Chip four-corner binding glue and preparation method thereof

Abstract

The invention belongs to the technical field of chip protective glue and particularly relates to chip four-corner binding glue and a preparation method thereof. The chip four-corner binding glue is prepared from the following components in parts by weight: 20-25 parts of bisphenol A epoxy resin, 35-40 parts of bisphenol F epoxy resin, 0.5-1.0 part of pigment, 4-10 parts of white carbon black, 60-100 parts of spherical filler, 30-50 parts of sulfydryl ester, 1-2 parts of a stabilizer, 4-10 parts of a curing agent and 1-3 parts of a coupling agent. The four-corner binding glue prepared by the preparation method disclosed by the invention is not high in viscosity, good in thixotropy and relatively high in cross-linking density, so that the weather resistance is extremely good, the curing temperature is low, the bonding strength is high, the shrinking percentage is low, the storage is relatively stable and lasting, the preparation process is simple and environmentally friendly, the cost is low and the applied range is wide. Moreover, a product obtained by the preparation method disclosed by the invention is in liquid state, and beneficial to site construction and avoiding generating gas bubbles.

Description

technical field [0001] The invention belongs to the technical field of chip protection adhesives, and in particular relates to a chip four-corner binding adhesive and a preparation method thereof. Background technique [0002] China has become the world's largest producer of digital products, among which the production of mobile digital products accounts for more than half of the world's output. According to data, the development trend of modern digital products is "thin, light, and small". This development also requires chips. It tends to be "thin, light, and small", and this trend also greatly increases the protection requirements for chips. [0003] Since mobile digital products will be pressed, bent, twisted, dropped and other phenomena during use, and this stress change will naturally be applied to the chip, the chip will creep when the stress changes, and long-term application will lead to chip solder balls The chip is broken and the function of the chip is lost, and ...

AI Technical Summary

Problems solved by technology

[0005] At present, the traditional four-corner binding glue on the market is: 1. Epoxy resin is cured at high temperature, but due to the high curing temperature of the epoxy-cured system, after the digital product is assembled, the high temperature will affect the performance of other components; 2. UV ultraviolet curing, due to the fast curing speed of UV ultraviolet curing glue, the curing room will not generate high temperature, this process should be the best way to protect the chip, but due to the polymerization inhibition effect of oxygen in the air, the surface of the UV ultraviolet glue after curing Sticky, and there will be no curing phenomenon where the ultraviolet light is not irradiated