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Low-temperature hot melt adhesive

A technology of low-temperature heat and melting adhesives, which is applied in the direction of adhesives, adhesive types, and mineral oil hydrocarbon copolymer adhesives. big effect

Active Publication Date: 2015-04-29
竹林伟业科技发展(天津)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the label paper made of hot melt adhesive can only be labeled when it is above 10 degrees Celsius. When the temperature is low, the hot melt adhesive often has discoloration, viscosity drop or even brittleness.

Method used

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  • Low-temperature hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The mass ratio components of the low temperature hot melt adhesive are as follows:

[0024] Styrene-isoprene-styrene block copolymer (SIS) 10g,

[0025] C5 petroleum resin 12g,

[0026] Powdered nitrile rubber (acrylonitrile content; 32-35%) 9g,

[0027] GA-90 rosin resin 20g,

[0028] KN4010 naphthenic oil 20g,

[0029] Honeywell Polyethylene Wax AC8 10g,

[0030] Antioxidant B225 0.8g.

[0031] According to a low-temperature hot melt of the above formula, the preparation method is as follows:

[0032] 1) Styrene-isoprene-styrene block copolymer (SIS) with fixed components and KN4010 naphthenic oil were oil-extended at 90°C for 20 minutes.

[0033] 2) Add antioxidant B225 and stir at high speed at 180°C.

[0034] 3) Add petroleum resin, powdered nitrile rubber, rosin resin, Honeywell polyethylene wax AC8 in sequence and keep stirring and kneading.

[0035] 4) Extrude the hot melt adhesive that has been stirred and kneaded evenly through the extruder. The follo...

Embodiment 2

[0037] Low-temperature hot-melt adhesive, including the mass ratio of the following ingredients mixed uniformly:

[0038] Styrene-isoprene-styrene block copolymer (SIS) 40g,

[0039] C5 petroleum resin 28g,

[0040] KN4010 naphthenic oil 25g,

[0041] Honeywell Polyethylene Wax AC8 21g,

[0042] GA-90 Rosin Resin 18g,

[0043] Powdered nitrile rubber 16g,

[0044] Antioxidant B225 0.5g.

Embodiment 3

[0046] Low-temperature hot-melt adhesive, including the following mass ratios mixed uniformly:

[0047] Styrene-isoprene-styrene block copolymer (SIS) 26g,

[0048] C5 petroleum resin 15g,

[0049] Antioxidant B225 5g,

[0050] Honeywell Polyethylene Wax AC8 40g,

[0051] GA-90 Rosin Resin 16g,

[0052] Powdered nitrile rubber 16g.

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Abstract

The invention discloses a low-temperature hot melt adhesive which is prepared from the following raw materials in percentage by mass: 10-40% of styrene-isoprene-styrene block copolymer (SIS), 10-30% of a tackifier, 5-18% of nitrile-butadiene rubber, 10-40% of polyethylene wax, 0.6-0.1% of an antioxidant, 10-30% of naphthenic oil and 20-30% of resin, wherein the tackifier is rosin resin or petroleum resin; the nitrile-butadiene rubber is powder nitrile-butadiene rubber with acrylonitrile content of 32-35%; the naphthenic oil is KN4010 naphthenic oil; the antioxidant is one or more of an antioxidant B225, an antioxidant 1010, an antioxidant 168, and an antioxidant DLTP, and has outstanding processing stability and long-term protective effect on polyolefin; the polyethylene wax is of an AC8 level, and shows very strong external lubricating property due to an irregular structure and low-viscosity homopolymer. The hot melt adhesive disclosed by the invention has viscosity of less than or equal to 1.5Pa.s at 150 DEG C, and the viscosity fluctuates little under a temperature changing condition, is relatively stable, and is more excellent at -10 DEG C.

Description

technical field [0001] The invention belongs to the field of hot-melt adhesives, in particular to pressure-sensitive adhesives used in low-temperature environments. Background technique [0002] Generally, the hot melt adhesive coated into self-adhesive paper has requirements for acid resistance, alkali resistance, temperature resistance, water resistance, chemical resistance, and aging resistance. Usually, the label paper made of hot melt adhesive can only be labeled when it is above 10 degrees Celsius. When the temperature is low, the hot melt adhesive often has discoloration, viscosity drop or even brittle cracking. Contents of the invention [0003] The invention aims to overcome the defects of the prior art and provide a low-temperature hot-melt adhesive which still has strong adhesive force at minus 10 degrees. [0004] A kind of low temperature hot melt adhesive, the mass composition of raw material is: [0005] Styrene-isoprene-styrene block copolymer (SIS) 10%~4...

Claims

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Application Information

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IPC IPC(8): C09J153/02C09J109/02C09J123/06C09J191/00C09J157/02C09J193/04
Inventor 竺汉明刘勇
Owner 竹林伟业科技发展(天津)股份有限公司
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