Preparation method of high-attenuation backing material

A high-attenuation, backing technology, applied in the field of preparation of high-attenuation backing materials, can solve the problems of tungsten powder volume ratio limitation, high-attenuation metal backing cutting, difficult bonding, and sound attenuation coefficient cannot be achieved, etc. Effect of Sound Attenuation Coefficient

Active Publication Date: 2015-04-29
EDAN INSTR
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  • Abstract
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Problems solved by technology

However, there are some shortcomings in some aspects of the two production methods: although the backing layer made by casting is easy to bond with the piezoelectric element, the sound attenuation coefficient of the backing layer is related to the tungsten content, and the casting method is affected by tungsten. The influence of the solubility of the powder in the solvent leads to the limitation of the volume ratio of the tungsten powder after molding, so that the sound attenuation coefficient is far from meeting our needs; and some high-attenuation metal backings have the problem of cutting and bonding difficulties

Method used

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  • Preparation method of high-attenuation backing material

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preparation example Construction

[0041] A high attenuation backing preparation method, comprising the following steps, please refer to figure 2 -4 shows:

[0042] 100. Material selection: select micron-scale tungsten powder that accounts for 10% to 60% of the total volume of the backing and polyester powder that accounts for 40% to 90% of the total volume of the backing; the micron-scale refers to 2 microns to 7 microns . The polyester is preferably one of polyurethane powder, soft polyvinyl chloride and polyamide or a mixture thereof in any proportion. The glass transition temperature of the polyester material is greater than 65°C, preferably 70-150°C.

[0043] 101. Mixing of materials: put the powder selected above into the mixing machine and mix it evenly;

[0044] In addition, in order to avoid that the particle size of the formed granule polymer is too large to meet the requirements of preparation due to the cohesion between the powder particles, the materials can also be screened after mixing. Mixe...

Embodiment 1

[0052] Embodiment 1 A high attenuation backing preparation method, comprising the following steps, please refer to figure 2 -4 shows:

[0053] 100. Material selection: choose 20% tungsten powder in the total volume of the micron-level backing and 80% polyester powder in the total volume of the backing;

[0054] 101. Mixing of materials: put the powder selected above into the mixing machine and mix it evenly;

[0055] 102. Degassing of materials: place the uniformly mixed powder in the container (4), and use a vacuuming instrument to extract the air to remove the air in it;

[0056] 103. Hot pressing of materials: the hot pressing part (5) is connected to the container (4), the hot pressing part (5) is matched with the shape of the inner wall of the container (4), and the mixed powder that has been sieved and screened is uniformly put into the container (4), the hot-pressed part (5) is heated to 70°C, the interior of the container (4) is pressurized to 5MPa, and the hot-pres...

Embodiment 2

[0058] Embodiment 2 A high attenuation backing preparation method, comprising the following steps, please refer to figure 2 -4 shows:

[0059] 100. Material selection: choose 30% tungsten powder in the total volume of the micron-level backing and 70% polyester powder in the total volume of the backing;

[0060] 101. Mixing of materials: put the powder selected above into the mixing machine and mix it evenly;

[0061] 102. Degassing of materials: place the uniformly mixed powder in the container (4), and use a vacuuming instrument to extract the air to remove the air in it;

[0062] 103. Hot pressing of materials: the hot pressing part (5) is connected to the container (4), the hot pressing part (5) is matched with the shape of the inner wall of the container (4), and the mixed powder that has been sieved and screened is uniformly put into the container (4), the hot pressing part (5) is heated to 150°C, the interior of the container (4) is pressurized to 15MPa, and the hot p...

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Abstract

The invention provides a preparation method of a high-attenuation backing material and the high-attenuation backing material obtained through the preparation method. The method comprises the following steps: (100) selecting materials; (101) mixing the materials; (102) degassing the materials; and (103) carrying out hot press molding on the materials. The backing material has high voice attenuation performance and high coefficient of heat conduction. By utilizing the backing material, imaging resolution ratio is improved, heat generated in the use process of an ultrasonic probe can be conducted quickly, and the service life of the ultrasonic probe can be correspondingly prolonged.

Description

technical field [0001] The invention relates to the technical field of ultrasonic transducers, in particular to a preparation method of a high attenuation backing material. Background technique [0002] The ultrasonic transducer is mainly composed of three parts: piezoelectric vibrator 3, matching layer 1 in front of the vibrator, and backing layer 2 behind the vibrator, such as figure 1 shown. It can be seen from the figure that the backing layer is an important part of ultrasonic transducers (especially medical ultrasonic transducers). Our ideal requirement for the backing layer is that it has infinite sound attenuation (the sound wave propagates in the medium). The phenomenon that its intensity gradually weakens with the increase of the propagation distance) coefficient, so that all the backward propagating ultrasonic waves generated by the piezoelectric vibrator due to vibration can be absorbed in it, and will not be reflected back to affect the imaging. It can play th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/02B29C43/32
CPCB29C43/02B29C43/32B29C2043/3205
Inventor 刘建华周丹王文娟欧阳波
Owner EDAN INSTR
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