Preparation method and application of thermal-peeling acrylic ester pressure-sensitive adhesive

A pressure-sensitive adhesive and acrylate technology, applied in the field of pressure-sensitive adhesives, can solve problems such as the separation of the foaming agent layer from the substrate, the separation of the foaming agent layer from the substrate, the separation of the foaming agent layer from the carrier substrate, etc. , to achieve the effects of small particles, good flatness of the rubber surface, good adhesion and thermal peeling

Inactive Publication Date: 2015-02-25
新丰杰力电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this patent can well solve the problem of foaming and shedding: that is, it is easy to peel off and does not remain, but the particle size of the foaming agent is selected to be 30-100um. After foaming, it is easy to cause the adhesive layer containing the foaming agent to separate from the substrate. , resulting in the separation of the foamed adhesive layer from the carrier substrate, making it difficult to cle

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] The preparation method of the above-mentioned heat-peelable acrylate pressure-sensitive adhesive, its preparation steps are:

[0041] The first step: according to the above components and their weight ratio, mix 0.1-2 N-methylol acrylamide, 5-10 acrylic acid, 0.5-1.5 azobisisobutyronitrile, 100-200 ethyl acetate, 60- 140 isooctyl acrylate, 60-140 vinyl acetate, 5-15 hydroxyethyl acrylate, 5-10 methyl methacrylate are uniformly mixed to prepare a mixed solution;

[0042] The second step: select 30-70% ethyl acetate and heat it to 76-80°C in the reactor. After the reflux is stable, start to add the mixed solution prepared in the first step, and the dropping time is 3.5-4 hours. The reaction temperature is controlled at 78-80°C; after the mixture is added dropwise, within 30 minutes, start to drop 10-50 ethyl acetate dissolved with 0.02-1 azobisisobutyronitrile into ethyl acetate at a constant speed, and react for 1 hour ; Start adding 10-50% ethyl acetate with 0.02-1 azo...

Embodiment 1

[0053] A heat release acrylate pressure sensitive adhesive polymerized from the following components in their weight ratios:

[0054] Isooctyl acrylate 110

[0055] Butyl acrylate 66

[0056] Acrylic 3.6

[0057] Hydroxyethyl Acrylate 5.4

[0058] Methyl methacrylate 3

[0059] N-methylolacrylamide 0.24

[0060] Azobisisobutyronitrile 0.84

[0061] Ethyl acetate 240

[0062] The preparation method of heat-peelable acrylate pressure-sensitive adhesive of the present invention, its steps are as follows:

[0063] The first step: select 0.1-2 N-methylol acrylamide, 3.6 acrylic acid, 0.5-1.5 azobisisobutyronitrile, 150 ethyl acetate, 110 isooctyl acrylate, 66 acetic acid for the components and their weight ratio Vinyl ester, 5.4 hydroxyethyl acrylate, and 3 methyl methacrylate are uniformly mixed to obtain a mixed solution;

[0064] The second step: according to the above weight ratio, select 50% ethyl acetate and heat it to 76-80°C in the reactor. After the reflux is stabl...

Embodiment 2

[0066] A heat release acrylate pressure sensitive adhesive polymerized from the following components in their weight ratios:

[0067] Isooctyl Acrylate 125

[0068] Butyl acrylate 70

[0069] Acrylic 3.6

[0070] Hydroxyethyl Acrylate 5.4

[0071] Methyl methacrylate 5

[0072] N-methylolacrylamide 0.24

[0073] Azobisisobutyronitrile 0.84

[0074] Ethyl acetate 264

[0075] The preparation method of heat-peelable acrylate pressure-sensitive adhesive of the present invention, its steps are as follows:

[0076] The first step: select 0.1-2 N-methylol acrylamide, 3.6 acrylic acid, 0.5-1.5 azobisisobutyronitrile, 174 ethyl acetate, 125 isooctyl acrylate, 70 vinyl acetate, 5.4 hydroxyethyl acrylate, and 5 methyl methacrylate are evenly mixed to obtain a mixed solution;

[0077] The second step: select 50% ethyl acetate and heat it to 76-80°C in the reactor. After the reflux is stable, start to drop the mixed solution in the first step. The dropping time is 3.5-4 hours, and...

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Abstract

The invention relates to a thermal-peeling acrylic ester pressure-sensitive adhesive. The thermal-peeling acrylic ester pressure-sensitive adhesive comprises, by weight, 60-140 parts of 2-ethylhexyl acrylate, 60-140 parts of vinyl acetate, 3-10 parts of acrylic acid, 5-15 parts of hydroxyethyl acrylate, 3-10 parts of methyl methacrylate, 0.1-2 parts of N-hydroxymethyl acrylamide, 0.5-2 parts of azodiisobutyronitrile and 200-300 parts of ethyl acetate by polymerization. The polyacrylate pressure-sensitive adhesive is synthesized by (methyl) acrylic monomers through polymerization, and stickiness of an adhesive tape is changed via a temperature variation range. The thermal-peeling acrylic ester pressure-sensitive adhesive has excellent adhesiveness and thermal peeling property, the adhesiveness is larger than 900gf at the temperature lower than 90 DEG C, and the peel strength to a steel plate is smaller than or equal to 1N/m after foaming expansion at the temperature of 130 DEG C. When the pressure-sensitive adhesive tape is sufficiently foamed at the temperature of 130 DEG C, the foaming adhesive layer cannot be separated from a base material. After the pressure-sensitive adhesive tape is sufficiently foamed at 130 DEG C, the foaming agent is small in particles after foaming and the adhesive side is good in flatness.

Description

technical field [0001] The invention belongs to the technical field of pressure-sensitive adhesives, and relates to a preparation method and application of heat-peeling acrylate pressure-sensitive adhesives. Background technique [0002] In recent years, with the miniaturization of electronic components, there have been major problems in their production process and improvement of production efficiency, especially the method of efficiently and non-destructively stripping and recycling small electronic components is a big problem. Therefore, if such components are processed within a certain temperature range, the change in the viscosity of the adhesive tape can be changed through the temperature range, which can effectively recycle small electronic components. [0003] At present, heat-peelable pressure-sensitive adhesive tapes are mainly developed by companies such as Japan and South Korea. The existing patented technology mainly involves directly coating the layer containi...

Claims

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Application Information

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IPC IPC(8): C09J133/08C08F220/18C08F218/08C08F220/06C08F220/28C08F220/14C08F220/58C09J7/02C09J11/00C09J11/06
Inventor 李国烜何俊
Owner 新丰杰力电工材料有限公司
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