Photo-cured heat-conductive film and production method thereof

A production method and light-curing technology, applied in the field of light-curing thermal conductive film and its production, can solve the problems of complex processing technology of thermal conductive film, poor use effect, poor molding effect, etc., so as to improve operating efficiency, high production efficiency, and reduce equipment. cost effect

Inactive Publication Date: 2015-04-29
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a light-cured thermally conductive film and its production method, which can solve the defects of complex processing technology, poor molding effect and poor use effect existing in the existing thermally conductive film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A light-curing heat-conducting film is composed of the following components in weight percentage: 10% of modified acrylic oligomer, 10% of acrylic monomer, 3% of photoinitiator, 2% of auxiliary agent, and 75% of heat-conducting filler.

[0021] The modified acrylic oligomer consists of the following components: 15.9 parts by weight of epoxy acrylate oligomer, 10.5 parts by weight of polyester acrylate oligomer, 14.3 parts by weight of polyether acrylate oligomer, 15.8 parts by weight Parts of silicone acrylate oligomer, 17.6 parts by weight of aliphatic urethane acrylate oligomer, 14.2 parts by weight of aromatic urethane acrylate oligomer, 11.7 parts by weight of amine-modified polyester acrylate oligomer things.

[0022] The acrylic monomer consists of the following components: 24.5 parts by weight of monofunctional monomer, 23.7 parts by weight of bifunctional monomer, 25.2 parts by weight of trifunctional monomer, and 26.6 parts by weight of multifunctional monomer....

Embodiment 2

[0031] A photocurable thermal conductive film is composed of the following components in weight percentage: 9.26% of modified acrylic oligomer, 9.37% of acrylic monomer, 2.11% of photoinitiator, 0.3% of auxiliary agent, and 78.96% of thermally conductive filler.

[0032] The modified acrylic oligomer consists of the following components: 30.1 parts by weight of epoxy acrylate oligomer, 25.7 parts by weight of polyester acrylate oligomer, 21.4 parts by weight of silicone acrylate oligomer, 22.8 parts by weight parts of amine modified polyester acrylate oligomer.

[0033] The acrylic monomer consists of the following components: 36.76 parts by weight of a monofunctional monomer, 30.43 parts by weight of a bifunctional monomer, and 32.81 parts by weight of a trifunctional monomer.

[0034] Photoinitiator is made up of following components: the 2-hydroxy-2-methyl-1-phenylacetone of 21.73 parts by weight, the 1-hydroxycyclohexyl phenyl ketone of 17.42 parts by weight, the 2-isoprop...

Embodiment 3

[0042] A photocurable thermal conductive film is composed of the following components in weight percentage: 15.73% of modified acrylic oligomer, 18.57% of acrylic monomer, 5.64% of photoinitiator, 4.31% of auxiliary agent, and 55.75% of thermally conductive filler.

[0043] The modified acrylic oligomer is composed of the following components: 30.56 parts by weight of aliphatic urethane acrylate oligomer, 36.42 parts by weight of aromatic urethane acrylate oligomer, 33.02 parts by weight of amine-modified polyester acrylate Oligomer.

[0044] The acrylic monomer consists of the following components: 45.21 parts by weight of monofunctional monomers, and 54.79 parts by weight of multifunctional monomers.

[0045] Photoinitiator is made up of following components: the 2-benzyl-2-dimethylamino-1-(4-morpholine phenyl) butanone of 31.7 parts by weight, the 2-trimethylbenzoyl of 33.2 parts by weight - Diphenylphosphine oxide, 35.1 parts by weight of 6-trimethylbenzoyl-diphenylphosph...

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PUM

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Abstract

The invention relates to a photo-cured heat-conductive film. The photo-cured heat-conductive film is composed of the following components in percentage by weight: 9.26-20.44% of modified acrylate oligomer, 9.37-32.58% of acrylic monomer, 2.11-5. 82% of a photoinitiator, 0.3-5% of auxiliaries and 55.75-78.96% of a heat-conductive filler, and prepared by a production method comprising the steps of mixing raw materials, moulding by casting, and curing. The photo-cured heat-conductive film disclosed by the invention has the following advantages: the heat-conductive film is prepared by mixing modified acrylate oligomer, the acrylic monomer, the photoinitiator, the auxiliaries and the heat-conductive filler, thus improving the existing production process of films, improving the running efficiency of equipment, reducing the volatilization phenomena of organic solvents in the existing metal material thermal control and solvent moulding process, improving the use effect, simplifying the existing processing process, reducing heating steps, avoiding ingredient volatilization, and achieving a good use effect.

Description

technical field [0001] The invention relates to a light-cured heat-conducting film and a production method thereof. Background technique [0002] In the field of manufacturing high-power-density electronic industrial devices, thermally conductive film is an important part. The existing thermally conductive film is formed by heat-conducting molding process using traditional metal material thermal controls and solvents. Heating is required during the process and the organic solvent is volatile, and the use effect is poor, which is not conducive to molding. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a light-cured thermally conductive film and its production method, which can solve the defects of complex processing technology, poor molding effect and poor use effect existing in the existing thermally conductive film. [0004] In order to solve the above-mentioned technical problems, the present invention is ach...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F291/06C08K3/22C08K3/38C08K3/28C08K3/34C08K3/08C08K3/04C08L51/08C08L51/00
Inventor 范勇
Owner PINGHU ALLIED IND
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