A beam-splitting laser multi-station time-sharing cutting machine and processing method

Abstract

The invention relates to a beam splitting laser multi-station time sharing cutting machine and a machining method. The beam splitting laser multi-station time sharing cutting machine comprises a platform, a laser light source, an incident mechanism, a laser scanner, a beam splitting mechanism, machining heads, a cross mobile platform and a task control system; a plurality of stations are installed on the cross mobile platform; a plurality of machining heads are installed on every station; incident laser of the laser light source is guided into the laser scanner through the incident mechanism; emergent laser of the laser scanner is respectively guided to the plurality of machining heads in the same station through the beam splitting mechanism; the task control system controls the laser scanner to guide laser into the machining heads of the other station after machining of materials inside one station is finished. According to the beam splitting laser multi-station time sharing cutting machine, laser multi-head machining is distributed coordinately through a combination mode of optical energy distribution and industrial intelligent control time sharing, laser multi-station energy separation machining is achieved, the efficiency is greatly improved, and the machining quality is improved.

Description

technical field [0001] The invention relates to the field of laser processing equipment, in particular to a beam-splitting laser multi-station time-sharing cutting machine. The invention also relates to a beam-splitting laser multi-station time-sharing processing method for materials. Background technique [0002] The display industry glass substrate is an ultra-thin, large-format special glass material, which is the key component of the display panel. The quality of the display glass substrate directly determines the production cost and market value of subsequent related application products (such as LCD TVs, LCD monitors, mobile phone screens). The conventional cutting glass substrate processing method is the mechanical cutting method of scribing and cutting with diamond grinding wheel or cemented carbide wheel; cutting with this method will inevitably produce debris on the glass surface, and subsequent processes such as cleaning and polishing are required ; At the same ...

AI Technical Summary

Problems solved by technology

The conventional cutting glass substrate processing method is the mechanical cutting method of scribing and cutting with diamond grinding wheel or cemented carbide wheel; cutting with this method will inevitably produce debris on the glass surface, and subsequent processes such as cleaning and polishing are required ; At the same time, in the substrate surface cleaning process, tiny debris may also cause damage to the glass surface; in addition, due to the large inertia of the traditional mechanical cutting method, the efficiency of cutting small arcs is low

As the requirements for processing precision are getting higher and higher, improving efficiency and reducing production costs are issues that must be considered by every manufacturer. It is becoming more and more difficult for mechanical processing to adapt to the requirements of modern industry. In order to improve the yield of glass substrates and save Raw material cost, easy to expand production capacity, a fast, efficient and clean glass substrate cutting technology is very necessary

[0003] At present, laser processing has gradually replaced mechanical processing as a commonly used processing method for display glass and other materials, but the current industrial single-head laser cutting machine is still inefficient, especially in the fine cutting of small arcs, there are problems of slow speed and poor effect

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