Packaging method for flexible-graphite-flake substrate LED

A flexible graphite sheet and LED packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high price of ceramic materials, unsuitable for wide-scale promotion and use, and achieve good sealing, strong shock resistance and pressure resistance. sex, the effect of flexible use of space

Inactive Publication Date: 2015-02-04
江西量一光电科技有限公司
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the stable heat dissipation of LEDs and the luminous efficiency of LED chips, many ceramic materials have recently been used as heat dissipation substrates for high-power LEDs. However, due to the high price of ceramic materials, they are not suitable for large-scale promotion and use.
At present, there is no invention using flexible graphite sheets as LED substrates

Method used

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  • Packaging method for flexible-graphite-flake substrate LED
  • Packaging method for flexible-graphite-flake substrate LED
  • Packaging method for flexible-graphite-flake substrate LED

Examples

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Embodiment Construction

[0024] A flexible graphite sheet substrate LED chip and packaging method, using a flexible graphite sheet as a support, the packaging steps are:

[0025] A flexible graphite sheet substrate LED packaging method, using a flexible graphite sheet as a support, the packaging steps are:

[0026] (1) Crystal expansion: Use an expansion machine to evenly expand the entire LED wafer film, so that the LED grains that are closely arranged on the surface of the film are pulled apart to facilitate spinning;

[0027] (2) Dot primer: Dot insulating glue on the corresponding position of the graphite sheet;

[0028] (3) Solid crystal: Put the crystal expansion ring prepared with silver glue into the spinner frame, and the operator stabs the LED chip with a spinner pen on the corresponding position of the flexible graphite sheet under the microscope; (4) Baking : Put the stabbed flexible graphite sheet into a thermal cycle oven and let it stand at a constant temperature of 200°C for 5 minutes...

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PUM

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Abstract

The invention discloses a packaging method for a flexible-graphite-flake substrate LED. A flexible graphite flake is adopted as a support. The packaging steps include: wafer expanding, primer dispensing, die bonding, drying, welding, fluorescent glue dispensing, drying, glue dispensing, solidifying, and post-testing. The method has the advantages of high heat radiation efficiency, high perveance, flexible space application, great sealing performance, and extremely high anti-shock and pressure resistance performance and is great in packaging effect.

Description

technical field [0001] The invention relates to an LED chip packaging method, in particular to a flexible graphite sheet substrate LED packaging method. Background technique [0002] Flexible graphite sheet is a new type of carbon material. As early as the early 1860s, Brodie heated natural graphite with chemical reagents such as sulfuric acid and nitric acid, and discovered flexible graphite. However, its application did not start until a hundred years later. Since then, many countries have successively carried out research and development of flexible graphite, and achieved major scientific breakthroughs. Flexible graphite has strong pressure resistance, flexibility, plasticity and self-lubrication; strong resistance to high and low temperature, corrosion and radiation; strong shock resistance; strong electrical conductivity; and non-toxic, non-toxic Contains any carcinogens, has no harm to the environment, and is worthy of vigorous promotion and application. [0003] LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/641H01L33/005
Inventor 廖昆
Owner 江西量一光电科技有限公司
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