Inorganic material-modified phenolic foam insulation material with low water absorption and preparation method thereof

An inorganic material, low water absorption technology, applied in the field of low water absorption inorganic material modified phenolic foam material and its preparation field, can solve the problems of low strength, limited application of phenolic insulation material, high water absorption

Inactive Publication Date: 2015-03-11
CHINA BUILDING MATERIALS ACAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional phenolic foam insulation materials have problems such as high water absorption and low strength...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Use the mixing method to carry out surface hydrophobic treatment on the inorganic modifier: choose silicone water repellent, mix with vitrified microbeads after diluting 3 times, and dry in an oven at 50°C to constant weight.

[0026] Then, at room temperature around 20°C, according to the weight percentage, 100 parts of expandable phenolic resin, 20 parts of inorganic modifier (vitrified microbeads) with surface hydrophobic treatment, 5 parts of coupling agent (KH550 silane coupling agent), 3 parts of organic modifier (cottonseed oil), 9 parts of foaming agent (cyclopentane), 8 parts of curing agent (hydrochloric acid: phosphoric acid = 2:1), 1 part of powder water repellent (stearin Calcium acid) mixed evenly, foaming, curing, and heat preservation at 70°C for 4 hours, and placed at room temperature for 10 days. The thermal conductivity of the obtained modified phenolic foam material is 0.035W / (m K), and the combustion calorific value is 9.8MJ / kg , density 120kg / m 3 ...

Embodiment 2

[0028] Use the mixing method to carry out surface hydrophobic treatment on the inorganic modifier: choose silicone water repellent, mix it with vitrified microbeads evenly after diluting it by 5 times, and dry it in an oven at 50°C to constant weight.

[0029] Then, at room temperature around 20°C, according to the weight percentage, 100 parts of expandable phenolic resin, 20 parts of inorganic modifier (vitrified microbeads) with surface hydrophobic treatment, 5 parts of coupling agent (KH550 silane coupling agent), 3 parts of organic modifier (cottonseed oil), 9 parts of foaming agent (cyclopentane), 8 parts of curing agent (hydrochloric acid: phosphoric acid = 2:1), 1 part of powder water repellent (stearin Calcium acid) mixed evenly, foamed at 70°C, kept warm, and cured for 4 hours, and left at room temperature for 10 days. The thermal conductivity of the modified phenolic foam obtained was 0.035W / (m K), and the combustion calorific value was 9.5MJ / kg , density 118kg / m 3 ...

Embodiment 3

[0031] Surface hydrophobic treatment of inorganic modifiers by immersion method: select organosilicon water repellent, and treat inorganic modifiers by infiltration method: dilute the water repellent to 3% concentration and soak vitrified microbeads for 1 Hours, dried in an oven at 50°C to constant weight.

[0032] Then, at room temperature around 20°C, according to the weight percentage, 100 parts of expandable phenolic resin, 20 parts of inorganic modifier (vitrified microbeads) with surface hydrophobic treatment, 5 parts of coupling agent (KH550 silane coupling agent), 3 parts of organic modifier (cottonseed oil), 9 parts of foaming agent (cyclopentane), 8 parts of curing agent (hydrochloric acid: phosphoric acid = 2:1), 1 part of powder water repellent (stearin Calcium acid) mixed evenly, foamed at 70°C, kept warm, and cured for 4 hours, and placed at room temperature for 10 days. The thermal conductivity of the modified phenolic foam obtained was 0.035W / (m K), and the com...

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Abstract

An inorganic material-modified phenolic foam insulation material with low water absorption and a preparation method thereof are disclosed. According to the invention, 0.1-50 parts by weight of an inorganic modifier with the surface coated by a water repellent, 1-10 parts by weight of a coupling agent, 3-15 parts by weight of an organic modifier, 2-18 parts by weight of a foaming agent, 6-20 parts by weight of a curing agent and 0-5 parts by weight of a powdery water repellent are added into 100 parts by weight of foamable phenolic resin. The preparation method provided by the invention comprises the following steps: uniformly mixing the foamable phenolic resin, the inorganic modifier processed by surface hydrophobic treatment, the coupling agent, the organic modifier, the foaming agent, the curing agent and the powdery water repellent, foaming at 18-90 DEG C, curing, carrying out thermal insulation for 2-18 h, standing at room temperature for 7-20 days, and slaking to obtain the inorganic material-modified phenolic foam insulation material with low water absorption. The foam material provided by the invention has fine and uniform cells and high porosity by closed pore. In addition, a light inorganic material undergoes hydrophobic cover treatment so as to achieve the purpose of reducing water absorption of the material.

Description

technical field [0001] The invention relates to a low water absorption inorganic material modified phenolic foam material and a preparation method thereof. Background technique [0002] Traditional phenolic foam insulation materials have problems such as high water absorption and low strength during use, which limits the application of phenolic foam insulation materials in the field of external wall insulation. Modified phenolic foam insulation board, as an ideal insulation material for building exterior walls, has excellent comprehensive properties, good physical and mechanical properties, and stable dimensions. It is fundamentally different from the usual polymer resin materials obtained by adding flame retardants. As the only B1 grade organic building wall insulation board, phenolic foam board has a good application prospect. Contents of the invention [0003] The purpose of the present invention is to study a low water absorption inorganic material modified phenolic f...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08K13/06C08K9/10C08K7/20C08J9/14C08J9/10C08J9/08
Inventor 刁桂芝刘光华刘振贤王志新
Owner CHINA BUILDING MATERIALS ACAD
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