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Anti-fracturing solid wood composite board and processing method thereof

A processing method, solid wood composite technology, applied in the field of wood processing, can solve problems such as cracks, and achieve the effect of simple and easy processing method

Inactive Publication Date: 2014-12-10
濮亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the base material is solid wood or solid wood composite board, the thermal expansion coefficient of the surface layer resin after being hot-compressed by a press is very different from that of wood, and cracks often appear after a period of use, especially in use. The phenomenon of cracking is particularly obvious in places with large environmental temperature differences, such as the dry and geothermal environment in the north

Method used

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  • Anti-fracturing solid wood composite board and processing method thereof
  • Anti-fracturing solid wood composite board and processing method thereof
  • Anti-fracturing solid wood composite board and processing method thereof

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Embodiment Construction

[0027] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0028] Combine below figure 1 Embodiments of the present invention will be described in detail.

[0029] figure 1 A schematic structural diagram of Embodiment 1 of the present invention is shown. Such as figure 1 As shown, the present invention provides a kind of anti-cracking solid wood composite board, on the substrate, there are impregnated decorative pattern layer, non-impregnated dry paper layer and impregnated decorative pattern layer sequentially from top to bottom, unimpregnated The dry paper layer and the upper and lower impregnated layers form a crack-resistant fiber cushion. Place the substrate on the lower template of the press, and place the above-mentioned fiber buffer layer on the substrate. The temperature of the upper and lower ...

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Abstract

The invention provides an anti-fracturing solid wood composite board and a processing method thereof. At least one non-impregnated fiber layer is arranged on a base material, the upper face and the lower face of the non-impregnated fiber layer are respectively provided with at least one impregnated layer, the non-impregnated fiber layer, the upper impregnated layer and the lower impregnated layer form an anti-fracturing fiber buffering layer, and the fiber buffering layer and the base material are composited in a hot-press mode to form the anti-fracturing solid wood composite board. The anti-fracturing solid wood composite board has the advantages that the fracturing phenomenon caused by different expansion factors is avoided, and surface resin can not fracture due to expansion or shrinkage of the base material; production cost is not increased, the processing method is simple and practical, and the anti-fracturing solid wood composite board can be suitable for industrial mass production.

Description

technical field [0001] The invention relates to the field of wood processing, in particular to a crack-resistant solid wood composite board and a processing method thereof. Background technique [0002] In the prior art, the solid wood composite board is usually made by laying decorative pattern paper directly on the surface of the substrate after impregnation, or adding impregnated wear-resistant paper, or impregnating surface paper, and directly sending it into a press for hot pressing and compounding. However, since the base material is solid wood or solid wood composite board, the thermal expansion coefficient of the surface layer resin after being hot-compressed by a press is very different from that of wood, and cracks often appear after a period of use, especially in use. The phenomenon of cracking is particularly obvious in places with large environmental temperature differences, such as the dry and geothermal environment in the north. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27D1/00B32B21/10B32B17/04B32B27/04B32B7/12B32B37/06B32B37/10B32B37/12
Inventor 濮亮
Owner 濮亮
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