Halogen-free resin composition and copper-clad plate prepared by using composition

A resin composition and composition technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problem of decreased processability of copper clad laminates, poor tracking resistance, heat resistance and resistance Problems such as poor alkalinity, to achieve the effect of avoiding processability

Inactive Publication Date: 2015-04-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the ordinary epoxy resin used for copper clad laminates contains a large number of benzene rings, which makes the tracking resistance of ordinary FR-4 poor, and the CTI value generally does not exceed 250V
[0004] In addition, adding a large amount of aluminum hydroxid...

Method used

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  • Halogen-free resin composition and copper-clad plate prepared by using composition
  • Halogen-free resin composition and copper-clad plate prepared by using composition
  • Halogen-free resin composition and copper-clad plate prepared by using composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A kind of total amount is the resin composition of 100 parts, comprises each component of following parts by weight: 25 parts of phosphorus-containing epoxy resins (Dow Chemical, XZ92530), dicyclopentadiene type epoxy resins (Dainippon Ink Co., Ltd., HP7200H) 5 parts, cycloaliphatic epoxy resin (Dow Chemical, ERL-4221D) 20 parts, acid anhydride (Kray Willy, SMAEF-40) 45 parts, phosphorus-containing flame retardant (Clariant, EXOLIT OP935) 5 parts share.

[0027] The method for preparing a copper-clad laminate with the above-mentioned resin composition comprises the following steps:

[0028] 1) Weigh each component according to the formula and mix well;

[0029] 2) Add an accelerator and an organic solvent to the composition to form a glue solution, stir and mix evenly, and coat it on an electronic grade glass cloth, and then bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg; The prepregs are stacked together, covered with an electroly...

Embodiment 2

[0031] A kind of total amount is the resin composition of 100 parts, comprises each component of following parts by weight: 35 parts of phosphorus-containing epoxy resins (Dow Chemical, XZ92530), dicyclopentadiene type epoxy resins (Dainippon Ink Co., Ltd., HP7200H) 10 parts, cycloaliphatic epoxy resin (Dow Chemical, ERL-4221D) 10 parts, acid anhydride (Kray Willy, SMAEF-40) 42 parts, phosphorus-containing flame retardant (Clariant, EXOLIT OP935) 3 share.

[0032] The method for preparing a copper-clad laminate with the above-mentioned resin composition comprises the steps of:

[0033] 1) Weigh each component according to the formula and mix well;

[0034] 2) Add an accelerator and an organic solvent to the composition to form a glue solution, stir and mix evenly, and coat it on an electronic grade glass cloth, and then bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg; The prepregs are stacked together, covered with an electrolytic copper f...

Embodiment 3

[0036] A kind of total amount is the resin composition of 100 parts, comprises each component of following parts by weight: 45 parts of phosphorus-containing epoxy resins (Dow Chemical, XZ92530), dicyclopentadiene type epoxy resins (Dainippon Ink Co., Ltd., HP7200H) 7 parts, cycloaliphatic epoxy resin (Dow Chemical, ERL-4221D) 5 parts, acid anhydride (Kray Willy, SMAEF-40) 40 parts, phosphorus-containing flame retardant (Clariant, EXOLIT OP935) 3 parts share.

[0037] The method for preparing a copper-clad laminate with the above-mentioned resin composition comprises the following steps:

[0038] 1) Weigh each component according to the formula and mix well;

[0039] 2) Add an accelerator and an organic solvent to the composition to form a glue solution, stir and mix evenly, and coat it on an electronic grade glass cloth, and then bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg; The prepregs are stacked together, covered with an electrolyt...

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Abstract

The invention provides a halogen-free resin composition and a copper-clad plate prepared by using the composition. The halogen-free resin composition is prepared from the following components in parts by weight: 25-45 parts of phosphorus-containing epoxy resin, 5-10 parts of dicyclopentadiene epoxy resin, 5-20 parts of alicyclic epoxy resin, 40-45 parts of acid anhydride and 3-5 parts of a phosphorus-containing flame retardant. According to the halogen-free resin composition and the copper-clad plate prepared by using the composition disclosed by the invention, the halogen-free resin composition is used for solving problems from the angle of the resin structure; the common epoxy resin and the alicyclic epoxy resin as well as the dicyclopentadiene epoxy resin are matched for use, and cured through the acid anhydride, so that the CTI of the copper-clad plate reaches the requirements greater than 600V. Moreover, aluminum hydroxide filler is not needed to be added into the composition, so that the problem that the processing performance, the heat resistance and the alkali resistance of the copper-clad plate are lowered due to filler addition is avoided.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a halogen-free resin composition and a copper clad laminate prepared using the composition. Background technique [0002] As the insulating base material of printed circuit boards, copper clad laminates are widely used in various electronic and electrical products. As people pay more and more attention to the safety and reliability of electronic and electrical products, higher and higher requirements are put forward for the safety and reliability of copper clad laminates. Among them, tracking resistance is an important reliability index of copper clad laminates. Copper clad laminates with poor tracking resistance are potential hidden dangers caused by fires in electronic and electrical products. Therefore, the copper clad laminate must improve its tracking resistance, that is, have a higher CTI value to ensure its safety and reliability. [0003] However, due to t...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L35/06B32B15/092B32B15/20B32B27/12B32B27/38
Inventor 汪青
Owner GUANGDONG SHENGYI SCI TECH
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