LDMOS (laterally diffused metal oxide semiconductor) device and manufacturing method thereof
A device and drift region technology, applied in the manufacture of LDMOS devices, in the field of lateral field effect transistors (LDMOS devices, it can solve the limitations of the increase in the doping concentration of the drift region, the reduction in length, the large and short channel effects, and the increase in process costs, etc. problem, to achieve high breakdown voltage, reduce parasitic resistance, reduce the effect of on-resistance
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[0046] The LDMOS device of the embodiment of the present invention includes:
[0047] A silicon substrate doped with a first conductivity type.
[0048] The first drift region is composed of a second conductivity type ion implantation region formed in a selected region of the silicon substrate.
[0049] The channel region is composed of a well region of the first conductivity type formed in a selected region of the silicon substrate, and the first side of the first drift region is in contact with the channel region in the lateral direction.
[0050] A polysilicon gate formed above the channel region, a gate dielectric layer is isolated between the polysilicon gate and the silicon substrate, the polysilicon gate covers part of the channel region and extends above the first drift region , the surface of the channel region covered by the polysilicon gate is used to form a channel.
[0051] A source region is composed of a heavily doped region of the second conductivity type for...
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