Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Addition Silicone Potting Compounds

A technology of silicone potting adhesive and composition, which is applied in the directions of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of increasing the stirring process, increasing the application cost, and detrimental to the stability of the application performance of the potting adhesive.

Active Publication Date: 2016-01-27
惠州市安品新材料有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practical application, it is found that the inorganic powder with a higher filling ratio can improve the thermal conductivity of the potting compound, and at the same time, because the powder is in a loosely packed state in the silicone matrix, as the rubber is placed for a long time, the powder Separation, sedimentation and even hardening occur gradually. After a long period of storage, it is necessary to increase the stirring process before use, which increases the application cost and is not conducive to the stability of the application performance of the potting compound.
The prior art solves this technical problem generally by surface-treating the inorganic powder to improve its compatibility with the silicone-based rubber, thereby improving the dispersion stability of the powder; or adding a thixotropic agent to the base rubber, Including thixotropic fillers such as silicon dioxide or thixotropic compounds, the potting compound has thixotropic properties, so that the powder can exist more stably in the network structure of the thixotropic agent and slow down the occurrence of sedimentation, but Surface treatment or addition of thixotropic agents have limited effect on slowing down settling

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Addition Silicone Potting Compounds
  • Addition Silicone Potting Compounds
  • Addition Silicone Potting Compounds

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The preparation method of the two-component addition type silicone heat-conducting potting compound comprises the following steps:

[0047] After mixing 200 parts of thermally conductive fillers and 0.5 parts of nano-scale additives evenly, mix and stir with 4 parts of dispersion stabilizer and 60 parts of base polymer, heat up to 150°C for 3 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature. To obtain matrix mixture A, mix matrix mixture A with 2 parts of catalyst, 0.2 parts of inhibitor, 8 parts of plasticizer and 40 parts of base polymer to obtain A component;

[0048] After mixing 200 parts of thermally conductive fillers and 0.5 parts of nano-scale additives evenly, mix and stir with 4 parts of dispersion stabilizer and 60 parts of base polymer, heat up to 150°C for 3 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature. To obtain matrix mixture B, mix matrix mixture B with 20 parts of curing ag...

Embodiment 2

[0051] The preparation method of the two-component addition type silicone heat-conducting potting compound comprises the following steps:

[0052] After mixing 400 parts of thermally conductive filler and 4 parts of nanoscale additives evenly, mix and stir with 6 parts of dispersion stabilizer and 80 parts of base polymer, heat up to 130°C for 2 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature. To obtain matrix mixture A, mix matrix mixture A with 2 parts of catalyst, 0.2 parts of inhibitor, 8 parts of plasticizer and 20 parts of base polymer to obtain A component;

[0053] After mixing 400 parts of thermally conductive filler and 4 parts of nanoscale additives evenly, mix and stir with 6 parts of dispersion stabilizer and 80 parts of base polymer, heat up to 130°C for 2 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature. To obtain matrix mixture B, mix matrix mixture B with 25 parts of curing agent, 8 p...

Embodiment 3

[0056] The preparation method of the two-component addition type silicone heat-conducting potting compound comprises the following steps:

[0057] Mix 800 parts of thermally conductive filler and 8 parts of nano-scale additives evenly, then mix and stir with 9 parts of dispersion stabilizer and 40 parts of base polymer, heat up to 150°C for 2 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature to obtain Matrix mixture A, mix matrix mixture A with 2 parts of catalyst, 0.2 parts of inhibitor, 8 parts of plasticizer and 60 parts of base polymer to obtain component A;

[0058] Mix 800 parts of thermally conductive filler and 8 parts of nano-scale additives evenly, then mix and stir with 9 parts of dispersion stabilizer and 40 parts of base polymer, heat up to 150°C for 2 hours under stirring and -0.08MPa vacuum conditions, and cool down to room temperature to obtain Matrix mixture B, mix matrix mixture B with 6 parts of curing agent, 8 parts of p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
specific surface areaaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses an addition-type silicone potting compound composition, which includes a base polymer, a curing agent, a filler, and a catalyst. The addition-type silicone potting compound composition also includes a nanoscale additive and a dispersion stabilizer. The high-grade additive is an inorganic powder with a specific surface area of ​​150m2 / g-600m2 / g, and the dispersion stabilizer is a hydroxyl-containing organopolysiloxane; the base polymer contains at least two silicon-bonded alkenes in its molecule The curing agent is a polysiloxane containing two or more silicon-bonded hydrogen groups in the molecule. The potting glue of the present invention combines nano-scale additives with hydroxyl-containing organopolysiloxane to significantly improve the dispersion stability of fillers, effectively weaken the phenomenon of sedimentation and hardening of potting glue fillers after long-term storage, and improve potting with a high proportion of fillers The storage stability of the glue.

Description

technical field [0001] The invention belongs to the technical field of silicone materials, and relates to an addition-type silicone potting compound. Background technique [0002] Silicone thermal conductive potting adhesive has the advantages of good thermal conductivity, high and low temperature resistance, good elasticity, and excellent insulation. It is used in the fields of electrical, electronic integration technology, and electrical packaging to improve the accuracy and life of electrical and electronic devices. In recent years to be widely applied. [0003] Silicone thermally conductive potting adhesives generally contain silicone matrix materials and thermally conductive fillers, which are divided into condensation type thermally conductive potting adhesives, addition type thermally conductive potting adhesives, etc., and can also be divided into single-component and two-component thermally conductive potting compounds according to the packaging form. Plastic closu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/08C09K3/10
Inventor 丁小卫肖敦乾罗海剑邹小武刘金龙
Owner 惠州市安品新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com