Backboard for high heat dissipation photovoltaic module and preparation method
A photovoltaic module, high heat dissipation technology, applied in photovoltaic power generation, chemical instruments and methods, electrical components, etc., can solve the problems of poor heat dissipation of the backplane, affecting the photoelectric conversion efficiency of cells, and heat accumulation of components, and achieves good thermal conductivity. Avoid the effects of poor hydrolysis resistance and high photoelectric conversion rate
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Embodiment 1
[0069] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;
[0070] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:
[0071] Fluorocarbon resin 20 parts
[0072] 1 part isocyanate
[0073] Inorganic filler 40 parts
[0074] UV absorber 0.5 parts
[0075] Light stabilizer ...
Embodiment 2
[0095] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;
[0096] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:
[0097] Fluorocarbon resin 25 parts
[0098] 2 parts isocyanate
[0099] Inorganic filler 50 parts
[0100] UV absorber 0.8 parts
[0101] Light stabilizer...
Embodiment 3
[0121] A backboard for high heat dissipation photovoltaic modules, the backboard includes a high thermal conductivity weather-resistant layer, an aluminum foil layer, an adhesive layer and a lower weather-resistant layer arranged sequentially from top to bottom, the bottom surface of the high thermal conductivity weather-resistant layer is bonded to the aluminum foil layer, The two sides of the bonding layer are respectively attached to the aluminum foil layer and the lower weather-resistant layer, and the lower weather-resistant layer is a fluororesin modified polyolefin film with a concave-convex grid structure on the surface;
[0122] Wherein, the high thermal conductivity and weather-resistant layer is made of fluorocarbon coating, and the fluorocarbon coating includes the following raw materials in parts by weight:
[0123] Fluorocarbon resin 35 parts
[0124] 3 parts isocyanate
[0125] Inorganic filler 60 parts
[0126] 1 part UV absorber
[0127] Light stabilizer 1 ...
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