Thermal expansion coefficient adjustable Cu heat sink and preparation method thereof

A thermal expansion coefficient and heat sink technology, applied in lasers, electrical components, circuits, etc., can solve the problems of large thermal expansion coefficient of metal heat sinks, poor thermal conductivity of ceramic heat sinks, and high price, so as to reduce internal stress and reduce energy consumption. , cost saving effect

Inactive Publication Date: 2015-04-08
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problems in the prior art that the thermal expansion coefficient of the metal heat sink is large, the thermal conductivity of most ceramic heat sinks is poor, and the ceramic heat sink with the characteristics of low expansion and high heat conductivity is expensive and difficult to process, and provides a A kind of Cu heat sink with adjustable coefficient of thermal expansion and preparation method thereof

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  • Thermal expansion coefficient adjustable Cu heat sink and preparation method thereof
  • Thermal expansion coefficient adjustable Cu heat sink and preparation method thereof
  • Thermal expansion coefficient adjustable Cu heat sink and preparation method thereof

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preparation example Construction

[0034] The method for preparing the above-mentioned Cu heat sink with adjustable thermal expansion coefficient mainly includes two stages of green compact preparation and sintering to prepare the heat sink. The sintering preparation of the heat sink is divided into three processes: preheating, reaction and densification, specifically including the following steps:

[0035] Step 1. Compaction preparation:

[0036] Weighing 20-80vol.% Cu powder and 20-80vol.% mixed powder into the mixer, mixing evenly, adding to a stainless steel mold, pressing and forming to obtain a green compact;

[0037] Wherein, the mixed powder is one of the mixed powder of Ti powder and B powder, the mixed powder of Zr powder and B powder, the mixed powder of Ti powder and C powder, and the mixed powder of Zr powder and C powder; In the mixed powder of Ti powder and B powder, the amount of substance ratio of Ti powder and B powder is 1:2; In the mixed powder of Zr powder and B powder, the amount of substa...

Embodiment 1

[0053] Cu heat sink with adjustable thermal expansion coefficient, its composition is: 80vol.% Cu and 20vol.% TiB 2 .

[0054] The preparation method of the above-mentioned Cu heat sink with adjustable thermal expansion coefficient:

[0055] Step 1. Put 88.80g of Cu powder with a particle size of 50μm, 7.68g of Ti powder with a particle size of 25μm and 3.52g of B powder with a particle size of 1μm into the mixer for 6 hours; then put the uniformly mixed powder into the stainless steel In the mold, pressed into a billet;

[0056] Step 2. Place the green compact in the graphite mold in the sintering furnace. After vacuuming, inject high-purity argon gas of 1 atmosphere for protection. Heat the sintering furnace to 300°C for preheating and heat preservation for 25 minutes;

[0057] Step 3. Continue heating the sintering furnace to 800°C for 8 minutes, and the tungsten-rhenium thermocouple detects a sudden and rapid increase in the temperature of the green compact, indicating t...

Embodiment 2

[0061] Cu heat sink with adjustable thermal expansion coefficient, its composition is: 60vol.% Cu and 40vol.% TiB 2 .

[0062] The preparation method of the above-mentioned Cu heat sink with adjustable thermal expansion coefficient:

[0063] Step 1. Put 74.83g of Cu powder with a particle size of 45μm, 17.26g of Ti powder with a particle size of 20μm and 7.91g of B powder with a particle size of 1μm into the mixer for 7 hours; then put the evenly mixed powder into the stainless steel In the mold, pressed into a billet;

[0064] Step 2. Place the green compact in the graphite mold in the sintering furnace. After vacuuming, inject high-purity argon gas of 1 atmosphere for protection. Heat the sintering furnace to 300°C for preheating and heat preservation for 28 minutes;

[0065] Step 3. Continue heating the sintering furnace to 800°C for 7 minutes, and the temperature measured by the tungsten-rhenium thermocouple increases rapidly, indicating that a reaction has occurred betw...

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Abstract

The invention discloses a thermal expansion coefficient adjustable Cu heat sink and a preparation method thereof, belonging to the technical field of semiconductor laser unit chip packaging, and solving the problems that the thermal expansion coefficient of a metal heat sink is high, the heat conductivity coefficients of most ceramic heat sinks are poor, and the ceramic heat sinks with low expansion and high heat conductivity properties are high in price and are difficult to process in the prior art. The heat sink consists of Cu being 20-80vol.% and ceramic particles being 20-80vol.%, wherein the ceramic particles are TiB2, TiC, ZrB2 or ZrC. The thermal expansion coefficient of the Cu heat sink can be adjustable in the range of 5.91*10<-6>/K to 13.44*10<-6>/K by adjusting the content of the ceramic particles, and further the thermal expansion coefficient of the Cu heat sink is matched with that of a semiconductor laser unit chip; the internal stress for welding is reduced; the reliability of the semiconductor laser unit is improved; the service life of the semiconductor laser unit is prolonged; the thermal expansion coefficient adjustable Cu heat sink and the preparation method thereof are applicable to heat dissipation and packaging of semiconductor laser unit chips.

Description

technical field [0001] The invention belongs to the technical field of semiconductor laser chip packaging, and in particular relates to a Cu heat sink with adjustable coefficient of thermal expansion and a preparation method thereof. Background technique [0002] There are two main types of heat sinks for semiconductor laser chip packaging: metal and ceramic. Metal heat sinks such as Cu and Al have good thermal conductivity and can meet the thermal conductivity requirements of semiconductor laser chips. However, compared with Si and GaAs, the main materials of semiconductor laser chips, metal heat sinks have a larger thermal expansion coefficient. During the chip welding process, welding internal stress will be generated. During the use of the laser, the semiconductor device will often fail due to excessive welding stress, which will reduce the service life of the laser. The thermal expansion coefficient of the ceramic heat sink is low, but the thermal conductivity is usual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C32/00C22C29/00C22C1/05H01S5/024
Inventor 舒世立佟存柱田思聪汪丽杰宁永强王立军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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