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Epoxy resin composition, purpose of same, and fillings for epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, dyed silicone compound treatment, adhesive type, etc., can solve research problems and achieve the effect of excellent formability and excellent flame resistance

Active Publication Date: 2015-03-25
UBE IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the usual (compound-type) silane coupling agents have not necessarily been studied in detail

Method used

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  • Epoxy resin composition, purpose of same, and fillings for epoxy resin composition
  • Epoxy resin composition, purpose of same, and fillings for epoxy resin composition
  • Epoxy resin composition, purpose of same, and fillings for epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] As shown in Table 1, 100 g (100 parts by mass) of YX-4000 as an epoxy resin and 57 g of Hardener 1 (phenol formaldehyde type phenolic resin) as a hardener were mixed under the temperature conditions shown in Table 1 using a twin-shaft kneader. (57 parts by mass), 2.7 g (2.7 parts by mass) of triphenylphosphine as a hardening accelerator, 532 g (532 parts by mass) of silica powder (MSR-2212) as a filler, and phenyltrimethoxy 1,424 g (424 parts by mass) of magnesia powder treated with oxysilane was kneaded to obtain a kneaded product of an epoxy resin composition. Observe the mixing steps at this time.

[0113] After cooling the obtained kneaded product to room temperature, it was pulverized by a pulverizer to be powdered. This powder was press-molded with a specific die to form an ingot made of an epoxy resin composition. This ingot was used as a sample, and the fluidity (swirl flow) was evaluated. Furthermore, the sample was formed into a specific size by a transfer ...

Embodiment 2

[0115] As shown in Table 1, an epoxy resin composition was obtained in the same manner as in Example 1, using hardener 2 (biphenyl aralkyl type phenol resin) instead of hardener 1 (phenol formaldehyde type phenol resin) as a hardener. of mixes. In addition, its evaluation is performed.

Embodiment 3

[0117] As shown in Table 1, magnesium oxide powder 2 whose surface has been treated with N-2-aminoethyl-3-aminopropyltrimethoxysilane is used instead of magnesium oxide powder 1, and epoxy resin is obtained in the same manner as in Example 2. A kneaded product of a resin composition. In addition, its evaluation is performed.

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Abstract

The invention discloses an epoxy resin composition, a purpose of the same, and fillings for the epoxy resin composition. Specifically, the invention can provide a heat-conductive epoxy resin composition containing magnesium oxide powder, wherein the epoxy resin composition can be easily prepared through mixing, and the epoxy resin composition is high in forming property and low in water-absorbing property through improved fluidity. The epoxy resin composition of the invention is characterized in that the epoxy resin composition contains an epoxy resin, a hardening agent and a magnesium oxide powder processed through an alkoxy silane surface having at least one of a phenyl group and an amino group. Additionally, the invention can provide a heat-conductive epoxy resin composition containing magnesium oxide powder, wherein the epoxy resin composition can preferably be excellent in combustibility. The epoxy resin composition of the invention can be suitably used as a heat-conductive sealing material, a heat-conductive sheet material, a heat-conductive adhesion agent and a hardening object.

Description

technical field [0001] The present invention relates to a thermally conductive epoxy resin composition containing magnesium oxide powder, a thermally conductive sealing material, a thermally conductive sheet, a thermally conductive adhesive, a cured product, and a thermally conductive epoxy resin composition containing Magnesium oxide powder filler for epoxy resin compositions. In particular, it relates to a thermally conductive epoxy resin composition that can be easily prepared by kneading, has improved fluidity, has excellent moldability, has good water absorption (low water absorption), and preferably further has excellent combustion resistance. Background technique [0002] Epoxy resin compositions are used for various purposes in numerous fields. [0003] Especially in electronic parts, it is suitably used as a substrate material, a sealing material, a thermally conductive sheet material, an adhesive, and the like. In this application, the amount of heat released fro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/22C08G59/40C09J163/00C09J11/04C08J5/18C09C1/02C09C3/12
CPCC08G59/621C08K3/22C08K5/5415C08K9/06C08K2003/222C08L63/00C09J163/00C09K3/10C09K5/14H01L21/56H01L23/29H01L23/31H01L23/373
Inventor 藤永匡敏篠田教一中江胜西田直人山口诚治
Owner UBE IND LTD
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