Production technology of Teflon film

A polytetrafluoroethylene and production process technology, which is applied in the field of thin polytetrafluoroethylene production technology, can solve the problems of uneven surface density, uneven density of blanks, influence electrical properties, etc., and achieve uniform surface density and short cooling time. , The effect of low processing cost

Inactive Publication Date: 2014-12-31
曹建林
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production conditions and process of the conventional PTFE film are as follows: as long as the PTFE powder is added to a certain specification pressing mold with a stainless steel spoon in a clean workshop, at this time the PTFE powder in the mold The material is piled up in clusters, and there is an irregular distance between the clusters, which means that the PTFE powder in the mold is very irregular, the fluidity of the powder is very poor, and the surface density is very uneven. It is difficult to press it with a hydraulic press. The air in the mold is discharged, so the density of the entire blank is not uniform, and the density of the film turned out in the future is also uneven, so the high-frequency circuit board is pressed with an ordinary film, which directly affects the electrical properties of the product.
In addition, the standard of polytetrafluoroethylene film products in my country is relatively low, the standard number is QB / T3627-1999, and the thickness tolerance is ±10% of the product thickness, while the general high-frequency printed circuit board uses 6 to 10 polytetrafluoroethylene films , the cumulative error of the printed circuit board pressed by the film with this tolerance is large, which directly affects the electrical performance
Finally, because the blank is pressed in a conventional clean workshop, it cannot solve the fine dust in the air, such as PM2.5. Thin films press printed circuit boards, affecting electrical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] (1) Material constant temperature: place the polytetrafluoroethylene resin in the purification workshop at a constant temperature of 23°C for 24 hours;

[0018] (2) Pressing: In the purification workshop, under the temperature condition of 23°C, the vacuum automatic feeding technology is used for feeding, and the main billet is pressed;

[0019] (3) the pressed main blank was left to stand for 48 hours;

[0020] (4) Sintering: Put the static main body into an automatic oven for sintering. The sintering temperature starts from normal temperature and continues to heat up to 380 ° C. The sintering time is 150 hours;

[0021] (5) Cutting: The most advanced cutting equipment in the world is used for cutting, and the cutting thickness tolerance is controlled to ±2%.

[0022] The polytetrafluoroethylene film produced by this method has uniform density, special process, and low processing cost; the thickness tolerance is controlled within ±2%, and the thickness tolerance is fi...

Embodiment 2

[0024] (1) Material constant temperature: place the polytetrafluoroethylene resin in the purification workshop at a constant temperature of 27°C for 48 hours;

[0025] (2) Pressing: In the purification workshop, under the temperature condition of 27°C, the vacuum automatic feeding technology is used for feeding, and the main billet is pressed;

[0026] (3) the pressed main blank was left to stand for 48 hours;

[0027] (4) Sintering: Put the static main body into an automatic oven for sintering. The sintering temperature starts from normal temperature and continues to heat up to 380 ° C. The sintering time is 150 hours;

[0028] (5) Cutting: The most advanced cutting equipment in the world is used for cutting, and the cutting thickness tolerance is controlled to ±2%.

[0029] The polytetrafluoroethylene film produced by this method has uniform density, special process, and low processing cost; the thickness tolerance is controlled within 2%, and the thickness tolerance is fiv...

Embodiment 3

[0031] (1) Material constant temperature: place the polytetrafluoroethylene resin in the purification workshop at a constant temperature of 25°C for 36 hours;

[0032] (2) Pressing: In the purification workshop, under the temperature condition of 25°C, the vacuum automatic feeding technology is used for feeding, and the main billet is pressed;

[0033] (3) the pressed main blank was left to stand for 36 hours;

[0034] (4) Sintering: Put the static main body into an automatic oven for sintering. The sintering temperature starts from normal temperature and continues to heat up to 380 ° C. The sintering time is 150 hours;

[0035] (5) Cutting: The most advanced cutting equipment in the world is used for cutting, and the cutting thickness tolerance is controlled to ±2%.

[0036] The polytetrafluoroethylene film produced by this method has uniform density, special process, and low processing cost; the thickness tolerance is controlled within ±2%, and the thickness tolerance is fi...

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PUM

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Abstract

The invention discloses a production technology of a Teflon film. The production technology comprises a material temperature-keeping process, a compacting process, a sintering process and a turning process. The material temperature-keeping process and the compacting process utilize dust-free purified workshops as production workshops. A vacuum automatic feeding technology is used in all feeding processes. The Teflon film obtained by the production technology has uniform density, is prepared by special processes, has a low treatment cost and has thickness tolerance within + / -2% improved by five times than that of the traditional technology.

Description

technical field [0001] The invention relates to a production process of a film material, in particular to a production process of a polytetrafluoroethylene film. Background technique [0002] Polytetrafluoroethylene is generally called the "King of Plastics", and it is a synthetic polymer material that uses fluorine to replace all hydrogen atoms in polyethylene. PTFE has very stable electrical properties (such as dielectric constant, dielectric loss, etc.), and evenly sandwiching high-precision PTFE films into the production process of high-frequency printed circuit boards can improve the The stability of the electrical properties of the circuit board, the peel strength between the copper foil and the medium, and the smoothness of the surface. The production conditions and process of the conventional PTFE film are as follows: as long as the PTFE powder is added to a certain specification pressing mold with a stainless steel spoon in a clean workshop, at this time the PTFE p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D7/01
Inventor 曹建林
Owner 曹建林
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