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Backboard for high heat dissipation photovoltaic module and preparation method

A photovoltaic module, high heat dissipation technology, applied in photovoltaic power generation, chemical instruments and methods, electrical components, etc., can solve the problems of poor heat dissipation of the backplane, affecting the photoelectric conversion efficiency of cells, and heat accumulation of components, and achieves good thermal conductivity. Avoid the effects of poor hydrolysis resistance and high photoelectric conversion rate

Active Publication Date: 2015-03-04
MING CROWN ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation of the backplane of this structure is relatively poor, and it is easy to cause the heat accumulation of the components, which directly affects the photoelectric conversion efficiency of the cell.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;

[0070] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:

[0071] Fluorocarbon resin 20 parts

[0072] 1 part isocyanate

[0073] Inorganic filler 40 parts

[0074] UV absorber 0.5 parts

[0075] Light stabilizer ...

Embodiment 2

[0095] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;

[0096] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:

[0097] Fluorocarbon resin 25 parts

[0098] 2 parts isocyanate

[0099] Inorganic filler 50 parts

[0100] UV absorber 0.8 parts

[0101] Light stabilizer...

Embodiment 3

[0121] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;

[0122] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:

[0123] Fluorocarbon resin 35 parts

[0124] 3 parts isocyanate

[0125] Inorganic filler 60 parts

[0126] 1 part UV absorber

[0127] Light stabilizer 1 ...

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Abstract

The invention relates to the technical field of solar cell backboard, and in particular relates to a backboard for high heat dissipation photovoltaic module and a preparation method, the backboard comprises a high thermal conductivity weather-proof layer, an aluminum foil layer, a bonding layer and a lower weather-proof layer orderly formed, the underside of the high thermal conductivity weather-proof layer is pasted to the aluminum foil layer, two sides of the bonding layer are respectively pasted to the aluminum foil layer and the lower weather-proof layer, the lower weather-proof layer is the fluorine resin modified polyolefin film provided with the concave-convex grid structure on the surface, wherein the high thermal conductivity weather-proof layer is prepared by the fluorocarbon coating, the raw material of the fluorocarbon coating comprises the fluorocarbon resin, isocyanate, inorganic filler, ultraviolet light absorber, light stabilizer and butyl acetate; the raw material of fluorine resin modified polyolefin film comprises the polypropylene resin, fluorinated ethylene-propylene resin, filler, anti-ultraviolet agent and antioxygen. The backboard for high heat dissipation photovoltaic module is good in heat dissipation effect, high in photoelectric conversion rate and simple in structure. The preparation method for the backboard for high heat dissipation photovoltaic module is simple in process, convenient in operation control, stable in quality and high in production efficiency.

Description

technical field [0001] The invention relates to the technical field of solar battery backplanes, in particular to a backplane for high heat dissipation photovoltaic modules and a preparation method thereof. Background technique [0002] The solar cell module accumulates considerable heat while performing photoelectric conversion, and the temperature rise of the module will directly affect the photoelectric conversion efficiency of the cell, while the conventional solar backsheet uses a PET substrate with a thickness of 125-350 μm, and the thickness of the double-sided coating is The 20-50μm fluorine coating or adhesive composite fluorine film is used to protect the PET substrate against damp heat aging and ultraviolet aging, thereby prolonging the service life of the component. However, the heat dissipation of the backplane of this structure is relatively poor, and it is easy to cause heat accumulation of the components, which directly affects the photoelectric conversion ef...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/049H01L31/052H01L31/18B32B15/085B32B15/08
CPCB32B15/08B32B15/085H01L31/052H01L31/1876Y02E10/50Y02P70/50
Inventor 徐海燕张鹏方艳吴松纪孝熹张曙光
Owner MING CROWN ADVANCED MATERIAL CO LTD
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