxyethylene distyrenated phenyl ether, Kao Corporation, brand name EMULGEN A-60.

[0057] Take 318g of the above-mentioned PTFE resin emulsion, add 60g of silica powder, 265g of titanium dioxide, and 5.2g of thickener for high-speed stirring and mixing for 2 hours. The viscosity of the test glue is 550mPa.s, which is within the normal range.

[0058] The above-mentioned glue solution was coated on the surface of the copper foil with a coating machine, and a resin layer with a thickness of 206 μm was coated to obtain a glue-coated copper foil.

[0059] Put the coated copper foil in a vacuum oven at 100°C, bake for 1 hour to remove water,...

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Abstract

The invention relates to the field of a high-frequency copper-clad plate of a polytetrafluoroethylene (PTFE) dielectric substrate, and in particular relates to a preparation method of a polytetrafluoroethylene (PTFE) composite dielectric substrate used for a microwave circuit. The method comprises the steps of firstly, mixing fluororesin emulsion, inorganic filler and a thickening agent to prepare stable and uniform dispersion liquid; after that, enabling a release type base material to be coated with the dispersion liquid, and then baking; after baking, carrying out release type separation on a resin layer and the base material; cutting and overlapping the separated resin layer according to the thickness and the size of the substrate; covering the two sides of the resin layer with copper foils, and carrying out high-temperature lamination sintering to obtain the PTFE composite dielectric substrate covered by the copper foils at the double sides. After the preparation method is used, the formation of a hole in the composite dielectric substrate and the residue of an organic auxiliary agent are effectively reduced; the preparation method has the advantages of being simple and convenient in technology, beneficial to large scale production, etc.

Description

technical field [0001] The invention relates to the field of high-frequency copper-clad laminates for PTFE dielectric substrates, in particular to a method for preparing a microwave circuit PTFE composite dielectric substrate. Background technique [0002] With the gradual development of electronic information products towards high frequency and high speed. Traditional FR-4 substrate materials will be gradually replaced by high-speed, high-frequency and high-reliability substrate materials. In recent years, scientific and technological workers have conducted in-depth research on the selection and performance of high-frequency and high-speed substrate materials, aiming to find substrate materials with excellent dielectric, mechanical and thermal properties to meet the requirements of actual use. [0003] Since the commercial production of polytetrafluoroethylene (PTFE) by DuPont in 1945, due to the unique physical and chemical properties of the material, people have continuo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B37/06B32B37/10B32B15/082B32B27/18
Inventor 邓华阳江恩伟
Owner GUANGDONG SHENGYI SCI TECH
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