High-thermal-conductivity organosilicone mud and preparation method thereof

A high thermal conductivity and silicone technology, applied in the field of heat conduction and heat transfer, can solve the problems of not obvious effect, poor heat transfer stability, and affecting the service life of electronic products, so as to avoid a significant decline in heat transfer performance and increase Filling amount, effect of good thermal conductivity

Active Publication Date: 2015-04-08
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the density of the thermally conductive powder filler is much greater than that of silicone oil, the oil powder is easy to separate. Therefore, the prior art also adopts a method of treating the thermally conductive powder filler to improve the settlement problem, but the effect is not very good. obvious
Especially during long-term use when the temperature exceeds 80°C, the silicone oil in the thermal grease will slowly dissociate, which will cause the thermal grease layer to dry and crack and enter the air, making the heat transfer stability worse and seriously affecting The life cycle of electronic products and equipment

Method used

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  • High-thermal-conductivity organosilicone mud and preparation method thereof
  • High-thermal-conductivity organosilicone mud and preparation method thereof
  • High-thermal-conductivity organosilicone mud and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1. A kind of organosilicon high thermal conductivity mud in this embodiment, its raw material is composed of:

[0019]

[0020] 2. The preparation method of the above-mentioned organosilicon high thermal conductivity mud in this embodiment, the steps are as follows:

[0021] First, add phenylvinyl silicone oil into the planetary machine, add thermal conductive powder filler in five batches, and stir and mix evenly under the vacuum protection condition of -0.095MPa; then add plasticizer, powder surface treatment agent, crosslinking agent in sequence Agent, high-temperature-resistant colorant, platinum catalyst, heated to 65°C for 0.5h under a vacuum protection condition of -0.095MPa, and reacted for 0.5h, then cooled to room temperature to obtain the finished silicone high thermal conductivity clay.

Embodiment 2

[0023] 1. A kind of organosilicon high thermal conductivity mud in this embodiment, its raw material is composed of:

[0024]

[0025] 2. The preparation method of the above-mentioned organosilicon high thermal conductivity mud in this embodiment, the steps are as follows:

[0026] First, add phenylvinyl silicone oil into the planetary machine, add thermal conductive powder filler in five batches, and stir and mix evenly under the vacuum protection condition of -0.095MPa; then add plasticizer, powder surface treatment agent, crosslinking agent in sequence Agent, high-temperature-resistant colorant, platinum catalyst, heated to 60°C for 1 hour under a vacuum protection condition of -0.095MPa, and cooled to room temperature to obtain the finished silicone high thermal conductivity clay.

Embodiment 3

[0028] 1. A kind of organosilicon high thermal conductivity mud in this embodiment, its raw material is composed of:

[0029]

[0030]

[0031] 2. The preparation method of the above-mentioned organosilicon high thermal conductivity mud in this embodiment, the steps are as follows:

[0032] First, add phenyl vinyl silicone oil into the planetary machine, add thermal conductive powder filler in six batches, and stir and mix evenly under the vacuum protection condition of -0.095MPa; then add plasticizer, powder surface treatment agent, crosslinking agent in sequence Agent, high-temperature-resistant colorant, platinum catalyst, heated to 55°C for 2 hours under a vacuum protection condition of -0.095MPa, and cooled to room temperature to obtain the finished silicone high thermal conductivity clay.

[0033] The physical and chemical properties of the finished organosilicon high thermal conductivity paste prepared in various embodiments of the present invention are shown in T...

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Abstract

The invention discloses a high-thermal-conductivity organosilicone mud. The high-thermal-conductivity organosilicone mud is prepared from the following raw materials: 100 parts of silicone oil and 1000-1200 parts of heat-conducting powder filler in parts by weight, 0.5-1wt% of plasticizer and 1-3wt% of powder surface treating agent in terms of the heat-conducting powder filler, and 1-3wt% of cross-linking agent, 5-10wt% of high temperature resistant pigment and 0.01-0.015wt% of platinum catalyst in terms of the silicone oil. Besides, the invention also discloses a preparation method of the high-thermal-conductivity organosilicone mud. The high-thermal-conductivity organosilicone mud product has the advantages of high thermal conductivity, stable heat transfer property, excellent high temperature resistance, plasticity just as plasticine and the like; the preparation method of the high-thermal-conductivity organosilicone mud is simple; a better thermal-conductivity solution way can be provided for electronic heating components and radiating or other cooling devices.

Description

technical field [0001] The invention relates to the technical field of heat conduction and heat transfer, in particular to an organosilicon high heat conduction mud and a preparation method thereof. Background technique [0002] With the rapid development of production science and technology and increasingly strict requirements on product performance, the stability of electronic product functions is facing severe market challenges. How to solve the problem of equipment heat dissipation has become the key to the miniaturization design of electronic products. Due to the poor thermal conductivity of the air, if the heat generated by the equipment is not dissipated in time, it is easy to form a local high temperature, and the high temperature will cause breakdown and arcing of electronic components, which will cause damage to components and components, thereby affecting the reliability and reliability of electronic products. normal working life cycle. For this reason, in the de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08K13/02C08K3/22C08K3/38C08K3/34C08K3/28C09K5/14
Inventor 张震宇陈思斌
Owner GUANGZHOU BAIYUN CHEM IND
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