Production process of plate grid
A manufacturing process and grid technology, which is applied to lead-acid battery electrodes, electrode carriers/current collectors, etc., can solve the problems of destroying the electrochemical performance of composite electrodes, unstable electrochemical performance, and corrosion resistance of aluminum, so as to increase the volume Specific energy and discharge capacity, the effect of reducing the amount of lead, and improving the performance of the grid
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0018] combine figure 1 and figure 2 As shown, a grid manufacturing process of the present invention is to make a grid 1 with carbon, aluminum or conductive alloy, and spray 0.1mm-2mm thick lead or lead alloy 2 on the grid after forming. 1, the surface layer of the lead layer is bonded to the grid by strong extrusion, or the surface is covered with a thin lead plate with a thickness of 0.1mm-0.8mm on the surface layer of the grid by strong extrusion, resulting in the surface layer The lead density is enhanced by more than 5 times.
[0019] Wherein, the main component of described carbon can be selected active carbon, silicon carbon or carbon alloy material, can add copper powder, silver powder, aluminum powder, graphite, superconducting carbon, graphite emulsion or conductive carbon black in carbon alloy material; The alloy is copper alloy, aluminum alloy or zinc alloy; the lead can be pure lead or alloy lead, and the alloy lead can be lead antimony alloy, lead calcium allo...
Embodiment 2
[0022] combine image 3 As shown, a kind of grid manufacturing process of the present invention is to make a radial grid 1 with carbon, aluminum or conductive alloy, and spray 0.1mm-2mm thick lead or lead alloy 2 on the grid after forming For the surface layer, the lead layer on the surface is bonded to the grid by strong extrusion, or the surface is coated with a thin lead plate with a thickness of 0.1mm-0.8mm on the surface layer of the grid by strong extrusion, resulting in the lead density of the surface layer Enhanced more than 5 times.
[0023] Wherein, the main component of described carbon can be selected active carbon, silicon carbon or carbon alloy material, can add copper powder, silver powder, aluminum powder, graphite, superconducting carbon, graphite emulsion or conductive carbon black in carbon alloy material; The alloy is copper alloy, aluminum alloy or zinc alloy; the lead can be pure lead or alloy lead, and the alloy lead can be lead antimony alloy, lead cal...
Embodiment 3
[0026] combine Figure 4 As shown, a kind of grid manufacturing process of the present invention is to use carbon, aluminum or a conductive alloy to make a meshed grid 1, and spray 0.1mm-2mm thick lead or lead alloy on the grid 1 after forming. For the surface layer, the lead layer on the surface is bonded to the grid by strong extrusion, or the surface is coated with a thin lead plate with a thickness of 0.1mm-0.8mm on the surface layer of the grid by strong extrusion, resulting in the lead density of the surface layer Enhanced more than 5 times.
[0027] Wherein, the main component of described carbon can be selected active carbon, silicon carbon or carbon alloy material, can add copper powder, silver powder, aluminum powder, graphite, superconducting carbon, graphite emulsion or conductive carbon black in carbon alloy material; The alloy is copper alloy, aluminum alloy or zinc alloy; the lead can be pure lead or alloy lead, and the alloy lead can be lead antimony alloy, le...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com