PCB board processing method and PCB board

Abstract

The invention relates to a PCB machining method and a PCB. The method comprises the steps that a board to be machined is provided, a first device hole with one end required to be insulated and a first outer layer circuit layer are machined on the board to be machined, and the first circuit layer comprises a welding disc which is located on an opening of a first device hole and is connected with the wall of the first device hole; high-temperature press fitting is carried out, an insulation layer and a copper foil layer are sequentially stacked on the surfaces of the two sides of the board to be machined, then, high-temperature press fitting is carried out, and a circuit board body is obtained; an outer-layer graph is manufactured, an etching technology is adopted to remove the copper foil layer to form a second outer layer circuit layer in an etching manner, and the end, required to be in pressure welding with a device, of the first device hole and a welding disc at the end are exposed out; solder resisting is manufactured, a solder resisting layer is formed on the surface of the insulation layer to cover an area, not required to be connected with a device, of the second outer layer circuit layer; surface coating is carried out, and a surface coating layer is formed on areas, not covered by the solder welding layer, exposed out of the first outer layer circuit layer and the second outer layer circuit layer. The coated surface coating layer is not damaged when passing through the high-temperature press-fit process, and the weldability of a finished product of the PCB is not affected.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a PCB board processing method and a PCB board. Background technique [0002] In the existing PCB board processing process, it is often necessary to perform insulation treatment on some areas. The existing insulation method is: after processing according to the conventional process of PCB, such as figure 1 shown with an insulated zone 10 ( figure 1 In the above, the region to be insulated is illustrated by taking the device hole as an example. For comparison, figure 1 After the PCB board semi-finished product 1 that does not need to be insulated, the insulating sheet 2 made of PI film (polyimide film) is milled to a size that matches the area to be insulated and positioned on the PCB The surface of the corresponding area to be insulated on the board semi-finished product 1 is coated with a surface coating layer for avoiding graphic copper oxidation on the outer surface, and ...

AI Technical Summary

Problems solved by technology

[0004] 1. The surface coating layer of the surface coating can withstand high temperature except the gold layer, other layers such as tin layer, silver layer and organic solder film layer are not resistant to high temperature. Therefore, the final high-temperature pressing step will destroy The surface coating layer directly affects the solderability of the finished PCB board;

[0005] 2. The PI film insulation sheet is processed by the conventional milling process. Since the PI film material is thin and soft, there are requirements for the size of the insulation area, which makes it difficult to control the accuracy of the insulation area after the PI film insulation sheet is pressed and formed;

[0006] 3. The high cost of PI film insulation sheet leads to high manufacturing cost of this type of PCB board, which is not conducive to its promotion

Images