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hdi printed circuit board copper foil browning device with rolling soft brush

A technology for printed circuit boards and soft brushes, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit secondary processing, etc. The effect of maintaining and improving quality

Active Publication Date: 2017-08-08
ZHEJIANG ZHENYOU ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this device, only relying on the stirring mechanism to stir the browning liquid, the obtained browning product is not uniform, and the efficiency is low

Method used

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  • hdi printed circuit board copper foil browning device with rolling soft brush

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Embodiment Construction

[0028] The following description is merely exemplary in nature and not intended to limit the disclosure, application or use. The specific implementation of the HDI printed circuit board copper foil browning device with rolling soft brush of the present invention will be further described below in conjunction with the accompanying drawings.

[0029] Such as figure 1 Shown, according to the structural representation of a preferred embodiment of the HDI printed circuit board copper foil browning device with rolling soft brush of the present invention. According to the HDI printed circuit board copper foil browning device with rolling soft brush of the present invention, according to the HDI printed circuit board copper foil browning device with rolling soft brush of the present invention, comprising browning tank 1, Medicament storage tank 2 and liquid distribution transfer tank 3, the drug storage tank 2 and liquid distribution transfer tank 3 are connected with liquid distribu...

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PUM

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Abstract

The invention relates to the technical field of HDI printed circuit board manufacturing, in particular to an HDI printed circuit board copper foil brownification device with a rolling type soft brush. The HDI printed circuit board copper foil brownification device with the rolling type soft brush comprises a brownification tank (1), an agent storage tank (2) and a prepared liquid transferring tank (3), wherein the agent storage tank (2) and the prepared liquid transferring tank (3) are connected with a prepared liquid transferring tank (9), and a rolling type soft brush mechanism is arranged in the brownification tank (1) and comprises a rotary shaft (12), the soft brush (13), a horizontal conveying device (11) and a movable guide rail (16) with a support. According to the HDI printed circuit board copper foil brownification device with the rolling type soft brush, copper foil corrosion is enhanced effectively during copper foil brownification through the liquid-phase mass transfer reinforcement, achieved by rotating the brush, of brownification treating fluid on the surface of copper foil, the liquid-phase mass transfer condition of the reaction of an organic film on the surface of the copper foil is updated in time, and on the premise that the microstructure and the mechanical binding force of the brownification film are guaranteed, the corrosion reaction speed and the film forming reaction speed are increased, the efficiency during brownification production is improved, and production cost is reduced easily.

Description

technical field [0001] The invention relates to the technical field of HDI printed circuit board through-hole processing, in particular to an HDI printed circuit board copper foil browning device with a rolling soft brush. Background technique [0002] With the continuous development of consumer electronics products such as smartphones and tablet computers towards portability and miniaturization, PCBs are constantly being developed towards higher and more dense layouts. The HDI board browning process is a chemical treatment process that can satisfy the inner layer of the multi-layer board to increase the bonding force, and it can replace the traditional black oxidation (Black Oxidation) process. It has the same final performance as the black oxidation process, which enhances the bonding force between the film layer and the prepreg, and blocks the attack on the copper surface by the amines produced by the polymerization and hardening of the epoxy resin during the pressing pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38H05K3/46
CPCH05K3/382H05K3/4611H05K2203/0285H05K2203/03
Inventor 詹有根蔡明曙余军龙潘青高云芳
Owner ZHEJIANG ZHENYOU ELECTRONICS CO LTD