Surfactant, use thereof, and phenolic resin foam board using same

Abstract

The invention provides a surfactant, which is prepared by esterification of citronellol and itaconic anhydride. The surfactant can be used for foaming resins, participates in reactions in resin curing resins, improves material flexibility, and reduces thermal conductivity. The invention therefore also relates to the use of this surfactant in organic foam panels. The present invention also provides a phenolic resin foam board using the aforementioned surfactant.

Description

technical field [0001] The invention relates to polymer materials, in particular to building energy-saving materials, in particular to phenolic foam boards and a preparation method thereof. Background technique [0002] In recent years, my country's thermal insulation material industry has developed rapidly, and various thermal insulation materials have sprung up like bamboo shoots after a spring rain. Up to now, the total consumption of thermal insulation materials in my country has exceeded 3 million tons. Along with the increasing of thermal insulation projects, the development of industrial thermal insulation materials and equipment production industry is also ushering in a new climax, and the development of external wall thermal insulation materials is ushering in an unprecedented opportunity. [0003] Existing thermal insulation materials can be divided into two categories: organic thermal insulation materials and inorganic thermal insulation materials. Among them, t...

AI Technical Summary

Problems solved by technology

Among them, the thermal conductivity of inorganic thermal insulation materials is high, it is difficult to meet the increasingly high thermal insulation requirements, and the use is relatively limited.

For organic thermal insulation materials, except phenolic, other thermal insulation materials are relatively easy to burn, and there are potential safety hazards

Due to the country's dual requirements for heat preservation and fire prevention, it is difficult to find a more suitable heat preservation material in the market

At present, the problems existing in various insulation materials are: the flame retardancy level of expandable polystyrene (EPS) and extruded polystyrene board (XPS) is low, and it is necessary to increase the flame retardancy of the foam by adding a flame retardant, although It can effectively improve its flame retardancy, but it cannot change the dripping problem during combustion

Polyurethane has a low thermal conductivity and good thermal insulation effect, but polyurethane itself is flammable, and flame retardants need to be added during production. Under the premise of maintaining qualified mechanical properties, the limiting oxygen index of polyurethane produced by most manufacturers is difficult to reach more than 30%. And the production cost of polyurethane is higher

Conventional phenolic foam has a good flame retardant effect. Without the addition of flame retardants, the oxygen index can reach more than 30%, but the thermal conductivity of the foam is high. Although the phenolic foam products produced by individual large companies can be used in a short period of time Maintains a low thermal conductivity, but cannot maintain long-term stability, which makes the long-term insulation effect of the wall poor