Manufacturing method of high thermal conductivity insulating layer and metal-based copper-clad laminate

Abstract

The present invention proposes a method for manufacturing a high thermal conductivity insulating layer, which is characterized by comprising: forming a high thermal conductivity composite fiber; grinding the high thermal conductivity composite fiber into fiber powder; dissolving the fiber powder and inorganic filler in the ring A resin glue solution is formed in the solvent where the oxygen resin and the curing agent are located; and the resin glue solution is cured to form the high thermal conductivity insulating layer. In addition, the invention also provides a metal-based copper-clad laminate. Through the technical solution of the invention, the lateral heat dissipation capacity of the insulating layer can be improved, the heat dissipation effect of the insulating layer can be improved, the filling content of inorganic substances in the insulating layer can be reduced, and a high thermal conductivity insulating layer with excellent thermal conductivity, good toughness and strong adhesion can be obtained, and further The reliability of metal-based copper clad laminates with this high thermal conductivity insulating layer material is improved.

Description

technical field [0001] The invention relates to the technical field of insulating layer manufacturing, and more specifically, relates to a method for manufacturing a high thermal conductivity insulating layer and a metal-based copper-clad laminate. Background technique [0002] With the development of electronic technology, the design of electronic components is becoming more and more miniaturized, and the circuit is becoming more and more refined. Therefore, it is necessary to meet the requirements of good circuit design flexibility and heat dissipation characteristics. Metal-based copper-clad laminates carrying electronic components have been widely used in LEDs, intelligent power modules, and power supplies due to their excellent heat dissipation, insulation performance, flexible circuit design, and excellent processing characteristics. [0003] In some fields such as LED lighting, TV, intelligent power devices, inverters, electric motors and power supplies, metal substra...

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Problems solved by technology

[0005] On the one hand, the heat dissipation method of heat-conducting inorganic powder achieves heat dissipation by filling a large amount of heat-conducting inorganic powder, which reduces the toughness, and the insulating layer generally shows the shortcomings of greater brittleness and poor adhesion, and it is easy to produce cracks or cracks during stamping and other processing processes. The insulation layer is peeled off from the surface of the board, which poses a great risk to product reliability;

[0006] On the other hand, high-power devices require good lateral heat dissipation, so that the heat can be quickly distributed inside the heat-dissipating substrate, filled with inorganic powder, and the horizontal and vertical heat dissipation effects are consistent, which cannot meet the needs of high-power devices for rapid lateral heat dissipation

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