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Thermosetting chip bonding film, chip bonding film with cutting disc, and manufacturing method of semiconductor device

A die-bonding film, thermosetting technology, applied in film/sheet adhesive, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of semiconductor chip tilt, semiconductor chip damage, low thermal conductivity, etc.

Inactive Publication Date: 2014-12-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when trying to bond such a semiconductor chip with a paste-like adhesive, various manufacturing problems may occur: the semiconductor chip is damaged due to the thinness of the semiconductor chip, or there is a crack on the circuit surface of the semiconductor chip. Adhesive entrapment, semiconductor chip tilt, etc.
However, conventional die-bonding films have room for improvement in terms of low thermal conductivity compared to silver pastes

Method used

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  • Thermosetting chip bonding film, chip bonding film with cutting disc, and manufacturing method of semiconductor device
  • Thermosetting chip bonding film, chip bonding film with cutting disc, and manufacturing method of semiconductor device
  • Thermosetting chip bonding film, chip bonding film with cutting disc, and manufacturing method of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0431]

[0432] The following (a) to (f) were dissolved in MEK (methyl ethyl ketone), and the concentration was adjusted so that the viscosity would be 150 mPa·s at room temperature to obtain an adhesive composition solution.

[0433] (a) Epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: JER827 (bisphenol A epoxy resin), liquid at room temperature (softening point: 25° C. or less))

[0434] 9.5 servings

[0435] (b) Phenolic resin (phenolic resin having a biphenyl aralkyl skeleton, manufactured by Meiwa Kasei Co., Ltd., product name: MEH-7851SS, softening point 67° C., hydroxyl equivalent 203 g / eq.)

[0436] 9.5 servings

[0437] (c) Acrylic copolymer (manufactured by Nagase ChemteX Corporation, product name: TEISANRESIN SG-P3, weight average molecular weight: 850,000, glass transition temperature: 12° C.)

[0438] 1 copy

[0439] (d) Curing accelerator catalyst (manufactured by Hokko Chemical Co.,...

Embodiment 2

[0450]

[0451] The following (a) to (f) were dissolved in MEK (methyl ethyl ketone), and the concentration was adjusted so that the viscosity would be 150 mPa·s at room temperature to obtain an adhesive composition solution.

[0452] (a) Epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: JER827 (bisphenol A epoxy resin), liquid at room temperature (softening point: 25° C. or less))

[0453] 6.5 servings

[0454] (b) Phenolic resin (phenolic resin having a biphenyl aralkyl skeleton, manufactured by Meiwa Kasei Co., Ltd., product name: MEH-7851SS, softening point 67° C., hydroxyl equivalent 203 g / eq.)

[0455] 7 copies

[0456] (c) Acrylic copolymer (manufactured by Nagase ChemteX Corporation, product name: TEISANRESIN SG-P3, weight average molecular weight: 850,000, glass transition temperature: 12° C.)

[0457] 1.5 servings

[0458] (d) Curing accelerator catalyst (manufactured by Hokko Chemical Co...

Embodiment 3

[0507]

[0508] The following (a) to (f) were dissolved in MEK (methyl ethyl ketone), and the concentration was adjusted so that the viscosity would be 150 mPa·s at room temperature to obtain an adhesive composition solution.

[0509] (a) Epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: JER827 (bisphenol A epoxy resin), liquid at room temperature (softening point: 25° C. or less))

[0510] 9.5 servings

[0511] (b) Phenolic resin (phenolic resin having a biphenyl aralkyl skeleton, manufactured by Meiwa Kasei Co., Ltd., product name: MEH-7851SS, softening point 67° C., hydroxyl equivalent 203 g / eq.)

[0512] 9.5 servings

[0513] (c) Acrylic copolymer (manufactured by Nagase ChemteX Corporation, product name: TEISANRESIN SG-P3, weight average molecular weight: 850,000, glass transition temperature: 12° C.)

[0514] 1 copy

[0515] (d) Curing accelerator catalyst (manufactured by Hokko Chemical Co...

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Abstract

The invention provides a thermosetting chip bonding film, a chip bonding film with a cutting disc, and a manufacturing method of a semiconductor device. The thermosetting chip bonding film is advantaged by high heat conductivity, and can be fully attached to the concave and convex shape of an adherend when attached to the adherend. The heat conductivity coefficient of the thermosetting chip bonding film is above 1W / mK after being thermosured, the thermosetting chip bonding film contains heat conductive particles with the heat conductivity coefficient of 12W / mK and above 75% of the integral weight relative to the thermosetting chip bonding film, and the detected melt viscosity of the thermosetting chip bonding film is below 200 PaS with the cutting rate of 50 sec-1 at a temperature of 130 DEG C.

Description

technical field [0001] The present invention relates to a method for manufacturing a thermosetting die-bonding film, a die-bonding film with a dicing sheet, and a semiconductor device. Background technique [0002] In recent years, as the speed of data processing in semiconductor devices has increased, the amount of heat generated from semiconductor chips has increased, and the importance of designing semiconductor devices with heat dissipation has increased. Heat exerts various adverse effects not only on the semiconductor device itself, but also on the main body of the electronic device incorporating the semiconductor device. Various methods have been considered as packaging measures for heat dissipation, but the most important one is heat dissipation through substrates such as printed circuit boards and lead frames. [0003] Therefore, conventionally, an adhesive having high thermal conductivity may be used for bonding a substrate and a semiconductor chip. Conventionall...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J7/02C09J11/00H01L21/50H01L23/373
CPCH01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/73265H01L2924/181H01L2924/00H01L2924/00012H01L2924/00014
Inventor 木村雄大三隅贞仁大西谦司菅生悠树宍户雄一郎
Owner NITTO DENKO CORP
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